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New R&S ZN-Z32/33 vector network analyzer calibration solution for TVAC and multiport production testing

Rohde & Schwarz presents new vector network analyzer calibration equipment: the R&S ZN-Z32 and R&S ZN-Z33 inline calibration units. These calibration units are ideal for satellite component testing in thermal vacuum chambers (TVAC) and for multiport component testing on production lines.

Munich, October 12, 2017 – Unlike conventional automatic network analyzer calibration units, the new R&S ZN-Z32/33 inline calibration units from Rohde & Schwarz are permanently connected to the test setup. This makes them an ideal solution for test setups that require frequent … Read More → "New R&S ZN-Z32/33 vector network analyzer calibration solution for TVAC and multiport production testing"

STMicroelectronics NFC Tags among First to Be Certified for Performance and Interoperability by NFC Forum

Geneva, October 12, 2017 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced the certification of its ST25 Near Field Communication (NFC) tags by the NFC Forum, a key industry and standardization body.

ST’s NFC Forum type 4 Tag IC (ST25TA</ … Read More → "STMicroelectronics NFC Tags among First to Be Certified for Performance and Interoperability by NFC Forum"

Cadence Announces Digital and Signoff Flow Support for Body-Bias Interpolation for GLOBALFOUNDRIES 22FDX™ Process Technology

Highlights:

•       Cadence tools enable customers creating designs across vertical markets to achieve optimized power and performance on GLOBALFOUNDRIES FD-SOI process nodes
•       Cadence and GLOBALFOUNDRIES collaborate on the delivery of a 22FDX™ reference flow and PDK

SAN JOSE, Calif., October 12, 2017 — Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its digital and signoff flow, from synthesis to timing and power analysis, supports body-bias interpolation for the GLOBALFOUNDRIES 22FDX™ process technology. The Cadence® tools enable advanced-node customers across a variety of vertical markets — including automotive, … Read More → "Cadence Announces Digital and Signoff Flow Support for Body-Bias Interpolation for GLOBALFOUNDRIES 22FDX™ Process Technology"

Reduce Risk and Time to Market with Microchip’s MPLAB® Mindi™ Analog Simulator with SPICE and SIMPLIS Environments

CHANDLER, Ariz., Oct. 10, 2017 — MPLAB® Mindi™ analog simulation software, which was updated to include more models and features, is now available from Microchip Technology Inc. (NASDAQ: MCHP). The MPLAB Mindi Analog Simulator is a circuit simulation tool that now supports more than 300 Microchip analog products, with SIMetrix’s enhanced SPICE (Simulation Program with Integrated Circuit Emphasis) and SIMPLIS Technologies’ SIMPLIS (SIMulation of Piecewise LInear Systems) simulation environments. The updated Mindi analog simulation software is available as a free download by visiting:Read More → "Reduce Risk and Time to Market with Microchip’s MPLAB® Mindi™ Analog Simulator with SPICE and SIMPLIS Environments"

Railways Benefit from Mobile IP Routing at the Network Edge Through New Embedded Platform

Technical Highlights

  • Cisco-enabled mobile routing in compact, rugged system
  • On-board hardware encryption for secure data, video and voice
  • Specifically designed for railway applications, designed for EN 50155 compliance

FREMONT, Calif., October 2017 – Elma Electronic Inc. has created a railway-ready version of its popular Read More → "Railways Benefit from Mobile IP Routing at the Network Edge Through New Embedded Platform"

Silicon Labs Reference Design Simplifies Development of USB Type-C Rechargeable Battery Packs

AUSTIN, TexasOct. 9, 2017 /PRNewswire/ — Silicon Labs (NASDAQ: SLAB) has introduced a comprehensive reference design to simplify the development of USB Type-C™ rechargeable lithium ion battery packs used to power smartphones, tablets, laptops, headphones and other portable devices. The reference design includes everything developers need to create dual-role port (DRP) applications with USB Type-C power delivery (PD), accelerating the development of new USB Type-C battery packs or migrating existing … Read More → "Silicon Labs Reference Design Simplifies Development of USB Type-C Rechargeable Battery Packs"

Sandia National Laboratories Licenses Flex Logix’s Embedded FPGA IP for Multiple Products

Mountain View, Calif., October 10, 2017 – Addressing the growing industry need to use embedded FPGA technology to design chips and MCUs, Flex Logixä Technologies, Inc.,  announced today that Sandia National Laboratories has licensed its EFLX reconfigurable logic IP.  As part of their licensing agreement, Flex Logix has delivered the Gen 2 EFLX-2.5K logic core in Sandia’s proprietary 180nm process for the development of … Read More → "Sandia National Laboratories Licenses Flex Logix’s Embedded FPGA IP for Multiple Products"

Telit and Husqvarna Collaborate on Robots for Urban Park Sustainability Program

London, October 10, 2017 – Telit, a global enabler of the Internet of Things (IoT), today announced that Husqvarna is using a wireless sensor device co-developed by Telit and Wireless System Integration (WSI), an award-winning Sweden-based design house developing wireless products and systems, in their city robotic mower pilot program. Cities are using the Husqvarna mowers to collect … Read More → "Telit and Husqvarna Collaborate on Robots for Urban Park Sustainability Program"

Fujitsu Receives Order for Japan’s Fastest Supercomputer System for AI Applications

TOKYO, Oct 10, 2017 – (JCN Newswire) – Fujitsu today announced that it has received an order from the National Institute of Advanced Industrial Science and Technology (AIST) for AI Bridging Cloud Infrastructure (ABCI), which is set to become the fastest supercomputer system in Japan.

Included in the ABCI configuration will be Fujitsu’s latest x86 servers, the Fujitsu Server PRIMERGY. The system will offer a theoretical peak performance in half-precision floating point operations (a critical measure in the AI field) of 550 petaflops(1), and 37 petaflops of double-precision floating point operation performance, a conventional measure in simulation and … Read More → "Fujitsu Receives Order for Japan’s Fastest Supercomputer System for AI Applications"

New automotive-grade magnetic position sensors from ams feature PSI5 interface

Premstaetten, Austria (10 October, 2017) — ams (SIX: AMS), a leading worldwide supplier of high performance sensor solutions, today announced the launch of the AS5172A/B magnetic position sensors, which feature a two-wire PSI5 interface for fast and secure transmission of their precise rotary position measurements.

The new AS5172A and AS5172B system-on-chip (SoC) devices are 0° to 360° contactless rotary magnetic position sensors which provide absolute angle measurements in high 14-bit resolution. The sensors have been developed as SEooC devices according to the automotive safety standard ISO26262, and feature extensive on-chip self-diagnostic systems. This makes … Read More → "New automotive-grade magnetic position sensors from ams feature PSI5 interface"

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