News – Page 1260 – EEJournal

Unique test solution from Rohde & Schwarz analyzes IP security mechanisms in IoT and mobile devices

February 28, 2017

Munich, February 28, 2017 — The Internet of Things (IoT) is integrating the Internet into our daily lives, with products such as home automation, wearables and even connected cars. Sensitive data is increasingly being transmitted via wireless IP-based connections. The high demand for mobility, large ranges and reliability is best met with cellular technologies, especially LTE and LTE-Advanced as well as 5G in the future. However the components, particularly for IoT, are often not fully mature or have undergone only the most basic testing and are therefore poorly protected against attacks and … Read More → "Unique test solution from Rohde & Schwarz analyzes IP security mechanisms in IoT and mobile devices"

Chirp Microsystems Introduces High-Accuracy Touchless Ultrasonic Sensing for Wearables at Mobile World Congress 2017

February 28, 2017

BARCELONA, Spain — (February 27, 2017) — Chirp Microsystems, the pioneer in low-power ultrasonic sensing solutions, today introduced at Mobile World Congress 2017 the first high-accuracy, ultra-low power ultrasonic sensing development platform for wearables. The new Chirp development platform — which leverages the company’s microelectromechanical systems (MEMS)-based time-of-flight (ToF) sensor — senses tiny “microgestures” with 1mm accuracy, allowing users to interact with wearables and other consumer electronics devices using … Read More → "Chirp Microsystems Introduces High-Accuracy Touchless Ultrasonic Sensing for Wearables at Mobile World Congress 2017"

CEVA’s Bluetooth® 5 Low Energy IP Powers ON Semiconductor’s Ultra-Low-Power Radio SoC for IoT and Connected Health and Wellness Devices

February 28, 2017

BARCELONA, Spain, – February 28, 2017 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing IP for smarter, connected devices, today announced that ON Semiconductor has licensed and deployed the RivieraWaves Bluetooth 5 low energy technology in its new Read More → "CEVA’s Bluetooth® 5 Low Energy IP Powers ON Semiconductor’s Ultra-Low-Power Radio SoC for IoT and Connected Health and Wellness Devices"

Spreadtrum Standardizes on Synopsys ZeBu Server Emulation System for Advanced Mobile SoCs

February 28, 2017

MOUNTAIN VIEW, Calif., Feb. 28, 2017 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS) today announced that Spreadtrum has standardized on Synopsys ZeBu^® Server-3 as its emulation solution for advanced mobile SoCs. With its high performance, scalability and integration with Synopsys’ Virtualizer^™ virtual prototyping solution, ZeBu Server delivered 40-minute Android boot and 5 MHz emulation performance, enabling Spreadtrum to achieve faster time to market for its latest mobile SoC platform.

“Spreadtrum develops the industry’s leading mobile chipsets, such as our recent single chip solution for medium and premium … Read More → "Spreadtrum Standardizes on Synopsys ZeBu Server Emulation System for Advanced Mobile SoCs"

Rail-to-Rail Op Amps Feature Precision & Power Efficiency

February 28, 2017

MILPITAS, CA – February 28, 2017 – Linear Technology introduces the LTC6258/59/60 and LTC6261/62/63, single/dual/quad op amps, extending its line of power efficient, low noise, precision operational amplifiers. These devices are part of a family of power efficient op amps ranging from 1.3MHz GBW product at 20µA supply current to 720MHz GBW product at 3.3mA supply current. The latest family members operate on 1.8V to 5.25V supply, feature rail-to-rail inputs and outputs, and include versions with shutdown mode, further reducing power consumption during periods of inactivity. Input offset voltage is just 400?V max. The devices are fully specified over the industrial ( … Read More → "Rail-to-Rail Op Amps Feature Precision & Power Efficiency"

Cadence Delivers Foundry-Enabled In-Design and Signoff Lithography Simulation Integration with ASML

February 28, 2017

SAN JOSE, Calif., 28 Feb 2017

Highlights:

Imec validates Cadence LPA PLUS for advanced-process technologies
Customers can verify design manufacturability during implementation and signoff, enabling them to detect and fix yield-limiting lithography hotspots

Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the Cadence® Litho Physical Analyzer (LPA) Production Lithography Unified Solution (PLUS) developed in partnership with ASML, which seamlessly provides foundry-enabled lithography simulation capabilities during chip design implementation and signoff. Cadence LPA PLUS enables engineers to detect … Read More → "Cadence Delivers Foundry-Enabled In-Design and Signoff Lithography Simulation Integration with ASML"

MaxLinear Showcases Wireless Backhaul Product Portfolio Strength with 20 Gbps Millimeter Wave Modem SoC

February 28, 2017

BARCELONA – Feb. 28, 2017 – MaxLinear Inc. (NYSE: MXL), a leading provider of radio frequency (RF) and mixed-signal integrated circuits for the connected home and wired and wireless infrastructure markets, today announced the MxL85110 baseband system on-chip (SoC) for broadband wireless transmission systems.

With its exceptional 20 Gbps throughput, the MxL85110 provides a flexible solution that meets the evolving … Read More → "MaxLinear Showcases Wireless Backhaul Product Portfolio Strength with 20 Gbps Millimeter Wave Modem SoC"

Samtec connector range from RS Components targets wireless telecommunications

February 28, 2017

Oxford, UK, 28 February 2017: RS Components (RS), the trading brand of Electrocomponents plc (LSE:ECM), the global distributor for engineers, has announced that it is expanding its Samtec product range with the introduction of more than 190 additional devices, including RF and coaxial connectors that target use in wireless telecommunications applications.

Key product types being introduced include: the high-speed and high-density Razor Beam™ self-mating systems, which reduce inventory costs and are available in a variety of pitches and … Read More → "Samtec connector range from RS Components targets wireless telecommunications"

PRO DESIGN Launches Intel® Stratix® 10-based High-Speed Multi FPGA Prototyping Solution

February 27, 2017

San Jose, 27 February 2017 – PRO DESIGN, a veteran in the E²MS and EDA industry, today announced the launch of its proFPGA quad SG 280 system, a new generation of its modular and scalable high-speed FPGA Prototyping solution based on the latest Intel® Stratix®10 FPGA technology.

Assembled with 4 pluggable Intel Stratix 10 SG280-based FPGA modules, the quad system offers a capacity of up to 80 M ASIC gates and up to 5 proFPGA quad systems with overall 20 FPGA modules, that can be easily connected to increase … Read More → "PRO DESIGN Launches Intel® Stratix® 10-based High-Speed Multi FPGA Prototyping Solution"

Cadence Launches Protium S1 FPGA-Based Prototyping Platform for Early Software Development

February 27, 2017

SAN JOSE, Calif., 27 Feb 2017

Highlights:

Delivers next-generation FPGA-based prototyping as part of the industry-leading Cadence Verification Suite
Reduces design bring-up time from months to weeks by an average of 80 percent
Provides front-end congruency with Palladium Z1 enterprise emulation platform for ease of adoption and fast bring-up
Offers 6X improvement in supported design size over previous generation

Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the new Protium™ S1 FPGA-Based Prototyping Platform, … Read More → "Cadence Launches Protium S1 FPGA-Based Prototyping Platform for Early Software Development"