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New Automotive Chips from STMicroelectronics Bring High-End Graphics, Audio, and Video to Entry and Mid-Range Vehicles

  • Advanced chip integration brings full-digital head unit with features like smartphone mirroring to cost-conscious vehicle markets
  • High-performing multi-processor architecture ensures high graphics, video, and audio quality
  • Dedicated on-chip microcontroller with crypto acceleration ensures best-in-class security 

Geneva, November 17, 2016 – Full-digital instrument panels that give a high-end feel to any car are coming to the mid and entry ranges, enabled by new technology from STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and a top supplier of advanced automotive ICs.

ST’s new Read More → "New Automotive Chips from STMicroelectronics Bring High-End Graphics, Audio, and Video to Entry and Mid-Range Vehicles"

Icon Labs Launches the Floodgate IoT Security Toolkit: A Complete Security Solution for IoT Edge Devices

November 17, 2016 — West Des Moines, IA – Icon Labs (www.iconlabs.com), a leading provider of security solutions for IoT and edge devices, today announced its Floodgate IoT Security Toolkit. The solution enables IoT edge devices to be easily and securely integrated with IoT cloud platforms, including Verizon’s ThingSpace IoT Cloud Platform, and provides security management for remote IoT devices from a single user interface. 

< … Read More → "Icon Labs Launches the Floodgate IoT Security Toolkit: A Complete Security Solution for IoT Edge Devices"

Driverless Vehicle Makers, Carriers, Drone-Defense Creators Look to MEMS & Sensors Industry for Advanced Sensing and Actuation

SCOTTSDALE, AZ–(Marketwired – Nov 11, 2016) – MEMS & Sensors Industry Group (MSIG)’s MEMS & Sensors Executive Congress™ — held November 9-11 in Scottsdale, AZ — gave innovative developers of driverless vehicles and drone-defense makers — as well as one of the world’s top carriers — a ready audience of industry execs as they shared their wants for … Read More → "Driverless Vehicle Makers, Carriers, Drone-Defense Creators Look to MEMS & Sensors Industry for Advanced Sensing and Actuation"

CEVA and NextG-Com Partner to offer Integrated LTE Cat-M1 and Cat-NB1 Solutions for Cost-Sensitive IoT applications

MOUNTAIN VIEW, Calif. – November 17, 2016 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing IPs for smarter, connected devices, and NextG-Com Limited (NextG-Com), today introduced two pre-integrated narrowband LTE solutions designed to simplify the development of Cat-M1 and Cat-NB1 (NB-IoT) modems for cost-sensitive Internet of Things (IoT) applications.

The solutions incorporate the recently introduced CEVA-X1 single-core IoT processor together with NextG-Com’s ALPSLite-M Cat-M1 or ALPSLite-NB Cat-NB1 protocol stacks, in a highly compact and power-efficient manner. Addressing the cost-sensitive nature of cellular IoT devices, the CEVA-X1 is capable of handling the full DSP and CPU processing loads … Read More → "CEVA and NextG-Com Partner to offer Integrated LTE Cat-M1 and Cat-NB1 Solutions for Cost-Sensitive IoT applications"

Altium Releases New Version of Leading PCB Design Software Committed to Passionate Design

San Diego, CA – 16 November 2016  – After experiencing record user growth in the past year, Altium has launched the latest version of their leading PCB design software with Altium Designer 17. This release further embodies Altium’s commitment to passionate design by significantly reducing the time spent on non-design related tasks. Designers can leverage several advanced new technologies to center their focus on actual design rather than the mundane tasks that often plague the design process.

“Altium Designer 17 is a continuation of our … Read More → "Altium Releases New Version of Leading PCB Design Software Committed to Passionate Design"

Ultra-Compact Open Frame AC-DC Power Supplies are Ideal for Space-Constrained Applications

TUALATIN, Ore. — November 17, 2016 — CUI Inc today announced a family of ultra?compact ac-dc power supplies in an open frame SIP package. The 3 W and 5 W configurations of the PBO series measure as small as 35 x 11 x 18 mm (1.38 x 0.43 x 0.71 in), allowing them to occupy less board real-estate than other power solutions. The 3 W models are also available in low-profile, right-angle versions measuring as small 35 x 18 x 11 mm (1.38 x 0.43 x 0.71 in), making them ideal for applications where vertical board space is at a premium.

< … Read More → "Ultra-Compact Open Frame AC-DC Power Supplies are Ideal for Space-Constrained Applications"

Samtec FireFly™ PCIe® Optical Flyover Cable Assembly Fully Supports PCIe 4.0

New Albany, IN: The technical collaboration between Samtec, a privately held $625MM global manufacturer of a broad line of electronic interconnect solutions, and PLDA, the industry leader in PCI Express® interface IP solutions, provides a groundbreaking solution for PCIe 4.0 endpoint development by combining PLDA’s PCIe 4.0 hardware and IP with the Samtec’s PCUO PCIe® Optical Flyover Cable Assembly.

The PLDA PCIe 4.0 Platform Development Kit (PDK) is a complete development platform based on PLDA’s PCIe compliant XpressSWITCH IP and PLDA’s XpressRICH4™ controller IP for PCIe Gen4 technology running on a Xilinx® Virtex® UltraScale™ FPGA. This … Read More → "Samtec FireFly™ PCIe® Optical Flyover Cable Assembly Fully Supports PCIe 4.0"

30A, Scalable to 180A, µModule Regulator in 9mm x 15mm BGA Package

MILPITAS, CA – November 16, 2016 – Linear Technology introduces the LTM4647, a 30A step-down µModule (power module) regulator. The LTM4647 includes the inductor, MOSFET, DC/DC controller and supporting components in a 9mm x 15mm x 5.01mm BGA package. The device’s conversion efficiency from 12VIN to 1VOUT at 30A is 87%, when delivering a full 30A continuously without a heat sink or air flow at 70°C ambient. The LTM4647 can deliver up to 180A by current sharing six devices in parallel.

Total output voltage DC accuracy is guaranteed at ±1.2% over reference, feedback resistor, line, load and temperature (–40°C to 125°C), … Read More → "30A, Scalable to 180A, µModule Regulator in 9mm x 15mm BGA Package"

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