News – Page 1201 – EEJournal

DVCon U.S. 2018 Announces Call for Extended Abstracts & Panel Proposals

July 27, 2017

Louisville, CO – July 27, 2017 — The 2018 Design and Verification Conference and Exhibition United States (DVCon U.S.), sponsored by Accellera Systems Initiative, is now accepting extended abstract and panel proposals for its conference to be held February 26-March 1, 2018 at the DoubleTree Hotel in San Jose, California.

“DVCon U.S., now in its 30th year, continues to be the ‘must-attend’ conference for practicing design and verification engineers and engineering management,” stated Dennis Brophy, DVCon U.S. 2018 General Chair. “The DVCon U.S. Steering Committee crafts the industry’s most compelling technical program … Read More → "DVCon U.S. 2018 Announces Call for Extended Abstracts & Panel Proposals"

New Ceramic Chip Inductors Provide the Industry’s Highest Q in an 0805 Package

July 26, 2017

Cary, IL, USA — Coilcraft’s new Read More → "New Ceramic Chip Inductors Provide the Industry’s Highest Q in an 0805 Package"

Maxim’s Dual Channel Transceiver Adopted by Omron for IO-Link Sensor Applications

Intelligent sensors enabled by MAX14827A reduce maintenance and increase uptime with continuous diagnostics and monitoring

July 26, 2017

San Jose, CA and Tokyo, Japan—July 25, 2017—Maxim Integrated Products, Inc. (NASDAQ：MXIM) announced that its MAX14827A dual IO-Link^® transceiver has been adopted by Omron Corporation. The high-performing device from Maxim, which utilizes IO-Link sensors to reduce maintenance and increase uptime, provides continuous diagnostics and monitoring at Omron’s customers’ production sites. It dissipates > 50% less heat than other solutions and is the smallest solution available.

Find details regarding MAX14827A ›
Read More → "Maxim’s Dual Channel Transceiver Adopted by Omron for IO-Link Sensor Applications"

4D Systems adds smart widgets editor tool and smart objects to Workshop4 PRO GUI development tool

July 26, 2017

Sydney, Australia: 4D Systems today announced the latest version of its graphical intelligent display integrated development environment (IDE), Workshop4 PRO.

Workshop4 PRO enhances the standard features of the base version of the Workshop4 IDE with options that extend productivity for developing advanced GUIs for embedded applications. The Workshop4 IDE features four different development environments¹ that provide an integrated editor, compiler and linker toolchain from which to create application code and incorporate graphical objects for the complete range of 4D Systems’ display modules and processors.

This latest release of Workshop4 PRO adds a new smart widgets … Read More → "4D Systems adds smart widgets editor tool and smart objects to Workshop4 PRO GUI development tool"

MediaTek Standardizes on Synopsys’ HAPS-80 Prototyping System

HAPS-80 Delivers 2X Performance and 2X Capacity Compared to Prior Generation

July 26, 2017

MOUNTAIN VIEW, Calif., July 26, 2017 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS) today announced that MediaTek, a leading fabless semiconductor company, has adopted Synopsys’ HAPS^®-80 prototyping system, part of the Verification Continuum™ Platform, for their broad portfolio of next generation system-on-chips (SoCs). Verification Continuum is built from Synopsys’ market-leading and fastest verification … Read More → "MediaTek Standardizes on Synopsys’ HAPS-80 Prototyping System"

Newark element14 adds new FLIR ETS320 to its Test & Measurement Portfolio

New FLIR camera provides hands-free, sensitive thermal imaging for electronics testing in the Laboratory

July 26, 2017

Chicago, United States, 26 July 2017 – Read More → "Newark element14 adds new FLIR ETS320 to its Test & Measurement Portfolio"

Cadence Announces Tensilica HiFi 3z DSP Architecture for Latest Mobile and Home Entertainment Applications

HiFi 3z DSP provides more than 1.3X better voice and audio processing performance than its industry-leading HiFi 3 DSP predecessor

July 26, 2017

SAN JOSE, Calif., July 25, 2017—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the Cadence® Tensilica® HiFi 3z DSP IP core for system-on-chip (SoC) designs targeted for the latest mobile and home entertainment applications, including smartphones, augmented reality (AR)/3D goggles, digital TVs and set-top boxes (STBs). The new HiFi 3z architecture offers more than 1.3X better voice and audio processing performance than its predecessor, the HiFi 3 DSP, which leads the industry in the number of audio DSP cores shipped. For more information on the Tensilica HiFi 3z DSP, … Read More → "Cadence Announces Tensilica HiFi 3z DSP Architecture for Latest Mobile and Home Entertainment Applications"

Feature-Rich Giant Gecko Microcontrollers Help Developers Tackle Complex IoT Applications

Silicon Labs’ New EFM32GG11 Gecko Family Offers the Most Advanced Capabilities and Largest Memory Footprint in the Low-Power MCU Market

July 25, 2017

AUSTIN, Texas – July 24, 2017 – Silicon Labs (NASDAQ: SLAB) has expanded its energy-friendly EFM32® Gecko portfolio with industrial-strength microcontrollers (MCUs) delivering higher performance, more features and lower power. The new EFM32GG11 Giant Gecko MCU family offers the most advanced feature set available in the low-power MCU market, targeting smart metering, asset tracking, industrial/building automation, wearables and personal medical applications. Giant Gecko MCUs combine peak 72 MHz processing performance, large memory options, peripherals and hardware accelerators, and comprehensive software tools including the industry-leading Micrium® OS.

Internet of Things (IoT) applications are growing increasingly complex, driving the need for multiple … Read More → "Feature-Rich Giant Gecko Microcontrollers Help Developers Tackle Complex IoT Applications"

Synopsys Launches Complete HBM2 IP Solution Offering More Than 300 GB/s Bandwidth for Graphics and High-Performance Computing SoCs

New DesignWare HBM2 Controller, PHY and Verification IP Enables High-Bandwidth, Power-Efficient Systems

July 25, 2017

MOUNTAIN VIEW, Calif., July 25, 2017 /PRNewswire/ —

Highlights:

Complete HBM2 IP solution, including PHY, controller and verification IP, reduces integration risk while minimizing time-to-market
DesignWare IP implementation supports data rates up to 2400 Mb/s, which is 20 percent faster than the JEDEC standard specification
Pseudo-channel mode doubles the number of channels, resulting in smaller fetch size and higher performance
The HBM2 IP is based on Synopsys’ silicon-proven HBM and DDR4 IP that has been integrated into hundreds of SoC designs

Synopsys, Inc. (Nasdaq: SNPS) today introduced its complete … Read More → "Synopsys Launches Complete HBM2 IP Solution Offering More Than 300 GB/s Bandwidth for Graphics and High-Performance Computing SoCs"

Cavium Expands XPliant® Product Portfolio with 10GbE and 25GbE Optimized Programmable Switch Devices

XP70 family addresses highest port count segment of data center switch market

July 25, 2017

SAN JOSE, CA – July 25, 2017 – Cavium, Inc. (NASDAQ: CAVM), a leading provider of semiconductor products that enable secure and intelligent processing for enterprise, data center, cloud, wired and wireless networking, announced the availability of the new XP60 and XP70 families of 10GbE/25GbE optimized programmable Ethernet switches. Targeted at the largest segment of the data center market, the XP70 family of programmable Ethernet switch devices scale from 1Tbps to 1.8Tbps and provides cost-effective seamless 1GBASE-T to 10GBASE-T and 10GbE to 25GbE access connectivity upgrades for enterprise, data center, and carrier networks with support for 40GbE/100GbE uplink connectivity.