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Riverwood Solutions Continues Expansion in the MEMS and Sensor Ecosystem:

September 26, 2016

Following continued growth, Riverwood Solutions is taking steps to broaden its presence in the emerging technology ecosystems. As one of several broader initiatives Riverwood Solutions has joined the MEMS & Sensors Industry Group where it will continue providing services that focus on taking critical aspects of emerging technology and helping companies create and manufacture leading edge hardware products.

“We are excited about the addition of Riverwood Solutions to our ecosystem” commented Karen Lightman, executive director of MEMS & Sensors Industry Group. “As our global … Read More → "Riverwood Solutions Continues Expansion in the MEMS and Sensor Ecosystem:"

Renesas Electronics Delivers Contactless Wireless Charging Solution for Healthcare and Wearable Devices

September 26, 2016

Düsseldorf, September 26, 2016 – Renesas Electronics, a premier supplier of advanced semiconductor solutions, today announced a contactless wireless charging solution for low-power applications, such as hearing aids and other wearable devices that require resistance to water and dust.

The new wireless charging … Read More → "Renesas Electronics Delivers Contactless Wireless Charging Solution for Healthcare and Wearable Devices"

Sophisticated Power Management IC Pushes Performance Envelope & Enables More Effective Energy Harvesting

September 26, 2016

26th September 2016, Liege, Belgium: Following its arrival on the power semiconductor scene earlier this year, e-peas today announces commercial availability of its first IC. The AEM10940 utilizes the company’s unique proprietary energy management technology in order to maximize the efficiency with which electronic hardware draws energy from the ambient environment. This device, which is now in full scale production, is set tohave major implications for the various power-frugal sensing applications currently emerging – including those covering all aspects of the Internet of Things (IoT), wearable technology, home automation, industrial monitoring and wireless geolocation, etc.

The … Read More → "Sophisticated Power Management IC Pushes Performance Envelope & Enables More Effective Energy Harvesting"

Mentor Graphics SystemVision Improves Siemens Building Technologies’ PCB Design Flow Worldwide

September 26, 2016

WILSONVILLE, Ore., September 26, 2016 – Mentor Graphics Corporation (NASDAQ: MENT) today announced that Siemens Building Technologies has deployed Mentor’s SystemVision® product to Siemens printed circuit board (PCB) design teams around the world, providing an upfront, mechatronic simulation environment and a qualified, central library for the Mentor Graphics® Xpedition® Enterprise PCB design flow. Early simulation using the SystemVision tool allows designers to make design decisions regarding component tradeoffs, find design mistakes, and verify their designs before PCB layout. The central library allows teams to exchange projects around the world, which eliminates … Read More → "Mentor Graphics SystemVision Improves Siemens Building Technologies’ PCB Design Flow Worldwide"

TSMC and Synopsys Collaboration Delivers Innovative Technologies for the High Performance Compute (HPC) Platform

September 23, 2016

MOUNTAIN VIEW, Calif., Sept. 22, 2016 /PRNewswire/ —

Highlights:

  • Innovations include multiple new implementation technologies including via pillar and clock tree optimizations in IC Compiler II
  • Both companies initiate Design Compiler Graphical synthesis collaboration for high performance compute designs
  • Synopsys will deliver a specially created flow to enable designers to maximize performance from the TSMC HPC Platform
  • Collaboration will produce industry-first ASIC-based flow and methodology with several new technologies to enable high-performance, compute-intensive designs

Synopsys, Inc. (Nasdaq: SNPS) today announced its collaboration with TSMC to deliver … Read More → "TSMC and Synopsys Collaboration Delivers Innovative Technologies for the High Performance Compute (HPC) Platform"

Pasternack Introduces New Lines of RF and Microwave Waveguide Directional Couplers

September 23, 2016

Irvine, CA – Pasternack, a leading manufacturer and supplier of RF, microwave and millimeter wave products, introduces a brand new family ofwaveguide directional couplers displaying highly accurate performance up to 33 GHz. These waveguide couplers are commonly used for signal sampling and other general purpose applications in wireless transmit/receive systems, satellite communications, … Read More → "Pasternack Introduces New Lines of RF and Microwave Waveguide Directional Couplers"

Cadence and TSMC Advance 7nm FinFET Designs for Mobile and HPC Platforms

September 23, 2016

SAN JOSE, Calif., 22 Sep 2016

Highlights:

  • Cadence digital, signoff and custom/analog tools certified and PDK-enabled for latest 7nm DRM and SPICE
  • TSMC and Cadence address custom and mixed-signal design requirements at advanced-process nodes through delivery of 7nm Custom Design Reference Flow
  • Cadence 7nm library characterization tool flow enables accurate process variation signoff for ultra-low-voltage applications
  • Cadence 7nm high-speed SerDes and low-latency DDR IP delivered in active customer engagements

Cadence Design Systems, Inc. (NASDAQ: … Read More → "Cadence and TSMC Advance 7nm FinFET Designs for Mobile and HPC Platforms"

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