LONDON, UK, 8 November, 2017 – RS Components (RS), the trading brand of Electrocomponents plc (LSE:ECM), the global distributor for engineers, has announced availability of several new video inspection cameras and kits from Laserliner. (Read More → "RS Components introduces new range of high-quality diagnostic inspection kits"
MOUNTAIN VIEW, Calif. and BURLINGTON, Mass., Nov. 2, 2017 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS) and Black Duck Software, Inc. have signed a definitive agreement for Synopsys to acquire privately held Black Duck, a leader in automated solutions for securing and managing open source software. The addition of Black Duck’s highly respected Software Composition Analysis solution will enhance Synopsys’ efforts in the software … Read More → "Synopsys to Enhance Software Integrity Platform with Acquisition of Black Duck Software"
LONDON, UK, 2 November, 2017 – RS Components (RS), the trading brand of Electrocomponents plc (LSE:ECM), the global distributor for engineers, has extended its portfolio of versatile development tools and equipment with a new range of Pmods™ (peripheral modules) and shields (http://uk.rs-online.com/web/p
Artesyn Embedded Technologies today announced the ADQ800 series, a new 800 watt quarter-brick isolated dc-dc converter with the high efficiency and thermal performance demanded by telecom network and data center equipment. Capable of delivering up to 70 amps output current with a single fully regulated 11.8 V output, the converters have no minimum load requirement.
The ADQ800 series … Read More → "New Artesyn 800W Quarter Brick DC-DC Converter Provides High Efficiency and Thermal Performance for Telecom, Computing and Server Equipment"
Tainan City, Taiwan – 7 November 2017. Pervasive Displays (PDi), a world leader in e-paper displays, announces its ultra-low power displays (http://www.pervasivedisplays.
Okmetic, the leading silicon wafer supplier for the sensor industry, is investing in developing its in-house production capabilities in Finland. The upgrade will enable Okmetic to provide more complex and advanced wafer structures and a platform for the development of new high-performance technological applications.
Okmetic supplies its global customers with tailored, high value-added silicon wafers for the manufacture of sensors, discrete semiconductors and analog circuits. The company’s strategy is to focus on wafers requiring high technological expertise, such as the SOI product family and specialized wafers in 150–200 mm diameter. The production line of … Read More → "Okmetic invests in high-performance wafers to enhance MEMS and sensor capabilities"
SAN JOSE, Calif. — (November 2, 2017) SEMI-MSIG’s MEMS & Sensors Executive Congress (MSEC) held November 1-2 in San Jose, CA, challenged industry executives to see beyond traditional dividing lines of human-machine interaction. MEMS and sensors were hailed as the enablers for pervasive, connected and contextually aware computing and seen as drivers for an explosion of new applications and possibilities. Securing autonomous vehicles from hackers and improving crop yields to feed the 10 billion people we will have … Read More → "MEMS & Sensors Safeguard Autonomous Cars, Boost Agricultural Productivity and Anticipate Needs"
Boston, USA – November 6, 2017: Arduino today announced the release of a rich set of new features for its Create Cloud platform (create.arduino.cc) aimed at expanding the number of Arduino supported platforms for the development of IoT applications. With this release, Arduino Create Cloud users can now program Linux® boards as if they … Read More → "Arduino upgrades its Create Cloud platform to enable the deployment of Arduino programs on Linux® based IoT devices"
SAN JOSE, Calif., November 6, 2017—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that HiSilicon, a global fabless semiconductor and IC design company, has selected the Cadence® Tensilica® Vision P6 DSP for its 10nm Kirin 970 mobile application processor, which debuted in Huawei’s new Mate 10 Series mobile phones. In deploying the Vision P6 DSP, HiSilicon added valuable imaging and vision processing capabilities to the Kirin SoC.
The high-performance Vision P6 DSP with increased math throughput and other architecture enhancements sets a new standard in imaging and computer … Read More → "HiSilicon Selects Cadence Tensilica Vision P6 DSP for its Latest Kirin 970 Mobile Application Processor"
November 2, 2017 – Morrisville, North Carolina, USA
Device Solutions Inc today announced the availability of the next generation Cellio LoRa long-range low-power wireless transceivers for wide area, long range, end-to-end monitoring and control for agriculture, cold chain, gas distribution, transportation, and many other industrial applications.
Cellio is suited for single locations as well extensive enterprise configurations where there may be upwards of millions of sensors and controls connected to equipment across the continent. Partnered with cellular carriers and back-end cloud platforms, sensor instrumentation companies, and technology core companies – full enterprise-level-solution installations can be quick, easily scaled, and … Read More → "Device Solutions Inc Launches Next Generation Cellio LoRa Transceivers for Affordable, Reliable and Scalable Wireless Remote Monitoring"
