News – Page 114 – EEJournal

onsemi Debuts Advanced Depth Sensor for Industrial Applications

Hyperlux™ ID iToF family increases distance of depth measurements up to 30 meters to improve productivity and safety in industrial environments

March 11, 2025

What’s New: Today onsemi released the Hyperlux™ ID family, the industry’s first real-time, indirect time-of-flight (iToF) sensor that offers high precision long distance measurements and 3D imaging of fast-moving objects. By using onsemi’s new proprietary global shutter pixel architecture and on-board storage, the Hyperlux ID family can capture an entire scene and simultaneously process depth measurement in real-time. This innovative approach addresses the limitations of standard iToF sensors and enables depth sensing up to 30 meters or four times further than standard iToF sensors, all within a smaller form factor. Additionally, the sensor … Read More → "onsemi Debuts Advanced Depth Sensor for Industrial Applications"

Ferrous Systems Demonstrates SEGGER’s J-Trace System for Analyzing Rust Applications Compiled with Qualified Ferrocene Toolchain

See it in action at embedded world, Hall 4, Booth 4-402

March 11, 2025

embedded world 2025 – Nuremberg, Germany – March 11, 2025 – Ferrous Systems, the leader in Rust solutions for safety-critical systems, announces a successful collaboration with SEGGER demonstrating the use of their J-Trace system analyzing a pure-Rust application compiled with Ferrous Systems’ qualified Ferrocene toolchain.

The demonstration showcases SEGGER’s Ozone debugger and J-Trace probes, which allow embedded systems developers to gain detailed insight into the operation of their firmware, down to the instruction level. Ozone is compatible with the output of almost any toolchain. As both a debugger … Read More → "Ferrous Systems Demonstrates SEGGER’s J-Trace System for Analyzing Rust Applications Compiled with Qualified Ferrocene Toolchain"

Insight SIP launches ISP2554-HM RF module with high performance IOT node

New module supports leading RF technologies & AI

March 11, 2025

Sophia Antipolis, France. 11.03.2025 – Insight SIP, the specialist in ultra-miniature RF modules, is launching the ISP2554-HM module. This module represents a dynamic IOT node, with support for Bluetooth Low Energy, Thread, and Zigbee radios and high-performance computing including an ability to run AI at the Edge. It can thus form the core of a complex IOT device with an unparalleled mixture of features, performance and low power consumption. These features and antennas fit into this ultra-miniature RF module, a tiny package measuring 9 x 9 x 1 mm, the smallest on the market.

With extended temperature … Read More → "Insight SIP launches ISP2554-HM RF module with high performance IOT node"

Mobile Industrial Robots (MiR) Supports Interoperability for Warehouses, Distribution Centers and Manufacturing Facilities with New VDA 5050 Adapter

March 11, 2025

ODENSE, Denmark, March 11, 2025: Mobile Industrial Robots (MiR), a leading manufacturer of collaborative autonomous mobile robots (AMRs), today announced the MiR VDA 5050 Adapter that bridges the company’s AMRs with VDA 5050-compatible third-party fleet management systems.

By simplifying integration to third-party systems, this new software adapter enables interoperability for warehouses, distribution centers and manufacturing facilities seeking a standardized approach to managing diverse heritage robot fleets, reducing integration complexities, and improving operational efficiency.

Initiated by the German Automotive Industry Association (VDA) and the VDMA Material Handling and Intralogistics Association, the Read More →

Cybord Unveils AI-Powered Real-Time Interception (RTI) Solution to Prevent Defective Electronic Products

The new visual AI solution prevents defective components from being assembled onto printed circuit boards in real-time, ensuring product viability while reducing manufacturing rework and scrap, will be presented at IPC APEX EXPO 2025

March 11, 2025

(Wilmington, Delaware, Tuesday, March 11^th, 2025) – Cybord, the leading provider of advanced AI-powered electronic component analytics, today announced the launch of its Real-Time Interception (RTI) solution, an advanced visual AI-powered software that prevents defective components from being assembled onto Printed Circuit Board Assemblies (PCBAs) in real time. By identifying and discarding faulty components within milliseconds before placement, Cybord’s RTI safeguards product quality, integrity, and compliance while significantly … Read More → "Cybord Unveils AI-Powered Real-Time Interception (RTI) Solution to Prevent Defective Electronic Products"

Microchip Technology Unveils 32-bit MCU Family with Integrated High-Performance Analog Peripherals

PIC32A MCU family showcases industry-leading analog peripherals with 200 MHz CPU for cost-effective system-level solutions

March 11, 2025

CHANDLER, Ariz., March 11, 2025—To address the increasing demand for high-performance, math-intensive applications in a wide range of industries, Microchip Technology (Nasdaq: MCHP) has released the PIC32A family of MCUs. Enhancing the company’s already robust 32-bit MCU portfolio, PIC32A MCUs are designed to be cost-efficient, high-performance solutions for general-purpose applications across automotive, … Read More → "Microchip Technology Unveils 32-bit MCU Family with Integrated High-Performance Analog Peripherals"

Infineon extends radiation-tolerant power MOSFET portfolio for space applications with first P-channel device

March 11, 2025

Munich, Germany – 5 March, 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the addition of P-channel power MOSFETs to its family of radiation-tolerant power MOSFETs for Low-Earth-Orbit (LEO) space applications. The new devices are part of Infineon’s expanding portfolio designed for next-generation “NewSpace” applications, providing cost-optimized radiation-tolerant MOSFETs that enable engineers to achieve faster time-to-market designs using smaller and lighter weight components with radiation performance suitable for missions lasting two to five years.

“Successful deployment … Read More → "Infineon extends radiation-tolerant power MOSFET portfolio for space applications with first P-channel device"

Synaptics Launches Ultra-Low-Power Wi-Fi/Bluetooth/802.15.4 Triple Combo SoC Family for Embedded Edge AI IoT

SYN461x is optimized for power, system integration, size, and time to market with outstanding rate-over-range and seamless interoperability to target an ~$3.2 billion market opportunity.

March 11, 2025

Nuremberg, Germany, March 10, 2025 — Synaptics® Incorporated (Nasdaq: SYNA) has extended its award-winning Veros™ Triple Combo connectivity portfolio with the SYN461x family of ultra-low-power (ULP) Wi-Fi® 2.4/5/6 GHz, Bluetooth® 6.0 and Bluetooth … Read More → "Synaptics Launches Ultra-Low-Power Wi-Fi/Bluetooth/802.15.4 Triple Combo SoC Family for Embedded Edge AI IoT"

STMicroelectronics reveals solutions for post-quantum cryptography, bringing quantum resistance to embedded systems

March 11, 2025

New post-quantum cryptographic algorithms integrated in general-purpose MCUs, secure microcontrollers, and automotive microcontrollers
ST’s efforts in post-quantum cryptography will be presented at embedded world exhibition and conference in Nuremberg, March 11-13, 2025

STMicroelectronics has introduced hardware cryptographic accelerators and associated software libraries for general-purpose and secure microcontrollers, ready for future generations of embedded systems to resist quantum attacks.

As quantum computers are beginning to outperform classical computers in research trials, industries are starting to prepare now for … Read More → "STMicroelectronics reveals solutions for post-quantum cryptography, bringing quantum resistance to embedded systems"

Infineon unveils next generation of high-density power modules for vertical power delivery (VPD) in AI data centers

March 11, 2025

Munich, Germany – 10 March 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), global semiconductor leader in power systems and IoT, launched the next generation of high-density power modules which play a pivotal role in enabling AI and high-performance compute. Through enhanced system performance and with Infineon’s trademark robustness, the new OptiMOS™ TDM2454xx quad-phase power modules enable best-in-class power density and total-cost-of-ownership (TCO) for AI data centers operators.

The OptiMOS TDM2454xx quad-phase power modules enable true vertical power delivery (VPD) and offer industry’s best current density of 2 Ampere per … Read More → "Infineon unveils next generation of high-density power modules for vertical power delivery (VPD) in AI data centers"

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