News – Page 1293 – EEJournal

Ultra-Compact Open Frame AC-DC Power Supplies are Ideal for Space-Constrained Applications

November 17, 2016

TUALATIN, Ore. — November 17, 2016 — CUI Inc today announced a family of ultra?compact ac-dc power supplies in an open frame SIP package. The 3 W and 5 W configurations of the PBO series measure as small as 35 x 11 x 18 mm (1.38 x 0.43 x 0.71 in), allowing them to occupy less board real-estate than other power solutions. The 3 W models are also available in low-profile, right-angle versions measuring as small 35 x 18 x 11 mm (1.38 x 0.43 x 0.71 in), making them ideal for applications where vertical board space is at a premium.

Samtec FireFly™ PCIe® Optical Flyover Cable Assembly Fully Supports PCIe 4.0

November 16, 2016

New Albany, IN: The technical collaboration between Samtec, a privately held $625MM global manufacturer of a broad line of electronic interconnect solutions, and PLDA, the industry leader in PCI Express® interface IP solutions, provides a groundbreaking solution for PCIe 4.0 endpoint development by combining PLDA’s PCIe 4.0 hardware and IP with the Samtec’s PCUO PCIe® Optical Flyover Cable Assembly.

The PLDA PCIe 4.0 Platform Development Kit (PDK) is a complete development platform based on PLDA’s PCIe compliant XpressSWITCH IP and PLDA’s XpressRICH4™ controller IP for PCIe Gen4 technology running on a Xilinx® Virtex® UltraScale™ FPGA. This … Read More → "Samtec FireFly™ PCIe® Optical Flyover Cable Assembly Fully Supports PCIe 4.0"

30A, Scalable to 180A, µModule Regulator in 9mm x 15mm BGA Package

November 16, 2016

MILPITAS, CA – November 16, 2016 – Linear Technology introduces the LTM4647, a 30A step-down µModule (power module) regulator. The LTM4647 includes the inductor, MOSFET, DC/DC controller and supporting components in a 9mm x 15mm x 5.01mm BGA package. The device’s conversion efficiency from 12VIN to 1VOUT at 30A is 87%, when delivering a full 30A continuously without a heat sink or air flow at 70°C ambient. The LTM4647 can deliver up to 180A by current sharing six devices in parallel.

Total output voltage DC accuracy is guaranteed at ±1.2% over reference, feedback resistor, line, load and temperature (–40°C to 125°C), … Read More → "30A, Scalable to 180A, µModule Regulator in 9mm x 15mm BGA Package"

New BeagleBone Black Wireless, Now Available for Pre-Order from Mouser, Tailored for Customizable IoT Designs

November 16, 2016

November 15, 2016 – Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, … Read More → "New BeagleBone Black Wireless, Now Available for Pre-Order from Mouser, Tailored for Customizable IoT Designs"

Mentor Graphics Signs Agreement with ARM to Accelerate Early Hardware/Software Development

November 16, 2016

WILSONVILLE, Ore., November 16, 2016 – Mentor Graphics^® Corporation (NASDAQ: MENT) has signed a multiyear license agreement with ARM to gain early access to a broad range of ARM^®Read More → "Mentor Graphics Signs Agreement with ARM to Accelerate Early Hardware/Software Development"

SLX: The next generation of multicore software development tools from Silexica is here today

November 16, 2016

Saratoga, Calif. – November 16, 2016 – Silexica, the industry leader in multicore software design automation addressing complex, multicore platforms today announced that the next generation of the company’s SLX Tool Suite is shipping now. The SLX Tool Suite has been broadly adopted to automate the distribution of code onto large, multicore platforms. Based upon customer feedback, enhancements were made to this new version, which includes the SLX Parallelizer, SLX Mapper, SLX Generator, and SLX Explorer, resulting in tremendous productivity advancements. The updated tool suite broadens the type and kinds of models, supports additional languages, as well … Read More → "SLX: The next generation of multicore software development tools from Silexica is here today"

Renesas Electronics Spurs Innovation in Ethernet TSN Technology to Drive Autonomous Driving and Industry 4.0 Network Evolution

November 16, 2016

Düsseldorf, November 16, 2016 – Renesas Electronics, a premier provider of advanced semiconductor solutions, today announced its latest innovative developments in Ethernet time-sensitive networking (TSN). Renesas has become the world’s first to demonstrate standard compliance and interoperability for frame preemption, the most essential feature … Read More → "Renesas Electronics Spurs Innovation in Ethernet TSN Technology to Drive Autonomous Driving and Industry 4.0 Network Evolution"

Coventor to Collaborate with MIT for Photonics Process Modeling

November 16, 2016

Cary, North Carolina – November 15, 2016 – Coventor, a leading supplier of semiconductor process development tools, today announced that it will collaborate with the Massachusetts Institute of Technology (“MIT”) on silicon photonics process modeling. MIT is a key player in the AIM Photonics program, a federally funded, public-private partnership established to advance domestic capabilities in integrated photonic technology and strengthen high-tech U.S.-based manufacturing. Coventor will provide its SEMulator3D® process modeling platform to model the effect of process variation in … Read More → "Coventor to Collaborate with MIT for Photonics Process Modeling"

Brite Semiconductor Announces DDR4 IP Achieve 2400 Mbps on SMIC 40nm Process

November 16, 2016

Shanghai, China—November 15, 2016—Brite Semiconductor (“Brite”) announced today, the YouPHY-DDR DDR4, DDR3/LPDDR3 subsystem had been silicon proven on SMIC 40nm low leakage process. According to the silicon data, the data rate of YouPHY-DDR reached to 2400Mbps in DDR4 protocol and 2133Mbps in DDR3/LPDDR3 with low power and small area successfully.

YouPHY-DDR is a complete DDR subsystem provided by Brite, including not only controller, PHY and IO, but also corresponding tuning and configuration software. And this solution can support DDR3, LPDDR3, DDR4 and LPDDR4 combo PHY with the data rate from 2133Mbps … Read More →

myDevices Announces Dedicated LoRa™ IoT Project Builder

November 15, 2016

Los Angeles, CA – November 15, 2016 — myDevices, the Internet of Things (IoT) solutions company that “simplifies the connected world” and creator of Cayenne, today announced its official launch of Cayenne for LoRa™— the IoT Project Builder developed exclusively for the LoRa ecosystem. Developers and organizations interested in building a LoRa solution can use Cayenne for free. At the same time, any LoRa device manufacturer can bundle Cayenne with their hardware and make it freely available to their customers.

myDevices is a Contributing Member of the LoRa Alliance, one of the fastest growing non-profit associations in the technology sector with … Read More → "myDevices Announces Dedicated LoRa™ IoT Project Builder"