News – Page 1151 – EEJournal

GUC Delivers 28G Multi-Standard SerDes IP

March 10, 2016

Hsinchu, Taiwan, March 10, 2016 – Global Unichip Corp. (GUC), the Flexible ASIC LeaderTM and leading analog mixed signal IP provider today announced that its 28GbpsMulti-Standard SerDes IP (28G-EMSPHY-XT), silicon-proven on TSMC’s 28nm process technology, has demonstrated compliance with IEEE 802.3bj (100GBase-KR4), CEI- 25G-LR, and CEI-28G-VSR specifications.

GUC’s new SerDes core, the latest and most advanced addition to GUC’s broad SerDes IP portfolio, features an innovative equalization architecture that … Read More → "GUC Delivers 28G Multi-Standard SerDes IP"

ZigBee Alliance Leads the Way To Smarter, More Efficient Homes, Buildings and Lighting Systems at Light + Building 2016

March 10, 2016

News Highlights:

ZigBee Alliance will share the latest in its collaboration with EnOcean Alliance to extend benefits of self-powered energy-harvesting products and applications to the global Internet of Things (IoT) and consumer markets.
Key focus will be the ZigBee 3.0 solution and its Common Applications Library that unifies the IoT by providing one comprehensive, interoperable end-to-end solution to all vertical markets.
More than 60 ZigBee Alliance members will exhibit ZigBee-certified products, as well as Built to ZigBee 3.0 standard offerings that … Read More → "ZigBee Alliance Leads the Way To Smarter, More Efficient Homes, Buildings and Lighting Systems at Light + Building 2016"

Molex Debuts Nano-Pitch I/O™ 80-Circuit Interconnect at DesignCon 2016

March 10, 2016

LISLE, IL – March 9, 2016 – At DesignCon 2016, Molex, LLC introduced the Nano-Pitch I/O™ 80-Circuit Interconnect System, which offers the highest port density (number of high-speed differential lanes) and speed (25 Gbps per lane) in the smallest package available. A multi-protocol pinout concept enables compatibility with all known SAS, SATA and PCIe protocols and provides enhanced signal integrity in an extremely compact form factor. The connector is ideal for SAS and PCI Express applications, including storage-to-controller, server-to-server, server-to-switch, switch-to-switch, and mobile/enterprise.

“With an industry-leading port density, multi-protocol application support, and … Read More → "Molex Debuts Nano-Pitch I/O™ 80-Circuit Interconnect at DesignCon 2016"

Renesas Electronics Introduces 8th-Generation IGBTs that Improve System Power Efficiency Through Industry-Leading Ultra-Low Loss Features

March 10, 2016

Düsseldorf, March 10, 2016 – Renesas Electronics, a premier supplier of advanced semiconductor solutions, today announced the availability of six new products in the 8th-generation G8H Series of insulated gate bipolar transistor (IGBT) lineup that minimize conversion losses in power conditioners for solar power generation systems and reduce inverter applications in uninterruptable power supply (UPS) systems. Six new product versions, rated at 650 V/40 A, 50 A, and 75 A, and at 1,250 V/25 A, 40 A, and 75 A, are being released. Renesas has also achieved the industry’s first TO-247 plus package for a 1,250V … Read More → "Renesas Electronics Introduces 8th-Generation IGBTs that Improve System Power Efficiency Through Industry-Leading Ultra-Low Loss Features"

40V Automotive-Compliant MOSFETs from Diodes Incorporated Target Motor Control

March 10, 2016

Plano, Texas – March 10th, 2016 – Rated for operation up to +175°C, the 40V DMTH4004SPSQ and DMTH4005SPSQ automotive-compliant MOSFETs introduced by Diodes Incorporated are ideally suited for use in high ambient temperature environments. The DMTH4004SPSQ has been designed to meet the requirements of high-power (>750W) brushless DC motor (BLDC) applications, such as water and fuel pumps, while the DMTH4005SPSQ is suited to lower power BLDC applications, such as auxiliary pumps and heating, ventilation and air-conditioning (HVAC) systems.

Developed to … Read More → "40V Automotive-Compliant MOSFETs from Diodes Incorporated Target Motor Control"

Synopsys Announces Release 2016.03 of the RSoft Photonic Component Design Suite

March 10, 2016

MOUNTAIN VIEW, Calif., March 10, 2016 /PRNewswire/ —

Highlights:

Enhances Bidirectional Scattering Distribution Function (BSDF) capabilities for the design and optimization of complex optical structures used in LEDs, OLEDs and displays
Extends multi-threaded processing support for dramatically faster BSDF calculations
Includes new BSDF Viewer for visualization of BSDF data

Synopsys, Inc. (Nasdaq: SNPS) today announced the latest release of its RSoft™ Photonic Component Design Suite, the company’s industry-leading software for the design of photonic devices and components … Read More → "Synopsys Announces Release 2016.03 of the RSoft Photonic Component Design Suite"

Avnet Introduces Multi-Protocol Industrial Ethernet Solution

March 10, 2016

PHOENIX – Avnet, Inc. (NYSE: AVT), a leading global technology distributor, today introduced the new MicroZed™ Industry 4.0 Ethernet Kit (I4EK), enabling multi-protocol Industrial Ethernet solutions based on the Xilinx^® Zynq^®-7000 All Programmable SoC and Anybus^® technology from HMS Industrial Networks. Offering seamless hardware and software integration across networks, the I4EK allows designers creating leading edge applications in smart factory automation such as networked sensors, actuators and motor control to avoid months of development … Read More → "Avnet Introduces Multi-Protocol Industrial Ethernet Solution"

New ICs from STMicroelectronics Deliver Highest Power-Conversion Efficiency for Next-Gen 48V Datacenter Architecture Presented by Google

March 10, 2016

Innovative, scalable, isolated power conversion architecture of new 48V power architecture reduces power loss, space needs, and cooling costs
Family of three ICs is in production and shipping now, in volume

Geneva, March 10, 2016 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced a new family of power-conversion ICs dedicated to 48V power architectures. These three new products are shipping in volume.

To meet ever-growing performance demands, servers and processors have ratcheted up their … Read More → "New ICs from STMicroelectronics Deliver Highest Power-Conversion Efficiency for Next-Gen 48V Datacenter Architecture Presented by Google"

GUC Announces Progress in LPDDR4 IP and Reaffirms Commitment to DIMM Application of DDR3/4

March 9, 2016

Hsinchu, Taiwan, March 09, 2016 – Global Unichip Corp (GUC), the Flexible ASIC LeaderTM and a leading mixed-signal IP provider, today announced two new additions to its 16nm process IP offerings: an LPDDR3/4 PHY/Controller combo in TSMC 16FF+ and 16FFC, respectively. In addition, the company reaffirmed its commitment to the growing DIMM market segment through a plan to tape out a DIMM-optimized DDR3/4 PHY/Controller IP set this year.

The new LPDDR4 IPs are capable of speed up to 3.2Gbps, as characterized in silicon interfacing … Read More → "GUC Announces Progress in LPDDR4 IP and Reaffirms Commitment to DIMM Application of DDR3/4"

eSilicon to attend GOMACTech 2016 Conference: More than Moore and Beyond

March 9, 2016

For release on March 9, 2016, San Jose, Calif.

eSilicon, a leading semiconductor design and manufacturing solutions provider, will participate at the 41st annual Government Microcircuit Applications & Critical Technology (GOMACTech) Conference in Orlando, Florida.

What: eSilicon will discuss its high-bandwidth memory (HBM) PHY solution and demonstrate its Read More → "eSilicon to attend GOMACTech 2016 Conference: More than Moore and Beyond"

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