Geneva, May 22, 2017 – STMicroelectronics has introduced new MOSFET devices in the advanced PowerFLATTM 5×6 dual-side cooling (DSC) package, enabling increased power density in automotive Electronic Control Units (ECUs). The new MOSFETs have already been chosen by Denso, a leading supplier of advanced automotive technology to all major car makers.
DesignWare PHY IP Cuts Power and Area by More Than 35 Percent for High-Performance Computing Applications Including Machine Learning and Artificial Intelligence
MOUNTAIN VIEW, Calif., May 22, 2017 /PRNewswire/ —
Highlights:
SL876Q5-A module simplifies the development process and delivers superior performance for wearables, personal trackers, and other battery-dependent applications
London, May 18, 2017 – Telit, a global enabler of the Internet of Things (IoT), today announced the introduction of a new, ultra-slim family of smart antenna GNSS (Global Navigation Satellite System) receiver modules. These fully integrated modules include a comprehensive feature set that eliminates the need for additional components, ideal for IoT projects with size, cost, and time constraints.
Easing the burden for developers with little or no RF design experience, the SL876Q5-A is compliant … Read More → "Telit Introduces Ultra-slim, Smart Antenna GNSS Location Module"
Avnet to preview new initiative announced with Kickstarter and Dragon, plus showcase its communities and tools available to support makers in the technology product lifecycle
PHOENIX—May 18, 2017—Avnet (NYSE: AVT), a leading global technology distributor, today announced its activities as a presenting sponsor at Maker Faire Bay Area beginning tomorrow at the San Mateo County Event Center.
Avnet will participate in a live presentation on the Make: Live stage about the collaboration announced earlier this morning by Kickstarter PBC, the world’s largest funding platform for creative projects. The new initiative from Kickstarter, Dragon Innovation, … Read More → "Avnet Helps Guide Makers’ Technology Ideas to Production at Maker Faire"
PEDOT Clear Conductive Sensors expand realm of possibility for capacitive user interface panels.
LISLE, IL – May 18, 2017 – Molex has solved the challenge of backlighting capacitive keys on a curved surface for user-interface designers. Molex PEDOT Clear Conductive Sensors are flexible translucent conductive circuits printed on a polyester substrate that can be implemented on three-dimensional surfaces, allowing for more elaborate designs and greater design freedom. Translucent PEDOT sensors can be used in space-restricted applications where previous methods of backlighting (light guide film or side fire LEDs) are impractical.
“OEMs want to design contemporary backlit capacitive interfaces while … Read More → "Molex Technology Makes Keypad Backlighting on Curved Surfaces a Reality"
Compact, easy-to-use Bluetooth tool is USB-powered, offers No Hassles Decoding – just plug into the USB port and go!
Fairport, NY: Saelig Company, Inc. has announced the availability of the BPA low energy Bluetooth Protocol Analyzer from Teledyne LeCroy – a powerful, portable protocol analyzer for wireless transmissions that adhere to Bluetooth low energy specifications. Ideal for field or lab use, the BPA low energy analyzer is USB powered, eliminating the need for an external power supply. This analyzer supports all of the mandatory Bluetooth low energy features through Bluetooth version 4.2, and ships with Frontline software allowing Bluetooth developers … Read More → "Saelig Introduces the BPA low energy Bluetooth Protocol Analyzer from Teledyne LeCroy"
Kits Provide Key Interconnect Solutions for Four Popular Electronics Platforms
New Albany, IN: Samtec, a privately held $662MM global manufacturer of a broad line of electronic interconnect solutions, proudly announces the release of four unique Expansion Connector Sample Kits for Makers. These new kits allow continued growth and stacking of the most popular electronics platforms using standard 0.100″ (2.54mm) centerline IDC cables, sockets and headers.
Read More → "Samtec Releases Expansion Connector Sample Kits for Makers"
Fully-Certified Software Development Kit Leverages Hardware-Based Calculations to Create Fast, Low-Power Solutions Providing an Optimized Customer Experience
CHANDLER, Ariz., May 18, 2017 — A fully-certified Wi-Fi® Software Development Kit (SDK) with Apple HomeKit support is now available from Microchip Technology Inc. (NASDAQ: MCHP). This SDK enables MFi licensees to create fast, low-power designs on the industry’s first hardware cryptography enabled Wi-Fi-based development kit for HomeKit. For more information about Microchip’Read More → "Microchip’s Wi-Fi® SDK with Apple HomeKit Support Now Available"
Solution Supports USB, USB PD and DisplayPort on Type-C and is Expandable to Future Protocols
MOUNTAIN VIEW, Calif., May 18, 2017 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS) today announced that ASIX Electronics Corporation has adopted Synopsys’ USB Type-C™ Subsystem Verification Solution for USB, USB Power Delivery and DisplayPort, including subsystem test suites and automated testbench generation. USB Type-C is being rapidly adopted as a signature feature for next-generation mobility and consumer electronics devices. Synopsys’ Subsystem Verification Solution enables ASIX to design next-generation LAN ICs with increased productivity for accelerated verification closure.
“Our latest SuperSpeed USB-to-LAN IC is an … Read More → "ASIX Adopts Synopsys’ USB Type-C Subsystem Verification Solution"
Integrated solutions based on CommAgility’s LTE software and hardware
Loughborough, UK, and Tokyo, Japan, May 18th, 2017 – CommAgility, a Wireless Telecom Group company (NYSE MKT: WTT), announces its software and hardware products have been chosen by IDY Corporation of Tokyo, Japan, for a research project to advance 4G and 5G small cell technology.
IDY is licensing CommAgility’s SmallCellPHY and SmallCellSTACK software, which provide a complete LTE Physical Layer and LTE Protocol Stack for small cell eNodeB products. CommAgility has integrated the software onto its AMC-K2L-RF2 ARM- and DSP-based processing card, which includes two … Read More → "CommAgility and IDY cooperate to develop 4G and 5G small cell technology"
