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Mentor Graphics Joins GLOBALFOUNDRIES FDXcelerator Partner Program

December 22, 2016

WILSONVILLE, Ore., December 22, 2016—Mentor Graphics Corp. (NASDAQ: MENT) today announced that it has joined GLOBALFOUNDRIES’ FDXcelerator™ Partner Program. FDXcelerator program partners support customers of GLOBALFOUNDRIES FDX™ technologies by providing a variety of design solutions, including approved design methodology, IP development expertise, hardware/software system integration expertise, and other critical software, services, and support. They participate in FDXcelerator Partner Program events, and receive early access to the GLOBALFOUNDRIES FDX roadmap and associated technology offerings.

“Mentor Graphics is proud to have expanded our long-term relationship with GLOBALFOUNDRIES to include … Read More → "Mentor Graphics Joins GLOBALFOUNDRIES FDXcelerator Partner Program"

3U VPX Power Card Released for Military and Industrial Embedded Technology Markets

December 21, 2016

Meeting various industry and military standards, a new 3U VPX power card from Aegis Power Systems, Inc  offers the latest in embedded power supply technology.  The filtered 270Vdc unit gives engineers in the defense and industrial markets a robust power system for use in VITA 62 rack mount chassis.

The VPX2703UC power card yields up to 93% max efficiency, 650 watts total output power, and a small 5HP size. Other features includes conduction cooling, six  output voltages, short circuit … Read More → "3U VPX Power Card Released for Military and Industrial Embedded Technology Markets"

Toshiba Expands Lineup of Embedded NAND Flash Memory Products for Automotive Applications

December 21, 2016

IRVINE, Calif., Dec. 20, 2016 /PRNewswire/ — Toshiba America Electronic Components, Inc. (TAEC)* today announced the launch of JEDEC®[1] e–MMCTM Version 5.1[2]-compliant embedded NAND flash memory products supporting AEC-Q100 Grade2 [3] requirements. The new product lineup consists of densities of 8 gigabyte (GB), 16GB, 32GB and 64GB, and is well suited to the demanding … Read More → "Toshiba Expands Lineup of Embedded NAND Flash Memory Products for Automotive Applications"

XP Power offers encapsulated 80 Watt AC-DC modules in an ultra-compact footprint

December 21, 2016

XP Power today announced the ECE80 series of 80W single output AC-DC encapsulated power supply modules with high efficiency and a low no load input power. The modules are perfect for customers requiring an encapsulated AC-DC power solution in an ultra-compact format for either PCB, chassis, or DIN rail mounting.  

The ECE80 series has the smallest footprint and highest power density in the industry for an 80W encapsulated power supply module.  The range is available in three formats for increased flexibility. The standard part comes as a PCB mount version, adding –S gives you … Read More → "XP Power offers encapsulated 80 Watt AC-DC modules in an ultra-compact footprint"

CEVA Brings its Leading-Edge Solutions for Smarter, Connected Devices to CES

December 21, 2016

MOUNTAIN VIEW, Calif., – December 21, 2016 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing IP for smarter, connected devices, announced today that it will showcase a broad range of products and solutions that leverage CEVA’s industry-leading technologies at CES 2017, January 5-8, 2017 in Las Vegas.

Product demonstrations on display in CEVA’s private meeting suite include some of the most innovative technologies that are driving the Internet of Things and the consumer electronics industries, including:</ … Read More → "CEVA Brings its Leading-Edge Solutions for Smarter, Connected Devices to CES"

Samtec to Present Flyover QSFP28 Technical Paper and PCIe®-Over-FireFly™ Product Demonstration at DesignCon 2017

December 20, 2016

New Albany, IN: Samtec, a privately held $625MM global manufacturer of a broad line of electronic interconnect solutions, will participate in the DesignCon 2017 conference and exhibition at the Santa Clara Convention Center, January 31 – February 2. Samtec’s Director of Signal Integrity Jim Nadolny will be presenting a 45-minute technical paper session covering “Design of Flyover QSFP28 (FQSFP Series) for 56+ Gbps Applications.” This white paper presentation will demonstrate how Samtec achieved at least four times lower trace insertion loss with FQSFP for 56+ Gbps applications by replacing typical PCB trace based QSFP … Read More → "Samtec to Present Flyover QSFP28 Technical Paper and PCIe®-Over-FireFly™ Product Demonstration at DesignCon 2017"

STMicroelectronics and Valencell Announce Collaboration on Highly Accurate and Powerful Biometric Sensor Platform for Wearables and IoT

December 20, 2016

Raleigh, N.C., Geneva, Switzerland – December 20, 2016 – Valencell, the leading innovator in performance biometric data sensor technology, and STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced … Read More → "STMicroelectronics and Valencell Announce Collaboration on Highly Accurate and Powerful Biometric Sensor Platform for Wearables and IoT"

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