News – Page 1274 – EEJournal

Curtiss-Wright Leads the Embedded Market in Bringing Gen 4 PCIe Capability to Standard VPX

January 24, 2017

EMBEDDED TECH TRENDS, NEW ORLEANS, La. – January 23, 2017 — Curtiss-Wright’s Defense Solutions division, the world’s leading supplier of open standard VPX (VITA 46) systems for aerospace and defense applications today announced that it has successfully developed the ability to meet the increased bandwidth requirements of Gen 4 PCI Express (PCIe) with standard MultiGig RT2 VPX connectors. This milestone, which uses a new optimized design approach, extends the ability of the VPX and OpenVPX (VITA 65) standards to support the full bandwidth and signal integrity required when transferring 16 Gbaud PCIe 4.0 data communications signals over the backplane. Curtiss-Wright has successfully proven the performance and … Read More → "Curtiss-Wright Leads the Embedded Market in Bringing Gen 4 PCIe Capability to Standard VPX"

Tektronix Delivers Automated 100G Electrical Test Solutions for DSA8300 Sampling Oscilloscopes

January 24, 2017

BEAVERTON, Ore. January 24, 2017 – Tektronix, a leading worldwide provider of measurement solutions, today introduced new equivalent time automated compliance test solutions for 4-lane 100G electrical interfaces defined in the IEEE 802.3bm and 802.3bj specifications. The new capabilities along with the full set of Tektronix solutions for 100G and 400G characterization and validation will be demonstrated February 1-2 at DesignCon 2017, Booth 741.

Available for Tektronix performance oscilloscopes … Read More → "Tektronix Delivers Automated 100G Electrical Test Solutions for DSA8300 Sampling Oscilloscopes"

New time-to-digital converter from ams offers industry-best combination of speed, precision and power

January 24, 2017

Premstaetten, Austria (24 January, 2017) — ams AG (SIX: AMS), a leading provider of high performance sensor solutions and analog ICs, has launched a new version of its market-leading time-to-digital converter (TDC) offering improved speed and precision together with low power consumption. The new TDC-GPX2 also features standard low-voltage differential signaling (LVDS) and serial peripheral (SPI) interfaces, and a new, smaller 9mm x 9mm QFN64 package.

TDCs from ams, which can measure short time intervals with great precision, are widely used in light detection and ranging (LIDAR) and laser-ranging devices, in positron emission tomography ( … Read More → "New time-to-digital converter from ams offers industry-best combination of speed, precision and power"

Tektronix Introduces Industry’s First Comprehensive Receiver Testing Solution for MIPI D-PHY v2.0

January 24, 2017

BEAVERTON, Ore., Jan. 24, 2017 – Tektronix, a leading worldwide provider of measurement solutions, today introduced the industry’s first receiver test solution with 100 percent coverage of the MIPI Alliance’s recently released D-PHY v.2.0 specification along with full support for the C-PHY v1.1 receiver test specification.

Tektronix now offers MIPI designers, such as those working on autonomous driving systems or in-vehicle infotainment, simplified PHY receiver test set up and faster test execution combined with industry leading signal fidelity and flexible support for in-depth debug and margin testing. This solution expands … Read More → "Tektronix Introduces Industry’s First Comprehensive Receiver Testing Solution for MIPI D-PHY v2.0"

Imec Introduces New Snapshot Multispectral Image Sensor that Combines Color and Near-Infrared Imaging

January 24, 2017

SAN FRANCISCO (USA)– Jan. 23st, 2017 – At next week’s SPIE Photonics West in San Francisco, imec, the world-leading research and innovation hub in nano-electronics and digital technologies, will introduce a new image sensor with integrated color (Red Green Blue, RGB) and narrow-band near-infrared (NIR) filters. This breakthrough optical filter integration platform will enable many different application fields from medical, industrial, security surveillance, automotive to virtual and augmented reality, where near-infrared signals need to be extracted and overlaid on top of color images.

Imec’s RGB-NIR multispectral platform demonstrates for the very first time the … Read More → "Imec Introduces New Snapshot Multispectral Image Sensor that Combines Color and Near-Infrared Imaging"

element14 exclusively launches BitScope Blade for Raspberry Pi

January 23, 2017

London 23^rd January 2017, element14, the development distributor, today announces exclusive global availability of the new BitScope Blade range, offering the ability to conveniently power and mount multiple Raspberry Pi’s.

BitScope Blades are designed for building scalable computing solutions ranging from stand-alone servers, routers and workstations up to full compute clusters, private clouds, networked physical computing and Industrial IoT systems.

Every Blade can be used with simple plug packs, 12V batteries, solar power systems, low cost uninterruptible power supplies (UPS) and even passive power over Ethernet (PoE) solutions to up 48V. They may … Read More → "element14 exclusively launches BitScope Blade for Raspberry Pi"

AVX Releases A New Series of 15W High Performance, Low Pass Integrated Thin Film Filters With a Frequency Range Spanning 512 – 1,800MHz

January 23, 2017

FOUNTAIN INN, S.C. (January 23, 2017) – AVX Corporation (NYSE:AVX), a leading manufacturer of passive components and interconnect solutions, has released a new series of 15W high performance, low pass integrated thin film (ITF) SMD filters that exhibit low insertion loss and extremely sharp attenuation in high frequency wireless applications spanning 512MHz to 1,800MHz. Featuring a miniature 2816 chip size with a maximum height profile of 1mm, and a rugged construction based on thin film multilayer technology and designed for reliable automatic assembly, the new 15W LP Series … Read More → "AVX Releases A New Series of 15W High Performance, Low Pass Integrated Thin Film Filters With a Frequency Range Spanning 512 – 1,800MHz"

Curtiss-Wright Debuts Industry’s First COTS Data Storage System to Support 2-Layer Encryption for Protecting Classified Data-at-Rest

January 23, 2017

ASHBURN, Va. – January 23, 2017 – Curtiss-Wright’s Defense Solutions division has announced the embedded industry’s first commercial off the shelf (COTS) data-at-rest (DAR) storage solution to support Commercial Solutions for Classified (CSfC) 2-Layer Encryption, an NSA approved approach for protecting classified National Security Systems (NSS) information in aerospace and defense applications using cost-effective commercial encryption technologies in a layered solution. Curtiss-Wright now supports CSfC 2-Layer Encryption on its Data Transport System (DTS1), a rugged single-slot Network Attached Storage (NAS) storage device. With data breaches and state sponsored cyber attacks on the rise, the protection of sensitive data becomes increasingly critical.</ … Read More → "Curtiss-Wright Debuts Industry’s First COTS Data Storage System to Support 2-Layer Encryption for Protecting Classified Data-at-Rest"

Mikrotron presents new family of high-resolution high-speed Machine Vision cameras

January 23, 2017

Mikrotron GmbH will present its new line of extremely compact high-resolution high-speed CoaXPress® and CameraLink machine vision cameras at SPIE Photonics 2017, held from 28 January to 2 February 2017 in San Francisco.

All three new camera models, namely EoSens® 25CXP+, EoSens® 12CXP+ and EoSens® 25CL+ are powered by an advanced OnSemi PYTHON CMOS sensor. The high resolution of the CMOS global shutter camera models, combined with a precise trigger and synchronization, a high frame rate and short integration times , give a perfect image quality … Read More → "Mikrotron presents new family of high-resolution high-speed Machine Vision cameras"

Flex Logix Works with DARPA to Develop Flex Logix’s Embedded FPGA IP for Government Projects

January 23, 2017

MOUNTAIN VIEW, Calif., Date January 23, 2017 – DARPA, the Defense Advanced Research Projects Agency, announced today that it has signed an agreement to work with Flex Logix to develop Flex Logix’s EFLX embedded FPGA technology for use by any company or government agency designing integrated circuits for the US Government. As part of the agreement, Flex Logix will make available EFLX arrays in the TSMC 16FFC process node from 2.5K to 122.5K LUTs so that these companies and agencies can reconfigure RTL at any point during the design process. Having this flexibility will enable chip designers to increase performance, reduce … Read More → "Flex Logix Works with DARPA to Develop Flex Logix’s Embedded FPGA IP for Government Projects"

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