News – Page 1201 – EEJournal

Easily develop and pair intuitive automotive infotainment systems with one tap using TI’s NFC transponder

December 2, 2015

DALLAS (Dec. 2, 2015) – Enabling developers to bring the ease of NFC to automotive infotainment systems, Texas Instruments (TI) (NASDAQ: TXN) today announced the industry’s first dynamic dual interface NFC transponder with Q100 automotive qualification.

The RF430CL330H-Q1 transponder enables simple secure pairing (SSP) using the Out of Band (OOB) association model for Bluetooth®, Bluetooth Smart and Wi-Fi® between an NFC-enabled smartphone or tablet and an automotive infotainment system. … Read More → "Easily develop and pair intuitive automotive infotainment systems with one tap using TI’s NFC transponder"

Cadence and Spreadtrum Collaborate on Virtual Reference Design Kit to Reduce Customers? Design Cycle by Up to 12 Weeks

December 2, 2015

SAN JOSE, Calif., December 2, 2015?Cadence Design Systems, Inc. (NASDAQ: CDNS) and Spreadtrum today announced they have developed a virtual reference design kit specific to Spreadtrum’s SC9830A ( http://www.spreadtrum.com/en/SC9830A.html ) quad-core system-on-chip (SoC) platform requirements. The availability of the kit enables their joint customers to accelerate their mobile product and application design cycles by up to 12 weeks, including time spent on schematic design, PCB design and power-aware signal integrity (SI) and power integrity (PI) signoff simulation.

This virtual reference design kit is intended to guide engineers as they design the Spreadtrum … Read More → "Cadence and Spreadtrum Collaborate on Virtual Reference Design Kit to Reduce Customers? Design Cycle by Up to 12 Weeks"

Keysight Technologies’ UXM Enables 600 Mbps Data Throughput Testing with 4×4 DL MIMO, Carrier Aggregation, Advanced Integrated Channel Emulation

December 2, 2015

Highlights:

New UXM release enables 4×4 MIMO data throughput test
UXM adds TM9 and spatial channel models for realistic device performance verification

SANTA ROSA, Calif., Dec. 2, 2015 – Keysight Technologies, Inc. (NYSE: KEYS) today announced the successful verification of category 12 data rates with just two component carriers using the UXM’s new downlink 4×4 MIMO capabilities. Using two 20 MHz component carriers, 64 QAM downlink modulation, and 4×4 downlink MIMO techniques, Keysight demonstrated 600 Mbps downlink … Read More → "Keysight Technologies’ UXM Enables 600 Mbps Data Throughput Testing with 4×4 DL MIMO, Carrier Aggregation, Advanced Integrated Channel Emulation"

Renesas Electronics Delivers R-Car H3, First SoC from the Third-Generation R-Car Automotive Computing Platform for the Autonomous-Driving Era

December 2, 2015

Düsseldorf, December 2, 2015 – Renesas Electronics, a premier supplier of advanced semiconductor solutions, today unveiled the third-generation R-Car, an automotive computing platform solution for driving safety support systems and in-vehicle infotainment systems. The new R-Car H3 System-on-Chip (SoC), the first member of the third-generation R-Car, delivers CPU performance, image recognition processing, ISO 26262 (ASIL-B) compliance, and a system in package (SiP) with external memory to enable a wide range of automotive applications.

The R-Car H3 realizes powerful automotive computing performance exceeding that of the predecessor R-Car H2. This enables system … Read More → "Renesas Electronics Delivers R-Car H3, First SoC from the Third-Generation R-Car Automotive Computing Platform for the Autonomous-Driving Era"

EnSilica and Express Logic collaborate to bring popular ThreadX RTOS to eSi-RISC processor cores

December 2, 2015

Wokingham, UK and San Diego, USA – 2^ndDecember 2015. EnSilica, a leading independent provider of semiconductor IP and IC design services, and Express Logic, the worldwide leader in royalty-free real-time operating systems (RTOSes), have collaborated to port Express Logic’s popular ThreadX^®real-time operating system (RTOS) to EnSilica’s eSi-RISC family of silicon-proven, highly configurable embedded processor cores.

ThreadX ease-of-use is facilitated by its intuitive, highly functional API and advanced, instant-on RTOS features. ThreadX features efficient … Read More → "EnSilica and Express Logic collaborate to bring popular ThreadX RTOS to eSi-RISC processor cores"

New Automotive Multi-Regulators from STMicroelectronics Enable Smaller and Cheaper Car-Infotainment Systems

December 2, 2015

Geneva, December 2, 2015 – A new series of highly integrated automotive-grade power-management devices from STMicroelectronics incorporates multiple voltage regulators on a single die, allowing manufacturers of car-infotainment systems to reduce the cost and size of their products. The first member of the new series, the L5963, integrates two switching regulators for step-down DC-DC conversion, a linear low-dropout regulator, and a high-side driver.

The L5963 is made using ST’s state-of-the-art BCD8s Automotive process technology with Deep Trench … Read More → "New Automotive Multi-Regulators from STMicroelectronics Enable Smaller and Cheaper Car-Infotainment Systems"

Xilinx Launches Vivado Design Suite HLx Editions, Bringing Ultra High Productivity to Mainstream System & Platform Designers

December 1, 2015

SAN JOSE, Calif., Dec. 1, 2015 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) today announced the Vivado® Design Suite HLx Editions, enabling a new ultra high productivity approach for designing All Programmable SoCs, FPGAs, and the creation of reusable platforms. These new HLx Editions include HL System Edition, HL Design Edition and HL WebPACK™ Edition. All HLx Editions include Vivado High-Level Synthesis (HLS) including C/C++ libraries, Vivado IP Integrator (IPI), LogicCORE™ IP subsystems, … Read More → "Xilinx Launches Vivado Design Suite HLx Editions, Bringing Ultra High Productivity to Mainstream System & Platform Designers"

AVX Releases a New Series of Medical Grade Tantalum Capacitors for Implantable & Life Support Applications

December 1, 2015

FOUNTAIN INN, S.C. (December 1, 2015) – AVX Corporation, a leading manufacturer of passive components and interconnect solutions, has released its new TBC Series HRC6000 medical implantable grade tantalum capacitors. Delivering lower DC leakage (DCL) values than any competitive offering — down to 0.0025CV or 25% of typical industry limits — and requiring significantly less voltage de-rating than the standard 50% recommendation for solid tantalum capacitors — as low as 20% for filtering and 0% for pacing, hold-up, and charging — the series is ideal for medical implantable and life support applications.

TBC Series … Read More → "AVX Releases a New Series of Medical Grade Tantalum Capacitors for Implantable & Life Support Applications"

Symtavision collaboration with iSYSTEM delivers improved tool integration and round-trip workflow

December 1, 2015

Schwabhausen and Braunschweig, Germany – December 1, 2015. Symtavision, the global leader in timing analysis solutions for planning, optimizing and verifying embedded real-time systems, has extended its collaboration with iSYSTEM, a leading independent provider of embedded software debugging, analysis and test tools, resulting in the announcement of significantly improved integration between Symtavision’s SymTA/S and TraceAnalyzer timing design tools and iSYSTEM’s debug and trace tools and a round-trip workflow. The improved integration will better ensure the safety and reliability of automotive real-time software at the same time as speeding up development and reducing costs.

The collaboration delivers Symtavision … Read More → "Symtavision collaboration with iSYSTEM delivers improved tool integration and round-trip workflow"

CEA-Leti to Share Insights into Post-7-nanometer Technologies At Workshop Prior to IEDM in Washington, D.C.

December 1, 2015

GRENOBLE, France – Dec. 1, 2015 – As part of its ongoing mission to help its industrial partners implement competitive, leading-edge semiconductor capabilities, CEA-Leti will present new details about its R&D efforts in post-7-nanometer CMOS device architectures, materials and computing-system paradigms during IEDM 2015.

“Our tradition is to take a broad, production-oriented approach to technology development, to reduce risks and accelerate the transition into high-volume manufacturing, and this is our approach for the post-7nm realm,” said Olivier Faynot, manager of Leti’s Microelectronic Section. “Our interdisciplinary exploration and analysis of upstream factors, like neuromorphic computing, gives us a … Read More → "CEA-Leti to Share Insights into Post-7-nanometer Technologies At Workshop Prior to IEDM in Washington, D.C."

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