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Arduino unveils two new boards delivering easy-to-use connectivity in IoT project development

Designed to make the IoT seamless, new boards deliver embedded LoRa and GSM connectivity, enabling quick development of devices and applications
September 25, 2017

TURIN, ITALY – September 25, 2017: Arduino has unveiled the new Arduino MKR WAN 1300 (LoRa) and the Arduino MKR GSM 1400, two new boards that are designed to offer a practical and cost-effective solution for developers, makers and enterprises, enabling them to quickly add connectivity to their projects and ease the development of battery-powered IoT edge applications.

The new Arduino MKR WAN 1300 delivers LoRa low-power WAN connectivity, and the Arduino MKR GSM 1400 adds global 2G/3G communications capability. Both of the highly compact boards feature dimensions of only 67.64 x 25mm, … Read More → "Arduino unveils two new boards delivering easy-to-use connectivity in IoT project development"

Pixus Announces New Sizes for Its RiCase Line of Instrumentation Cases

September 25, 2017

Waterloo, Ontario  —  Sept 25, 2017 –  Pixus Technologies, a provider of embedded computing and enclosure solutions,  now offers the RiCase Premier line of modular electronics enclosures in 3U height at a 300mm depth and a 4U height at a 420mm depth.  The new sizes expand the range of 10.5” and 19” wide instrumentation cases, offering more standard choices.

The Pixus RiCase series of instrumentation cases combine a rugged design and an attractive all-metal design.   The corners are rounded for aesthetics, mechanical protection, and to prevent snags/injuries.  They also have the option of securely stacking on top of … Read More → "Pixus Announces New Sizes for Its RiCase Line of Instrumentation Cases"

GLOBALFOUNDRIES Unveils Vision and Roadmap for Next-Generation 5G Applications

Technology platforms are uniquely positioned to enable a new era of ‘connected intelligence’ with the transition to 5G
September 25, 2017

Santa Clara, Calif., September 20, 2017 — GLOBALFOUNDRIES today announced its vision and roadmap for a sweeping range of technology platforms designed to help customers transition to next-generation 5G wireless networks. The company offers the industry’s broadest set of technology solutions for a range of 5G applications, from integrated mmWave front end modules (FEMs), transceivers, and baseband chips to high-performance application processors for mobile and networking.

As the world becomes more reliant on digital information, connectivity is expected to drive an enormous amount of growth, with an estimated Read More → "GLOBALFOUNDRIES Unveils Vision and Roadmap for Next-Generation 5G Applications"

GLOBALFOUNDRIES Announces Availability of mmWave and RF/Analog on Leading FDX™ FD-SOI Technology Platform

Technology solution delivers ‘connected intelligence’ to next generation high-volume wireless and IoT applications with lower power and significantly reduced cost
September 25, 2017

Santa Clara, Calif., September 20, 2017 — GLOBALFOUNDRIES today announced the availability of its radio frequency/analog PDK (22FDX®-rfa) solution for next-generation wireless and IoT chipsets and its mmWave PDK (22FDX®-mmWave) solution for emerging high-volume applications such as 5G, automotive radar, WiGig, SatComm and wireless backhaul.

Both solutions are based on the company’s 22nm FD-SOI platform, which provides a combination of both high performance RF and mmWave and high density digital to support integrated single chip system solutions. The technology offers the highest fT and fmax at both low and high current densities for applications that require … Read More → "GLOBALFOUNDRIES Announces Availability of mmWave and RF/Analog on Leading FDX™ FD-SOI Technology Platform"

GLOBALFOUNDRIES Delivers 8SW RF SOI Technology for Next-Generation Mobile and 5G Applications

Advanced 8SW 300mm SOI technology enables cost-effective, high-performance RF front-end modules for 4G LTE mobile and sub-6GHz 5G applications
September 22, 2017

Santa Clara, Calif., Sept. 20, 2017 — GLOBALFOUNDRIES today announced the availability of the industry’s first RF SOI foundry solution manufactured on 300mm wafers. The company’s most advanced RF SOI technology, 8SW SOI, delivers significant performance, integration and area advantages in front-end modules (FEMs) for 4G LTE and sub-6 GHz 5G mobile and wireless communication applications.

GF’s new 8SW technology offers a low cost, low power, highly flexible solution with superior switching, low-noise amplifiers (LNA) and logic processing capabilities on a 300mm manufacturing line. The technology features up to 70 percent power reduction compared to the … Read More → "GLOBALFOUNDRIES Delivers 8SW RF SOI Technology for Next-Generation Mobile and 5G Applications"

Imagination reveals PowerVR Neural Network Accelerator (NNA) with 2x the performance and half the bandwidth of nearest competitor

September 22, 2017
  • First dedicated hardware solution with flexible bit depth support from 16-bit down to 4-bit
  • Lowest bandwidth Neural Network (NN) solution
  • Architected to support multiple operating systems, including Linux and Android

LONDON, UK – 21st September, 2017 – Imagination Technologies (IMG.L) reveals its complete, standalone hardware IP neural network accelerator, with industry-leading area efficiency delivered by a specialized PowerVR architecture implementation for … Read More → "Imagination reveals PowerVR Neural Network Accelerator (NNA) with 2x the performance and half the bandwidth of nearest competitor"

GLOBALFOUNDRIES Delivers Custom 14nm FinFET Technology for IBM Systems

September 22, 2017

Sep 20, 2017

Jointly developed 14HP process is world’s only technology that leverages both FinFET and SOI

Santa Clara, Calif., Sept. 20, 2017 – GLOBALFOUNDRIES is now delivering in volume its 14nm High Performance (HP) technology that will enable IBM’s next-generation of processors for server systems. The jointly developed 14HP process is specifically designed to deliver the ultra-high performance and … Read More → "GLOBALFOUNDRIES Delivers Custom 14nm FinFET Technology for IBM Systems"

Imagination’s new PowerVR GPUs enable chip companies and OEMs to create the best possible user experience in cost-sensitive devices

PowerVR Series9XE and 9XM GPUs maintain fillrate density leadership and provide significant boost in performance density
September 22, 2017

LONDON, UK – 21st September, 2017 – Imagination Technologies (IMG.L) announces a new generation of PowerVR GPUs that raises the bar on graphics and compute in cost-sensitive devices, letting SoC vendors achieve a significant boost in performance with no impact on silicon area versus previous generation GPUs.

With the new PowerVR Series9XE and Series9XM GPUs, SoC vendors and OEMs can minimize costs and power consumption while ensuring the best possible user experience for gaming and GUI in devices such … Read More → "Imagination’s new PowerVR GPUs enable chip companies and OEMs to create the best possible user experience in cost-sensitive devices"

Synopsys Design Platform Certified by GLOBALFOUNDRIES for 22nm FD-SOI Process Technology

Certification Enables Optimized Implementation and Predictable Signoff
September 22, 2017

MOUNTAIN VIEW, Calif., Sept. 20, 2017 /PRNewswire/ —

Highlights:

TEWS TECHNOLOGIES Launches PMC with 16 or 8 Channel ADC, 8 or 4 Channel DAC and 14 Channel Digital I/O

September 22, 2017

Halstenbek, Germany – 21st September, 2017: TEWS announced today a standard single-wide PCI Mezzanine Card (PMC) compatible module designed for industrial, COTS, and transportation applications. The TPMC532 provides 16 or 8 channels of simultaneous sampling true differential bipolar 16-bit analog input, 8 or 4 channels of simultaneous update single-ended unipolar/bipolar 16-bit analog output and 14 channels of tri-state 5V-tolerant TTL digital input/output.

All signals are accessible through a Mini D Ribbon (MDR68) type front I/O connector.  The PMC-Connectors P11 and P12 provide … Read More → "TEWS TECHNOLOGIES Launches PMC with 16 or 8 Channel ADC, 8 or 4 Channel DAC and 14 Channel Digital I/O"

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