News – Page 1286 – EEJournal

New EEMBC Benchmark Opens the Door on IoT Gateway Performance

December 13, 2016

EL DORADO HILLS, Calif. — November 29, 2016 —EEMBC®, the Embedded Microprocessor Benchmark Consortium setting the industry standard for valuable application-specific benchmarks, announced its effort on a benchmark to measure how gateways perform in specific Internet of Things vertical markets. In general, an IoT gateway lives at or near the ‘edge’. The gateway is used to gather and manage data from multiple sources (sensors, IoT devices), process data locally (instead of on the cloud), react to and predict events, and send data to the cloud. IoT gateways are available in many form factors to support a wide range of vertical … Read More → "New EEMBC Benchmark Opens the Door on IoT Gateway Performance"

Smart Home Reference Designs from Silicon Labs Accelerate Development of IoT Connected Devices

December 13, 2016

AUSTIN, Texas–(BUSINESS WIRE)–Silicon Labs (NASDAQ: SLAB) has launched two new wireless occupancy sensor and smart outlet reference designs for the home automation market, providing IoT connected device solutions that help make our homes safer, more convenient and energy efficient. The FCC and … Read More → "Smart Home Reference Designs from Silicon Labs Accelerate Development of IoT Connected Devices"

Flex Logix High-Performance Embedded FPGA IP Core Now Available for TSMC 16FF+ and 16FFC

December 13, 2016

MOUNTAIN VIEW, Calif., December 13, 2016 – Flex Logix Technologies, Inc., the leading developer of embedded FPGA IP cores and software, today announced it has completed design of a high-performance IP core for TSMC 16FF+ and 16FFC, with performance for wide, single-stage logic around ~1GHz at worst case PVT conditions. Expected to be fully validated in silicon in early 2017, the EFLX-100 embedded FPGA IP core for TSMC 16FF+ and 16FFC will enable customers to design their next-generation networking, base station and data center chips … Read More → "Flex Logix High-Performance Embedded FPGA IP Core Now Available for TSMC 16FF+ and 16FFC"

New EEMBC Benchmark Targets Internet of Things Security Functions

December 13, 2016

EL DORADO HILLS, Calif. — November 29, 2016 —EEMBC®, the Embedded Microprocessor Benchmark Consortium setting the industry standard for valuable application-specific benchmarks, today announced its efforts on a benchmark to ensure optimum efficiency of security implementations in Internet of Things (IoT) devices. This new benchmark, currently in development within EEMBC’s IoT Security working group, aims to provide an industry-created and standardized tool for application developers to quickly, accurately, and equitably compare the performance and energy efficiency of security solutions targeted at IoT end-point applications – those “Things.”

New Low-Power PIC24 “GA7” Microcontroller Family Now Available

December 13, 2016

CHANDLER, Ariz., Dec. 12, 2016 — The new PIC24 “GA7” family of microcontrollers (MCU) is now available from Microchip Technology Inc. (NASDAQ: MCHP), a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions. As the lowest-cost 256 KB Flash memory 16-bit MCUs available today, these PIC24 devices enable extremely cost-effective designs for Internet of Things (IoT) sensor nodes, portable medical devices and industrial control applications. For more information about Microchip’s PIC24 “GA7” family visit: http://www.microchip.com/ … Read More → "New Low-Power PIC24 “GA7” Microcontroller Family Now Available"

DFI Tech Announces New Line of Pico-ITX Boards

December 13, 2016

Sacramento, CA — Dec 13, 2016 – DFI Tech, a provider of SWaP-optimized embedded computing solutions and board products, now offers a new product line of Pico-ITX boards featuring Atom-based SoC and ARM-based processor options.

The first in the Pico-ITX series is a 6^th Generation Intel® Atom™ SoC processor with up to 8GB of DDR3L memory. The BW051 board features a SATA 3.0 interface and Mini PCIe and mSATA expansion. The available I/O on the single board computer includes 2 x COM, 1 x GbE, 2 x USB 3.0, 2 x USB 2.0, 1 x 8-bit DIO, and 1 x SMBus. There are also display ports … Read More → "DFI Tech Announces New Line of Pico-ITX Boards"

TE Connectivity Releases One of the Smallest and Lightest 1000 A / 1000 VDC Contactor in the Industry

December 13, 2016

HARRISBURG, Pa. – December 13, 2016 – TE Connectivity (TE) (NYSE: TEL), a world leader in connectivity and sensors, recently released its KILOVAC K1K high-voltage contactor. Designed for harsh environments, these contactors offer exceptional performance in new-technology higher voltage and current battery systems and energy storage systems. This contactor is among the smallest and lowest cost in the industry while maintaining high-voltage switching capabilities.

TE’s KILOVAC K1K contactors are constructed to support up to 1000 V/1000 A in harsh and explosive environments, and are compact and lightweight for optimal performance without oxidation or contamination of contacts, even over periods … Read More → "TE Connectivity Releases One of the Smallest and Lightest 1000 A / 1000 VDC Contactor in the Industry"

STMicroelectronics Extends Feature Integration and Flexibility of STM32F4 Access Lines with STM32F413/423 MCUs

December 13, 2016

Geneva, December 13, 2016 – Two new microcontroller lines from STMicroelectronics increase energy efficiency, flexibility, and feature integration at the high end of the STM32F4 Access Line for high-performance embedded designs. Qualified up to 125°C^{^[1]}, these latest STM32 devices target always-on sensor acquisition and general-purpose industrial applications, and present a robust and cost-effective upgrade from STM32F1 MCUs^{^[2]}.

Tiny Nano-Power Op Amp from STMicroelectronics Boosts Sensing Accuracy, Consumes Negligible Space and Power

December 12, 2016

Geneva, December 12, 2016 – With its tiny 1.2mm x 1.3mm outline and typical current of only 900nA, theTSU111 nano-power op amp from STMicroelectronics helps cut the size and energy … Read More → "Tiny Nano-Power Op Amp from STMicroelectronics Boosts Sensing Accuracy, Consumes Negligible Space and Power"

CEL and THine introduce high performance HD video interface for industrial, machine vision, surveillance, and automotive applications

December 12, 2016

Combined with Slip Rings, this interface technology enables OEMs to produce 360 degree HD video Pan/Tilt/Zoom (PTZ) cameras at substantially reduced cost

SANTA CLARA, CA (December 12, 2016)

THine Electronics, Inc. (Tokyo Stock Exchange/JASDAQ: 6769), a semiconductor company focusing on high speed serial interfaces, today announced an AEC-Q100 (Grade 2) compliant single chip solution (THCV241-Q) that integrates the MIPI CSI-2 interface with THine’s well established V-by-One^®HS product family.

The new THCV241-Q is optimized for advanced camera requirements including: