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Chiplets Technology: How Modular Integration is Transforming Computing Performance

The semiconductor industry is experiencing a paradigm shift with the rise of chiplet technology. Traditional monolithic chip designs are reaching physical and economic limitations, prompting engineers to adopt a modular approach. Chiplets technology enables the integration of multiple smaller chips into a single package, dramatically improving computing performance, efficiency, and scalability. This approach is revolutionizing industries ranging from high-performance computing (HPC) and artificial intelligence (AI) to gaming and consumer electronics.

The Read More → "Chiplets Technology: How Modular Integration is Transforming Computing Performance"

Alphawave Semi to Showcase Innovations and Lead Expert Panels on 224G, 128G PCIe 7.0, 32G UCIe, HBM 4, and Advanced Packaging Techniques at DesignCon 2025

Researchers from Incheon National University Propose Novel Approaches for Improved Microgrid Management

Scientists at Incheon National University have developed a new optimization model to improve microgrid operation. This model adapts to unexpected changes in power supply and demand, ensuring stable and efficient energy systems. By addressing challenges like power outages and varying energy needs, this approach enhances the reliability and sustainability of microgrids, making it suitable for real-world use in areas with unstable power grids.
 
Microgrids are localized energy systems that provide stable power supply, especially in remote or disaster-prone areas. … Read More → "Researchers from Incheon National University Propose Novel Approaches for Improved Microgrid Management"

Infineon introduces new EiceDRIVER™ isolated gate driver ICs for traction inverters in electric vehicles

Munich, Germany – 28 January 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces new isolated gate driver ICs for electric vehicles to enhance its EiceDRIVER™ family. The devices are designed for the latest IGBT and SiC technologies.  Furthermore, they support Infineon’s new HybridPACK™ Drive G2 Fusion module, the first plug’n’play power module that implements a combination of Infineon’s silicon and silicon carbide (SiC) technologies. The pre-configured third-generation EiceDRIVER products, 1EDI302xAS (IGBT) and 1EDI303xAS (SiC/ Fusion), are AEC-qualified and ISO 26262-compliant, ideal for traction inverters in cost-effective and high-performant … Read More → "Infineon introduces new EiceDRIVER™ isolated gate driver ICs for traction inverters in electric vehicles"

EdgeCortix SAKURA-I AI Accelerator Demonstrates Robust Radiation Resilience, Suitable for Many Orbital and Lunar Expeditions.

Tokyo, Japan (Jan. 28, 2025) — EdgeCortix® Inc., a leading fabless semiconductor company specializing in energy-efficient Artificial Intelligence (AI) processing at the edge, today announced that its SAKURA-I AI Accelerator is suitable for space missions including in Earth orbit and … Read More → "EdgeCortix SAKURA-I AI Accelerator Demonstrates Robust Radiation Resilience, Suitable for Many Orbital and Lunar Expeditions."

New chip to solve quantum computing roadblocks

  • EU Commission invests €3 million to develop first-ever quantum chip that combines electronics and light using advanced Germanium-Silicon technology.
  • The goal is to make quantum computers faster, more efficient, and scalable, enabling them to tackle challenges like drug discovery, cybersecurity, and AI.
  • Consortium unites leading institutions from across Europe to drive technological independence and quantum innovation.

The European Commission is investing in a groundbreaking quantum chip that combines light and electronics for the first time, promising faster, more efficient quantum … Read More → "New chip to solve quantum computing roadblocks"

TDK presents HVC43MC with an integrated mirror contact and HVC45 for short-circuit currents up to 12 kA

January 28, 2025

TDK Corporation (TSE:6762) announces two new additions to its high-voltage contactor portfolio for harsh environments: the HVC43MC with integrated mirror contact and the HVC45 with enhanced short-circuit current handling capability. These new contactors for up to 1000 V (DC) enable reliable switching of lithium-ion batteries in traction applications, energy storage systems (ESS), and DC charging stations. These components underscore TDK’s dedication to enabling the transition to a greener, more electrified future.

With an integrated mirror contact according to IEC 60947-4-1, the HVC43MC enables safe detection of the main contact’s position. … Read More → "TDK presents HVC43MC with an integrated mirror contact and HVC45 for short-circuit currents up to 12 kA"

RTOSX Announces RTOSX KERNEL Functional Safety Certification to Give Developers an Industrial-Grade, Certifiable Alternative to Eclipse ThreadX

San Diego, CA, January 28, 2025 — RTOSX, a global leader in high-performance real-time operating systems and middleware, today … Read More → "RTOSX Announces RTOSX KERNEL Functional Safety Certification to Give Developers an Industrial-Grade, Certifiable Alternative to Eclipse ThreadX"
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