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Semtech Announces Availability of Wireless Power Evaluation Kits for Wearable Applications

CAMARILLO, Calif., Oct. 13, 2016 – Semtech Corporation (Nasdaq:SMTC), a leading supplier of analog and mixed-signal semiconductors, today announced it is shipping two new, compatible evaluation modules (EVMs) for prototyping and developing wireless charging solutions for wearable applications.

The Semtech TSWITX-G4-EVM is an evaluation platform for the test and experimentation of a wireless charging … Read More → "Semtech Announces Availability of Wireless Power Evaluation Kits for Wearable Applications"

Pasternack Releases Analog Phase Shifter Modules Supporting Frequency Bands Ranging from 5 GHz to 18 GHz

Irvine, CA – Pasternack, a leading manufacturer and supplier of RF, microwave and millimeter wave products, has introduced a new series ofanalog phase shifters that are used to control the phase characteristics in the processing of microwave signals and can also be used as phase modulators to control a modulating baseband signal. 

Read More → "Pasternack Releases Analog Phase Shifter Modules Supporting Frequency Bands Ranging from 5 GHz to 18 GHz"

Mentor Graphics Partnership with RTI Enables Secure Embedded Solution for Industrial Internet of Things (IIoT)

  • Mentor Graphics and RTI partnership enables the creation of heterogeneous distributed systems that leverage the Data Distribution Service (DDS) standard to communicate reliably and securely.

  • By establishing a software chain of trust that begins with hardware power-on, the system, inclusive of the RTI Connext® DDS middleware, can be authenticated, validated, and trusted.

  • Pre-integration of Connext DDS with Mentor® Embedded runtime platforms reduces risk, cost, and time to market. 

WILSONVILLE, Ore., Read More → "Mentor Graphics Partnership with RTI Enables Secure Embedded Solution for Industrial Internet of Things (IIoT)"

Antenova announces Inca – an “easy integration” antenna with high gain for small devices in the 433MHz band

Hatfield, UK – 13th October 2016 – Antenova Ltd, manufacturer of antennas and RF antenna modules for M2M and the Internet of Things, has added a brand new antenna, Inca (part no SRFI028), to its flexiiANT FPC range. This antenna is for small devices in the 433MHz ISM band.

The antenna measures 101.0mm x 20.0mm x 0.15mm, and weighs just 0.5g, with a peak gain of 2.80dBi. It is suitable for any small electronic device in the 433MHz band, typically remote monitoring, robot control, smart meters, home automation and medical devices.

It can also be … Read More → "Antenova announces Inca – an “easy integration” antenna with high gain for small devices in the 433MHz band"

CEVA Introduces Lightweight Multi-Purpose Processor for the Massive Internet of Things

  • EVA-X1 offers a unified platform for LTE Cat-M1, Cat-NB1, 5G and other cellular IoT standards
  • Serves as processing hub for multi-purpose, multi-mode IoT applications, also capable of handling voice, connectivity, positioning and sensor fusion workloads
  • Combines DSP and control in a single instruction set architecture, eliminating the need for a separate CPU core for upper layer stacks and system control

MOUNTAIN VIEW, Calif., – October 10, 2016 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing IP for smarter, connected devices, today introduced a new lightweight, multi-purpose, processor IP core to streamline the … Read More → "CEVA Introduces Lightweight Multi-Purpose Processor for the Massive Internet of Things"

STMicroelectronics and WiTricity to Develop Integrated Circuits (ICs) for Resonant Wireless Power Transfer

  • Chips to accelerate the adoption of wireless charging, with ability to efficiently charge metal-body consumer electronics
  • Opportunities include consumer electronics, Internet of Things, mobile computing, automotive, medical, and industrial applications 

Geneva, Switzerland and Watertown, MA – October 4, 2016 – Read More → "STMicroelectronics and WiTricity to Develop Integrated Circuits (ICs) for Resonant Wireless Power Transfer"

congatec presents first COM Express Type 7 modules with Intel® Xeon® D processors

San Diego, CA. October 12, 2016  * * *  congatec – a leading technology company for embedded computer modules, Single Board Computers (SBCs) and embedded design and manufacturing (EDM) services and editor of the upcoming COM Express 3.0 standard that includes the new COM Express Type 7 Pinout– is introducing new Server-on-Modules with Intel® Xeon® D processors (codename Broadwell) parallel to the preview release of the COM Express Type 7 specification. Based on the world-leading COM Express Basic standard form factor (95 x 125 mm), the modules feature 10 Gigabit Ethernet interfaces, 32 PCIe lanes and headless server performance currently with up to 16 server cores and 48 gigabytes of DDR4 ECC RAM. Examples … Read More → "congatec presents first COM Express Type 7 modules with Intel® Xeon® D processors"

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