News – Page 1280 – EEJournal

Altek License CEVA Imaging and Vision DSP for Deep Learning in Mobile Devices

January 5, 2017

LAS VEGAS, Nevada, – CES 2017 – January 05, 2017 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing IP for smarter, connected devices, today announced that Altek Corporation, a leading Taiwanese imaging systems provider, has licensed CEVA’s imaging and vision DSP to add power-efficient, … Read More → "Altek License CEVA Imaging and Vision DSP for Deep Learning in Mobile Devices"

SmartMesh IP Wireless Mesh Networks Expand to Address Industrial IoT Networks with Thousands of Nodes

January 5, 2017

MILPITAS, CA – January 5, 2017 – Linear Technology’s SmartMesh IP™ wireless sensor network (WSN) product line has expanded to address the growing needs of industrial Internet of Things (IoT) applications. New capabilities include the SmartMesh® VManager™ networking software, which seamlessly increases the mesh network capacity to thousands of nodes. The new Blink mode, an ultralow power roaming node capability, reduces average current consumption of wireless sensor nodes to less than 3µA.

SmartMesh IP, based on 6LoWPAN, delivers wire-like reliability and ultralow power to wireless mesh networks, allowing secure deployment of battery-operated IoT sensors in harsh environments with more than 10 … Read More → "SmartMesh IP Wireless Mesh Networks Expand to Address Industrial IoT Networks with Thousands of Nodes"

Retune DSP Multi-Microphone Beamforming and Echo Cancellation Now Available for Cadence Tensilica HiFi Audio DSPs

January 5, 2017

SAN JOSE, Calif. and COPENHAGEN, 04 Jan 2017

Cadence Design Systems, Inc. (NASDAQ: CDNS) and Retune DSP today announced that Retune DSP’s multi-microphone beamforming and echo cancellation technology has been ported and optimized to Cadence® Tensilica® HiFi DSPs for Audio/Voice/Speech. Optimized DSPs such as the Tensilica HiFi DSP that are efficient, low power and high performance are well suited for voice-processing applications.

“We are truly excited to partner with Cadence to deliver the Voice Seeker beamforming and echo cancellation solution, as well … Read More → "Retune DSP Multi-Microphone Beamforming and Echo Cancellation Now Available for Cadence Tensilica HiFi Audio DSPs"

Senet, STMicroelectronics, and myDevices Showcase the Benefits of Low-Power Wide Area Network Technology at CES 2017

January 5, 2017

Las Vegas, NV – January 5, 2017 — LoRa Allianceä members myDevices, the Internet of Things solutions company; Read More → "Senet, STMicroelectronics, and myDevices Showcase the Benefits of Low-Power Wide Area Network Technology at CES 2017"

EMA Releases Updated Power IC Model Library for PSpice

January 5, 2017

Rochester, NY (January 4, 2017) – EMA Design Automation® (www.ema-eda.com), a full-service provider and innovator of Electronic Design Automation (EDA) solutions, and AEi Systems, a world leader in power electronics modeling, analysis and design, today announced the release of version 4.2 of AEi Systems’ Power IC Model Library for the Cadence® PSpice® simulator. “We’ve spent over 1,000 man-hours testing, simulating, and optimizing the new models in this … Read More → "EMA Releases Updated Power IC Model Library for PSpice"

Vesper and DSP Group Demo Near-Zero-Power Voice-Activation for Battery-Powered Devices at CES 2017

January 5, 2017

LAS VEGAS – (January 4, 2017) – Vesper, developer of the world’s most advanced acoustic sensors, DSP Group, Inc.(NASDAQ:DSPG), a leading global provider of wireless chipset solutions for … Read More → "Vesper and DSP Group Demo Near-Zero-Power Voice-Activation for Battery-Powered Devices at CES 2017"

Faraday Extends SoC Design Services to Include Virtual Prototyping Solution Using Synopsys Virtualizer

January 5, 2017

HSINCHU, Taiwan, Jan. 5, 2017 /PRNewswire/ — Faraday Technology Corporation and Synopsys, Inc. (Nasdaq:SNPS) today announced the expansion of Faraday’s design services to include a virtual prototyping solution. Faraday’s SoReal!™ Virtual Platform, … Read More → "Faraday Extends SoC Design Services to Include Virtual Prototyping Solution Using Synopsys Virtualizer"

First Samtec nMode™ Wireless Sensor Module Shortens IoT Application Development Time

January 5, 2017

New Albany, IN: Samtec, a privately held $625MM global manufacturer of a broad line of electronic interconnect solutions, proudly announces the release of the first Samtec nMode™ Wireless Sensor Module. The production-ready solution allows engineers to remotely sense and measure inertial, environmental and acoustical parameters.

Samtec’s 13.5mm x 13.5mm nMode™ Wireless Sensor Module contains a MEMS accelerometer, gyroscope, magnetometer, pressure sensor, and a MEMS microphone —all from STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronic applications. The small size and powerful design make the nMode™ Wireless Sensor Module as a standalone node … Read More → "First Samtec nMode™ Wireless Sensor Module Shortens IoT Application Development Time"

AT&T Introduces New Starter Kits for Developers

January 5, 2017

January 4, 2017 – In August 2016, AT&T* introduced an all-in-one IoT Starter Kit to help developers jumpstart their Internet of Things (IoT) projects. The Read More → "AT&T Introduces New Starter Kits for Developers"

Renesas Electronics and TTTech Deliver Highly Automated Driving Platform Providing Faster Track to Mass Production

January 5, 2017

Düsseldorf/Germany, Vienna/Austria, January 5, 2017 – Renesas Electronics (“Renesas”), a premier provider of advanced semiconductor solutions, and Read More → "Renesas Electronics and TTTech Deliver Highly Automated Driving Platform Providing Faster Track to Mass Production"