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Parasoft Achieves Highest Leadership Position in Latest GigaOm Radar Report on API Functional Automated Testing

January 30, 2025
  • Parasoft tops field of 14 automated testing solutions based on comparison of key and emerging features, as well as top business criteria
  • Ranked ‘exceptional’ across 12 areas, including mock server capabilities, security testing, automated testing, and environment management
  • AI-powered automation and purpose-built functionality enable customers to streamline workflows, reduce testing complexities, and fine-tune product quality

Vishay Intertechnology 650 V and 1200 V SiC Schottky Diodes in SOT-227 Package Increase Efficiency in High Frequency Applications

40 A to 240 A Dual-Diode and Single Phase Bridge Devices Offer Low Forward Voltage Drop Down to 1.36 V and QC Down to 56 nC
January 30, 2025

MALVERN, Pa. — Jan. 29, 2025 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced 16 new 650 V and 1200 V silicon carbide (SiC) Schottky diodes in the industry-standard SOT-227 package. Designed to deliver high speed and efficiency for high frequency applications, the Vishay Semiconductors devices offer the best trade-off between capacitive charge (QC) and forward voltage drop for diodes in their class.

The devices released today consist of 40 A to 240 A dual diode components in a parallel configuration, and 50 A and 90 A single phase bridge devices. Built on state of the art thin wafer technology, the diodes feature a low forward voltage drop … Read More → "Vishay Intertechnology 650 V and 1200 V SiC Schottky Diodes in SOT-227 Package Increase Efficiency in High Frequency Applications"

2024 ISS National Lab Annual Report Highlights Momentum in Space-Based R&D

More Than 100 Payloads Delivered and More than 50 Papers Published as International Space Station National Laboratory Accelerates Discovery in Low Earth Orbit
January 30, 2025

KENNEDY SPACE CENTER (FL), January 28, 2025 – The International Space Station (ISS) National Laboratory highlighted the rapid growth of space-based R&D in its annual report, released today by the Center for the Advancement of Science in Space® (CASIS®). Over the past fiscal year, the ISS National Lab sponsored more than 100 payloads delivered to the orbiting laboratory—the second-highest annual total to date. Also this year, ISS National Lab-related results were published in 51 peer-reviewed articles—the most ever in a year—underscoring the vital role of the ISS National Lab in advancing scientific discovery and innovation.

Since 2011, CASIS … Read More → "2024 ISS National Lab Annual Report Highlights Momentum in Space-Based R&D"

EqualAI Launches New AI Literacy Initiative

EqualAI Enhances its Tools Including Expanded Podcast featuring Rosalind Wiseman and Global Experts
January 30, 2025

WASHINGTON, D.C. (January 28, 2025) – EqualAI, a nonprofit organization committed to promoting responsible AI governance, has unveiled a groundbreaking initiative to deepen and broaden AI literacy across industries and communities. This initiative includes new resources and an expanded focus for EqualAI’s popular podcast, In AI We Trust?, co-hosted by EqualAI President and CEO Miriam Vogel and cultural and educational thought leader Rosalind Wiseman, who is renowned for her global work on leadership, education and interpersonal dynamics.

Through its new efforts, EqualAI aims to equip individuals, educators, policymakers, and organizations with the tools to confidently navigate … Read More → "EqualAI Launches New AI Literacy Initiative"

Chiplets Technology: How Modular Integration is Transforming Computing Performance

January 30, 2025

The semiconductor industry is experiencing a paradigm shift with the rise of chiplet technology. Traditional monolithic chip designs are reaching physical and economic limitations, prompting engineers to adopt a modular approach. Chiplets technology enables the integration of multiple smaller chips into a single package, dramatically improving computing performance, efficiency, and scalability. This approach is revolutionizing industries ranging from high-performance computing (HPC) and artificial intelligence (AI) to gaming and consumer electronics.

The Read More → "Chiplets Technology: How Modular Integration is Transforming Computing Performance"

Alphawave Semi to Showcase Innovations and Lead Expert Panels on 224G, 128G PCIe 7.0, 32G UCIe, HBM 4, and Advanced Packaging Techniques at DesignCon 2025

In collaboration with industry leaders Amphenol, Foxconn Interconnect Technologies, MathWorks, Samtec, and Tektronix, we are showcasing the latest advances in interconnect technologies tailored for AI data centers
January 29, 2025

Researchers from Incheon National University Propose Novel Approaches for Improved Microgrid Management

A new optimization model improves microgrid operation, enhancing energy efficiency and ensuring reliable power supply
January 29, 2025
Scientists at Incheon National University have developed a new optimization model to improve microgrid operation. This model adapts to unexpected changes in power supply and demand, ensuring stable and efficient energy systems. By addressing challenges like power outages and varying energy needs, this approach enhances the reliability and sustainability of microgrids, making it suitable for real-world use in areas with unstable power grids.
 
Microgrids are localized energy systems that provide stable power supply, especially in remote or disaster-prone areas. … Read More → "Researchers from Incheon National University Propose Novel Approaches for Improved Microgrid Management"

Infineon introduces new EiceDRIVER™ isolated gate driver ICs for traction inverters in electric vehicles

January 28, 2025

Munich, Germany – 28 January 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces new isolated gate driver ICs for electric vehicles to enhance its EiceDRIVER™ family. The devices are designed for the latest IGBT and SiC technologies.  Furthermore, they support Infineon’s new HybridPACK™ Drive G2 Fusion module, the first plug’n’play power module that implements a combination of Infineon’s silicon and silicon carbide (SiC) technologies. The pre-configured third-generation EiceDRIVER products, 1EDI302xAS (IGBT) and 1EDI303xAS (SiC/ Fusion), are AEC-qualified and ISO 26262-compliant, ideal for traction inverters in cost-effective and high-performant … Read More → "Infineon introduces new EiceDRIVER™ isolated gate driver ICs for traction inverters in electric vehicles"

EdgeCortix SAKURA-I AI Accelerator Demonstrates Robust Radiation Resilience, Suitable for Many Orbital and Lunar Expeditions.

NASA publishes formal results of EdgeCortix SAKURA-I radiation testing
January 28, 2025

Tokyo, Japan (Jan. 28, 2025) — EdgeCortix® Inc., a leading fabless semiconductor company specializing in energy-efficient Artificial Intelligence (AI) processing at the edge, today announced that its SAKURA-I AI Accelerator is suitable for space missions including in Earth orbit and … Read More → "EdgeCortix SAKURA-I AI Accelerator Demonstrates Robust Radiation Resilience, Suitable for Many Orbital and Lunar Expeditions."

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