News – Page 1178 – EEJournal

General Micro Systems Launches Industry’s First Enterprise-Class “Mobile Battlefield Data Center” in Extremely Rugged and Compact Chassis

Based on the Intel Xeon® E5 server CPU, the S402-LC/SW’s ultra-efficient engineering design yields the highest performance with the greatest efficiencies in size, weight, and power (SWaP) in a small, cost-effective, conduction-cooled system

October 5, 2017

RANCHO CUCAMONGA, Calif., October 5, 2017 – General Micro Systems Inc. (GMS) today announced the S402-LC/SW, a fully sealed, low-cost, and small-size rugged conduction-cooled family of servers for harsh military/defense/aerospace environments as well as industrial and commercial platforms. Based on Intel’s highest-performing Xeon^® E5 server processor, the self-contained system comprises a server, optional router and multi-port switch plus network attached storage (NAS) that provides extremely high performance and reliability in a fully ruggedized, conduction-cooled system about the size of a 12-inch laptop.

Synopsys Delivers Industry’s First USB 3.2 Verification IP and Test Suite for Higher Performance USB Designs

Native SystemVerilog USB VIP Features Built-in Coverage, Verification Plan, Protocol-Aware Debug and Source Code Test Suites

October 5, 2017

MOUNTAIN VIEW, Calif., Oct. 5, 2017 /PRNewswire/ — Synopsys, Inc. (NASDAQ: SNPS) today announced the availability of the industry’s first verification IP (VIP) and UVM source code test suite to support the latest USB 3.2 specification. USB 3.2 enables new hosts and devices with USB Type-C™ to be designed as multi-lane solutions, allowing for up … Read More → "Synopsys Delivers Industry’s First USB 3.2 Verification IP and Test Suite for Higher Performance USB Designs"

New Stepper Motor Drivers from Toshiba Improve Motion Accuracy and Motor Efficiency

October 5, 2017

SAN JOSE, Calif.–Toshiba America Electronic Components, Inc. (Read More → "New Stepper Motor Drivers from Toshiba Improve Motion Accuracy and Motor Efficiency"

Xilinx Delivers Zynq UltraScale+ RFSoC Family Integrating the RF Signal Chain for 5G Wireless, Cable Remote-PHY, and Radar

Silicon Shipped to Multiple Customers, Early Access Program Available Now

October 5, 2017

SAN JOSE, Calif., Oct. 3, 2017 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) today announced delivery of its Zynq® UltraScale+™ RFSoC family, a breakthrough architecture integrating the RF signal chain into an SoC for 5G wireless, cable Remote-PHY, and radar. Based on 16nm UltraScale+ MPSoC architecture, the All Programmable RFSoCs monolithically integrate RF data converters for up to 50-75 percent system power and footprint reduction, and soft-decision Forward Error Correction (SD-FEC) cores to meet 5G and DOCSIS 3.1 standards. With silicon samples already shipping to multiple customers, the early access program for the Zynq UltraScale+ RFSoC … Read More → "Xilinx Delivers Zynq UltraScale+ RFSoC Family Integrating the RF Signal Chain for 5G Wireless, Cable Remote-PHY, and Radar"

Imec Leverages the Power of Silicon Fabrication to Create Innovative Neural Probe Demonstrator with Unprecedented Electrode Density

October 4, 2017

LEUVEN (Belgium) & SAN DIEGO (USA), Oct 3, 2017 – Imec, the world-leading research and innovation hub in nanoelectronics and digital technologies, today announced at its Imec Technology Forum (ITF) Health event, that is has designed and fabricated a demonstrator of a neural probe with unprecedented electrode density within the framework Neuroseeker, a large-scale EU-project. Designed and fabricated in silicon chip technology, the probe is suitable for breakthrough bio-interfaces and implants that will shape the future of neuroscience. With hundreds of electrodes capable of contacting and reading out single neurons, this probe incorporates innovations that point the way to a better understanding … Read More → "Imec Leverages the Power of Silicon Fabrication to Create Innovative Neural Probe Demonstrator with Unprecedented Electrode Density"

Rugged 3U VPX Processor with 10G Ethernet

Concurrent Technologies announces network ready processor board

October 4, 2017

Concurrent Technologies latest product combines high performance processing with multiple 10 Gigabit connections for deployment in computer applications requiring higher bandwidth local area network connectivity.

The single slot BA 1TR/501 features a 4-core Intel^® Xeon^® processor E3-1505M v5 with 16GB of DDR4 ECC DRAM and a rich assortment of I/O interfaces including dual 10 Gigabit and dual Gigabit Ethernet connections. The product is designed to suit the growing number of high performance command, control, communicate and compute applications in the military and aerospace markets that need matching network and processor capacity.

< … Read More →

Mercury Systems Introduces Industry’s First COTS Safety-Certifiable OpenGL Graphics Library for Intel Atom Processor Families

Mercury’s BuiltSAFE OpenGL Library with Green Hills INTEGRITY-178 tuMP Real-Time Operating System Delivers the Highest Level of Functional Safety for Graphics Intensive Applications

October 4, 2017

ANDOVER, Mass. and SANTA BARBARA, Calif. – Oct. 3, 2017 – Mercury Systems, Inc. (NASDAQ: MRCY, Read More → "Mercury Systems Introduces Industry’s First COTS Safety-Certifiable OpenGL Graphics Library for Intel Atom Processor Families"

Telit Teams with Wind River to Accelerate Industrial IoT Adoption

October 4, 2017

London, October 3, 2017 – Telit, a global enabler of the Internet of Things (IoT), today announced it is collaborating with Wind River®, an Intel®company, to accelerate Industrial IoT (IIoT) adoption. Through this relationship, Telit and Wind River are reducing the complexities of IoT device management, helping companies quickly and securely realize the full solution benefits of IIoT.

Wind River is utilizing Telit’s IoT platform technology for its device management platform. The Read More → "Telit Teams with Wind River to Accelerate Industrial IoT Adoption"

Technology Industry Leaders Release National Strategy to Maximize U.S. Economic and Societal Benefits from the Internet of Things

October 3, 2017

WASHINGTON – Today technology industry leaders Intel, Samsung, ITI, SIA and the Chamber Technology Engagement Center (C_TEC) released the first-of-its-kind, national Internet of Things (IoT) Strategy. These Read More → "Technology Industry Leaders Release National Strategy to Maximize U.S. Economic and Societal Benefits from the Internet of Things"

STMicroelectronics and Objenious Collaborate to Speed Connection of IoT Nodes to LoRa® Networks

October 3, 2017

Geneva, Switzerland, and Sevres, France, October 3, 2017 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and member of the board of the LoRa Alliance™, and Objenious, a founding member of the LoRa Alliance and the first carrier in France to provide a nationwide LoRa® network, are working together to accelerate the connection of Internet-of-Things (IoT) nodes to LoRa networks. ST’s development kitscertified on the Objenious network are available now, greatly reducing R&D effort and time to market in the creation of new LoRa devices.

LoRAWAN is a Low … Read More → "STMicroelectronics and Objenious Collaborate to Speed Connection of IoT Nodes to LoRa® Networks"