News – Page 1253 – EEJournal

Rohde & Schwarz introduces powerful 6 GHz lab oscilloscope for multi-domain applications

January 31, 2017

Rohde & Schwarz has added a new 6 GHz model to its R&S RTO2000 series, opening up measurements on fast communications interfaces and IoT applications. The exceptional characteristics of the compact R&S RTO2000 lab oscilloscopes make them the ideal instrument for demanding measurement tasks such as power integrity measurements.

Munich, January 31, 2017 — The new R&S RTO2000 model with 6 GHz bandwidth allows developers to test the radio interfaces of 802.11ac WLAN components for IoT modules in the 5 GHz band … Read More → "Rohde & Schwarz introduces powerful 6 GHz lab oscilloscope for multi-domain applications"

TE Connectivity’s Next Generation Composite Connectors Provide Rugged Reliability in Harsh Environments

January 31, 2017

HARRISBURG, Pa. – January 31, 2017 – TE Connectivity (TE) (NYSE: TEL), a world leader in connectivity and sensors, has released its next generation ACT composite connectors within the DEUTSCH MIL-DTL-38999 series. The ACT series circular connectors are among the most versatile and popular circular mil spec input/output connectors in the world. These circular connectors offer composite shells providing up to 40 percent weight savings over aluminum connectors.

MIL-DTL-38999 connectors are widely used throughout the world in military, defense and commercial avionics applications. TE’s DEUTSCH group created one of the original … Read More → "TE Connectivity’s Next Generation Composite Connectors Provide Rugged Reliability in Harsh Environments"

Electric Vehicle Charging Interface Initiative Welcomes STMicroelectronics

January 31, 2017

Berlin – January 31, 2017 – The Charging Interface Initiative e. V., CharIN, an open association founded to develop and establish the Combined Charging System (CCS) as the standard for charging all kinds of battery-powered electric vehicles, and STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications and a pioneer in making vehicles safer, greener, and more connected, have announced that ST has become a member of the initiative.

With an unparalleled portfolio of automotive and secure microcontrollers, industry-leading sensing and power technologies—including advanced silicon carbide (SiC), and top-tier secure connectivity expertise, ST brings to CharIN … Read More → "Electric Vehicle Charging Interface Initiative Welcomes STMicroelectronics"

congatec now entirely supports the Windows 10 IoT editions

January 31, 2017

San Diego, CA, January 31, 2017 * * * congatec – a leading technology company for embedded computer modules, single board computers and embedded design and manufacturing services – has announced its comprehensive support of the IoT editions of Windows 10. These full versions of Windows 10 are characterized by their extended security functions and lockdown options for IoT-connected appliances. congatec has integrated these innovative features on all its current boards with Intel^® Atom™, Celeron^®, Pentium^®, Core™ and Xeon^® processors as well as AMD Embedded R and G Series processors. Customers benefit from an overall simplified development of IoT connected … Read More → "congatec now entirely supports the Windows 10 IoT editions"

Cadence Sigrity 2017 Delivers Fast Path to PCB Power Integrity Signoff

January 30, 2017

SAN JOSE, Calif., 25 Jan 2017

Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced availability of the Sigrity™ 2017 technology portfolio, which introduces several key features specifically designed to speed up PCB power and signal integrity signoff. Among the features included in the newest version of the Cadence® Sigrity portfolio are the Allegro® PowerTree™ topology viewer and editor, which enable designers to quickly assess power delivery decisions early in the design cycle. The latest release of Sigrity also includes a … Read More → "Cadence Sigrity 2017 Delivers Fast Path to PCB Power Integrity Signoff"

Imec demonstrates world’s first multispectral time-delay-integration image sensor based on CCD-in-CMOS technology

January 30, 2017

San Francisco (US), Jan 30, 2017 – At this week’s SPIE Photonics West, imec, the world-leading research and innovation hub in nano-electronics and digital technologies, showcases a prototype of a high-performance multispectral time-delay-integration (TDI) imager that is based on charge-coupled device (CCD)-in-CMOS technology. Due to its high sensitivity and record high speed (up to 300kHz), this next-generation TDI imager targets high-end applications, such as remote sensing, life sciences and machine vision. The specialty imagers are offered through various business models, including full-custom design, prototype TDI sensors and … Read More → "Imec demonstrates world’s first multispectral time-delay-integration image sensor based on CCD-in-CMOS technology"

Fourth-Generation 600 V E Series Power MOSFET Lowers Conduction and Switching Losses, Increases Efficiency

January 30, 2017

MALVERN, Pa. — Jan. 26, 2017 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced the first device in itsfourth generation of 600 V E Series power MOSFETs. Providing high efficiency for telecom, industrial, and enterprisepower supply applications, the Vishay Siliconix n-channel SiHP065N60E slashes on-resistance by 30 % compared with previous 600 V E Series MOSFETs while delivering 44 % lower gate charge. This results in the industry’s lowest gate charge times on-resistance, a key figure of merit (FOM) for 600 V MOSFETs used in power conversion applications.

“We are committed to providing our customers with a broad line of MOSFET technologies that support all stages … Read More → "Fourth-Generation 600 V E Series Power MOSFET Lowers Conduction and Switching Losses, Increases Efficiency"

Rohde & Schwarz introduces a probe with both a large offset range and a DC voltmeter for power integrity measurements

January 30, 2017

The R&S RT-ZPR20 is a new, extremely low-noise power rail probe with a bandwidth of 2 GHz. Its 1:1 attenuation also ensures very good sensitivity. The large offset range of ± 60 V permits analysis of the smallest disturbance signals during power integrity measurements, even on DC power supplies with a high voltage level. The probe also features an integrated high-precision DC voltmeter.

Munich, January 30, 2017 — The quality of the power supply is a key factor in the functionality and performance of sensitive electronic circuits. … Read More → "Rohde & Schwarz introduces a probe with both a large offset range and a DC voltmeter for power integrity measurements"

SST & Sparkfun Collaborate on Arduino-Based Liquid Level Sensing Hardware

January 30, 2017

30^th January 2017 – In order to address the vibrant and constantly expanding maker market, SST Sensing Ltd. has partnered up with Sparkfun. Together they have developed and simple to implement solution for single point liquid detection using infra-red technology. This highly reliable and accurate solution comprises an Optomax Digital liquid level switch which is connected to an Arduino board via the TTL output and powered by its 5V source. LEDs on the Arduino can be easily programmed to indicate if the sensor is/isn’t immersed by the liquid (and thus determine if liquid level is too high/ … Read More → "SST & Sparkfun Collaborate on Arduino-Based Liquid Level Sensing Hardware"

Nanotherm LC solves the thermal management challenge of CSP LEDs

January 30, 2017

30 January 2017, London UK — Thermal management innovator Cambridge Nanotherm today announces how its Nanotherm LC thermal management solution addresses the unique needs of chip-scale packaging (CSP) LEDs.

CSP LEDs have several benefits over traditional high-power LEDs (HP LEDs), giving module designers the ability to produce smaller, brighter and more cost-effective luminaires. The market for CSP LEDs is growing rapidly. Yole Développment predict CSPs will make up 34% of the HP LED market by 2020.

However, CSPs also present a significant thermal challenge. Traditional HP LEDs have a … Read More → "Nanotherm LC solves the thermal management challenge of CSP LEDs"

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