News – Page 1279 – EEJournal

Vicotee Njord, the versatile Plug & Play IoT solution based on Linear Technology’s SmartMesh IPTM to be launched at Electronica 2016

November 8, 2016

MUNICH, GERMANY – November 8, 2016 – Norwegian company Vicotee AS, part of the Virinco Group, announces the release of Vicotee Njord – a wireless mesh Internet of Things (IoT) sensor interface which utilizes SmartMesh IP™ from Linear Technology Corporation.

Launching at Linear Technology’s booth 524-Hall A4 at the Electronica Fair 2016 Exhibition, this innovative IoT solution provides a vast array of opportunities for increased control and efficiency of physical infrastructure, made possible through the collection of data by sensors that can be located practically anywhere. The Vicotee Njord product is a module based solution with 4 different “out of the box” sensors: … Read More → "Vicotee Njord, the versatile Plug & Play IoT solution based on Linear Technology’s SmartMesh IPTM to be launched at Electronica 2016"

Highly accurate relative humidity and temperature sensor IC from ams ideal for space- and power-constrained designs

November 8, 2016

Premstaetten, Austria (8 November, 2016) — ams AG (SIX: AMS), a leading provider of high performance sensors and analog ICs, today launched the ENS210, a single-die sensor IC providing extremely accurate, pre-calibrated measurements of relative humidity and ambient temperature. The ENS210 is on display for the first time at the ams stand A5.107 at the Electronica trade show (Munich, 8-11 November 2016). </ … Read More → "Highly accurate relative humidity and temperature sensor IC from ams ideal for space- and power-constrained designs"

3D Systems to Showcase Advanced Applications of Digital Manufacturing Technology at formnext 2016

November 8, 2016

3D Systems will demonstrate how its products and services are providing enhanced digital alternatives to traditional manufacturing processes at formnext 2016 in Frankfurt, Germany. The company will feature its full range of 3D printers, materials and software solutions within its exhibit booth, including a range of new materials for advanced professional and production applications.

The company will also … Read More → "3D Systems to Showcase Advanced Applications of Digital Manufacturing Technology at formnext 2016"

Qorvo® Expands Capabilities of Voice-Activated, Smart Home Assistants

November 8, 2016

GREENSBORO, NC – November 7, 2016 – Qorvo® (Nasdaq:QRVO), a leading provider of innovative RF solutions that connect the world, is helping to advance smart home networking with a radio chip and software that significantly expand the ability of consumers to control their homes with spoken commands.

The GP712 radio chip supports multiple communication protocols in a single-chip design suited toRead More → "Qorvo® Expands Capabilities of Voice-Activated, Smart Home Assistants"

TI enables more efficient motor design with faster, more accurate current-sense amplifier

November 8, 2016

DALLAS (November 8, 2016) – Texas Instruments (TI) (NASDAQ:TXN) today introduced a new current-sense amplifier for in-line motor phase current measurement that improves overall motor efficiency, compared to existing current-sense amplifiers. The INA240 offers enhanced pulse-width modulation (PWM) rejection for systems running at up to 80 V to support a variety of applications such as motor control, solenoid control and power delivery systems. For more information about the new current-sense amplifier or to order samples, see Read More → "TI enables more efficient motor design with faster, more accurate current-sense amplifier"

Bluetooth SiP Module from Silicon Labs Offers World’s Smallest Footprint for IoT End Nodes

November 8, 2016

MUNICH (electronica 2016) – Nov. 8, 2016 – Silicon Labs (NASDAQ: SLAB) has introduced the industry’s smallest Bluetooth® low energy system-in-package (SiP) module with a built-in chip antenna, offering a complete, cost-effective connectivity solution with no compromises in performance. Available in a tiny 6.5 mm x 6.5 mm package, the BGM12x Blue Gecko SiP module enables developers to miniaturize IoT designs by minimizing the PCB footprint … Read More → "Bluetooth SiP Module from Silicon Labs Offers World’s Smallest Footprint for IoT End Nodes"

congatec presents Quick Starter Kit for SMARC 2.0

November 8, 2016

San Diego, CA, November 8 — congatec, a leading technology company for embedded computer modules, single board computers and embedded design and manufacturing services, presents the SMARC 2.0 Quick Starter Kit for Intel® Atom™ processors (code name Apollo Lake). The kit comes with congatec’s first SMARC 2.0 module – the conga-SA5 – and everything developers need for the immediate evaluation of the new SMARC 2.0 standard as well as the latest Intel® Atom™ processor generation. Application engineers of connected Industry 4.0 and wireless IoT devices will love the option of the integrated wireless interfaces with standardized antenna connectors on board.

Mouser Electronics Announces Winner of International Space Station Design Challenge

November 8, 2016

November 8, 2016 – Mouser Electronics Inc., a leading global distributor of electronic components, today announced the … Read More → "Mouser Electronics Announces Winner of International Space Station Design Challenge"

Intersil Announces Industry’s First 6-Phase Bidirectional DC/DC Controller for Automotive 12V-48V Power Supply Systems

November 8, 2016

Milpitas, Calif., Nov. 8, 2016 – Intersil Corporation (NASDAQ: ISIL), a leading provider of innovative power management and precision analog solutions, today announced it is shipping the industry’s first 6-phase bidirectional PWM controller designed to perform buck and boost power conversions between 12V and 48V automotive buses. A single automotive-grade ISL78226 delivers up to 3.75kW at … Read More → "Intersil Announces Industry’s First 6-Phase Bidirectional DC/DC Controller for Automotive 12V-48V Power Supply Systems"

Small, Energy-Efficient Health Patch from imec and Holst Centre Lays the Foundation for Better Mobile Health Solutions

November 8, 2016

LEUVEN (Belgium) and EINDHOVEN (The Netherlands), Nov. 8, 2016 – At electronica, the premier international electronics tradeshow (Munich, Nov. 8-11, 2016), imec – the world-leading research and innovation center in nanoelectronics and digital technologies – Holst Centre (set up by imec and TNO), and TNO have introduced their next-generation health patch. The small form-factor comfortable to wear health patch has been optimized for low power consumption and is … Read More → "Small, Energy-Efficient Health Patch from imec and Holst Centre Lays the Foundation for Better Mobile Health Solutions"