News – Page 1206 – EEJournal

Silicon Designs Expands MEMS Capacitive Accelerometer and LCC/JCC Chip Offerings for Automotive Testing

July 14, 2017

July 12, 2017 – Kirkland, Washington, USA – The 100% veteran owned and U.S.-based Silicon Designs, Inc.(www.silicondesigns.com), industry experts in the design, development and manufacture of highly rugged industrial-grade MEMS capacitive accelerometer chips and modules, today announced the recent expansion of its offerings for automotive testing, to include six new high-performance and low-cost model series, as well as enhanced application suitability.

Since 1983, the team … Read More → "Silicon Designs Expands MEMS Capacitive Accelerometer and LCC/JCC Chip Offerings for Automotive Testing"

When it Comes to High Performance: 16 Cores on 6U VMEbus with Intel Xeon D

July 14, 2017

Intel Xeon D-1500, up to 16 cores
Up to 32 GB DDR4 DRAM soldered, with ECC
64-bit VMEbus master and slave interfaces
Front I/O: 3 Gb Ethernet, 2 USB 3.0, 2 COMs
Rear I/O: 2 Gb Ethernet
1 PMC/XMC slot
Trusted Platform Module (TPM)

BLUE BELL, Pa. July, 2017. The new multicore SBC A25 from MEN offers up to 16 independent CPU cores, a variety of I/O options and an FPGA-based VMEbus interface. The board is already used by the Swiss research institute CERN in the world’s largest particle … Read More → "When it Comes to High Performance: 16 Cores on 6U VMEbus with Intel Xeon D"

efabless Launches Open Source Hardware Development Framework for IC Designs

Chiplicity Offers Complete Flow to Design, Verify, Validate, Prototype Mixed-Signal ASICs

July 14, 2017

SAN JOSE, CALIF. –– July 13, 2017 –– efabless corporation, an online design platform and marketplace for community-developed intellectual property (IP) and integrated circuits (ICs), today introduced Chiplicity, an open source framework for community members to create, share, make derivatives of and commercialize mixed-signal ICs.

“Chiplicity is a first of its kind and extends the efabless electronics community engineering concept from IP to ICs,” affirms Mohamed Kassem, efabless’ co-founder and chief technology officer. “We make chip design and productizing chips simple and broadly accessible. That’s why we call it Chip-licity.”
efabless developed Chiplicity as a development kit for integrated … Read More → "efabless Launches Open Source Hardware Development Framework for IC Designs"

XMOS acquires Setem Technologies, Inc., to drive the development of next generation voice interfaces

Acquisition confirms XMOS as a leading vendor of voice interfacing solutions.

July 14, 2017

BRISTOL, UK — JULY 10th, 2017—XMOS Ltd (www.xmos.com), a leading supplier of voice solutions for IoT products, today announced that it has completed the acquisition of Setem Technologies, Inc., (www.setemtech.com) the pioneer of Advanced Blind Source Signal Separation technology. Setem’s patented algorithms enable consumer devices to focus on specific voice or conversation within a crowed audio environment to achieve optimized input into speech recognition systems.

“The acquisition of Setem allows us to extend the development and deployment of world-leading algorithms capable of driving the rapid adoption of voice user interfaces. The Setem team … Read More → "XMOS acquires Setem Technologies, Inc., to drive the development of next generation voice interfaces"

VadaTech announces the AMC583 and FMC250

July 14, 2017

Henderson, NV – July 13, 2017 – VadaTech, a leading manufacturer of integrated systems, embedded boards, enabling software and application-ready platforms, announces the AMC583 dual FMC+ carrier and FMC250 ADC/DAC FMC+ module. By increasing the number of SERDES lanes available, FMC+ carriers and modules support higher I/O bandwidth, making improved use of the latest JESD204B-enabled signal conversion products.

The AMC583 is an FPGA Dual FMC+ Carrier with Kintex UltraScale™ XCKU115 and P2040. The double-module AMC provides a very capable I/O processing engine, with a large UltraScale™ FPGA coupled to two FMC+ sites and supported by an on-board … Read More → "VadaTech announces the AMC583 and FMC250"

New 3-D chip combines computing and data storage

Advance points toward new generation of computers for coming superstorm of data.

July 13, 2017

CAMBRIDGE, Mass. — As embedded intelligence is finding its way into ever more areas of our lives, fields ranging from autonomous driving to personalized medicine are generating huge amounts of data. But just as the flood of data is reaching massive proportions, the ability of computer chips to process it into useful information is stalling.

Now, researchers at Stanford University and MIT have built a new chip to overcome this hurdle. The results are published today in the journal Nature, by lead author Max Shulaker, an assistant professor of electrical engineering and computer science at MIT. … Read More → "New 3-D chip combines computing and data storage"

VPG Foil Resistors Announces Ultra-High Precision Military and Space Grade Resistors for High-Performance Current Sensing within Mission-Critical Applications

July 13, 2017

July 12, 2017 – Malvern, Pa – The VPG Foil Resistors product group of Vishay Precision Group (NYSE: VPG) (www.vpgfoilresistors.com), manufacturers of the industry’s most precise and stable precision resistors, today introduced the Model 303337 ultra-high precision military and space-grade resistor, offering high-performance current sensing within mission-critical applications.

The Model 303337 produces a highly precise voltage that is directly proportional to measured current levels, with significantly reduced … Read More → "VPG Foil Resistors Announces Ultra-High Precision Military and Space Grade Resistors for High-Performance Current Sensing within Mission-Critical Applications"

RS Components announces winners of Hackster community contest for IOT2020 open gateway design

Global competition provided students, makers and budding engineers opportunity to develop innovative applications for flexible and open IoT gateway

July 13, 2017

OXFORD, UK, 13 July 2017 – RS Components (RS), the trading brand of Electrocomponents plc (LSE:ECM), the global distributor for engineers, has announced the winners of the Hackster community design contest based on the SIMATIC IOT2020 industrial IoT (Internet of Things) gateway, (http://uk.rs-online. … Read More → "RS Components announces winners of Hackster community contest for IOT2020 open gateway design"

Micro-Power Voltage Detector from Diodes Incorporated Monitors Power Supplies in Computers and Digital Systems

July 13, 2017

Plano, Texas – July 13th, 2017 – Designed to support the supervisory circuits of microprocessors and microcontrollers, the APX803L micro-power voltage detector introduced by Diodes Incorporated allows accurate monitoring of voltage levels and will generate a reset signal whenever a supply rail falls below a defined threshold. This function is required by many systems, including computers and communications equipment, but particularly portable battery-powered devices. The APX803L’s low quiescent current also makes it very attractive when appliances like televisions are operating in standby mode.

Offered in a … Read More → "Micro-Power Voltage Detector from Diodes Incorporated Monitors Power Supplies in Computers and Digital Systems"

PLAT4M Matures Three Silicon Photonic Platforms

Accelerates Commercialization of Technology by Linking the Silicon Photonic Ecosystem

July 13, 2017

GRENOBLE, France – July 13th, 2017 – Leti today announced that the European FP7 project PLAT4M has now been completed with results that exceeded expectations.

Si photonics has long been expected to bring substantial breakthroughs in very high speed data communications, telecommunications and supercomputing. In addition, it is one of the most promising industrial-production candidates because of its potential for large-scale and low-cost production capability in existing CMOS foundries.

The European Commission launched the 15-member Read More → "PLAT4M Matures Three Silicon Photonic Platforms"

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