News – Page 1261 – EEJournal

Optimal+ to Present on Big Data Analytics’ Ability to Provide Value Chain Visibility and Brand Protection for Electronics Products in IBM Client Center at CES

January 5, 2017

LAS VEGAS–(BUSINESS WIRE)–Optimal+ VP of Business Development Kiki Ohayon will provide insight on how big data product analytics can provide value chain visibility and brand protection for electronics products at CES2017 in the IBM Client Center at the Venetian … Read More → "Optimal+ to Present on Big Data Analytics’ Ability to Provide Value Chain Visibility and Brand Protection for Electronics Products in IBM Client Center at CES"

FIIL Chooses Valencell’s PerformTek® Biometric Sensor Technology for Accurate Heart Rate Monitoring in New Carat Pro Wireless Earphones

January 5, 2017

LAS VEGAS, Jan. 4, 2017 /PRNewswire/ — CES 2017 – Valencell, the leading innovator in wearable biometric data sensor technology, and FIIL, a leading designer and innovator for audio products, today announced that Valencell’s PerformTek® technology has been integrated into FIIL’ … Read More → "FIIL Chooses Valencell’s PerformTek® Biometric Sensor Technology for Accurate Heart Rate Monitoring in New Carat Pro Wireless Earphones"

Pixus Adds New Versatile Features in 1U MicroTCA Chassis

January 5, 2017

Waterloo, Ontario — Jan 4, 2017 – Pixus Technologies, a provider of embedded computing and enclosure solutions, has announced that it’s 1U MicroTCA Chassis has new versatile power options.

The PXS0108 chassis is the ideal system for development or deployed MicroTCA applications. The 1U high unit offers a mix-and-match approach for the MicroTCA Carrier Hub (MCH), power, and payload modules. There are options for 1 or 2 MCHs, single or dual power supplies, and multiple size variants of AMCs. Further, the … Read More → "Pixus Adds New Versatile Features in 1U MicroTCA Chassis"

Altek License CEVA Imaging and Vision DSP for Deep Learning in Mobile Devices

January 5, 2017

LAS VEGAS, Nevada, – CES 2017 – January 05, 2017 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing IP for smarter, connected devices, today announced that Altek Corporation, a leading Taiwanese imaging systems provider, has licensed CEVA’s imaging and vision DSP to add power-efficient, … Read More → "Altek License CEVA Imaging and Vision DSP for Deep Learning in Mobile Devices"

SmartMesh IP Wireless Mesh Networks Expand to Address Industrial IoT Networks with Thousands of Nodes

January 5, 2017

MILPITAS, CA – January 5, 2017 – Linear Technology’s SmartMesh IP™ wireless sensor network (WSN) product line has expanded to address the growing needs of industrial Internet of Things (IoT) applications. New capabilities include the SmartMesh® VManager™ networking software, which seamlessly increases the mesh network capacity to thousands of nodes. The new Blink mode, an ultralow power roaming node capability, reduces average current consumption of wireless sensor nodes to less than 3µA.

SmartMesh IP, based on 6LoWPAN, delivers wire-like reliability and ultralow power to wireless mesh networks, allowing secure deployment of battery-operated IoT sensors in harsh environments with more than 10 … Read More → "SmartMesh IP Wireless Mesh Networks Expand to Address Industrial IoT Networks with Thousands of Nodes"

Retune DSP Multi-Microphone Beamforming and Echo Cancellation Now Available for Cadence Tensilica HiFi Audio DSPs

January 5, 2017

SAN JOSE, Calif. and COPENHAGEN, 04 Jan 2017

Cadence Design Systems, Inc. (NASDAQ: CDNS) and Retune DSP today announced that Retune DSP’s multi-microphone beamforming and echo cancellation technology has been ported and optimized to Cadence® Tensilica® HiFi DSPs for Audio/Voice/Speech. Optimized DSPs such as the Tensilica HiFi DSP that are efficient, low power and high performance are well suited for voice-processing applications.

“We are truly excited to partner with Cadence to deliver the Voice Seeker beamforming and echo cancellation solution, as well … Read More → "Retune DSP Multi-Microphone Beamforming and Echo Cancellation Now Available for Cadence Tensilica HiFi Audio DSPs"

Senet, STMicroelectronics, and myDevices Showcase the Benefits of Low-Power Wide Area Network Technology at CES 2017

January 5, 2017

Las Vegas, NV – January 5, 2017 — LoRa Allianceä members myDevices, the Internet of Things solutions company; Read More → "Senet, STMicroelectronics, and myDevices Showcase the Benefits of Low-Power Wide Area Network Technology at CES 2017"

EMA Releases Updated Power IC Model Library for PSpice

January 5, 2017

Rochester, NY (January 4, 2017) – EMA Design Automation® (www.ema-eda.com), a full-service provider and innovator of Electronic Design Automation (EDA) solutions, and AEi Systems, a world leader in power electronics modeling, analysis and design, today announced the release of version 4.2 of AEi Systems’ Power IC Model Library for the Cadence® PSpice® simulator. “We’ve spent over 1,000 man-hours testing, simulating, and optimizing the new models in this … Read More → "EMA Releases Updated Power IC Model Library for PSpice"

Vesper and DSP Group Demo Near-Zero-Power Voice-Activation for Battery-Powered Devices at CES 2017

January 5, 2017

LAS VEGAS – (January 4, 2017) – Vesper, developer of the world’s most advanced acoustic sensors, DSP Group, Inc.(NASDAQ:DSPG), a leading global provider of wireless chipset solutions for … Read More → "Vesper and DSP Group Demo Near-Zero-Power Voice-Activation for Battery-Powered Devices at CES 2017"

Faraday Extends SoC Design Services to Include Virtual Prototyping Solution Using Synopsys Virtualizer

January 5, 2017

HSINCHU, Taiwan, Jan. 5, 2017 /PRNewswire/ — Faraday Technology Corporation and Synopsys, Inc. (Nasdaq:SNPS) today announced the expansion of Faraday’s design services to include a virtual prototyping solution. Faraday’s SoReal!™ Virtual Platform, … Read More → "Faraday Extends SoC Design Services to Include Virtual Prototyping Solution Using Synopsys Virtualizer"