Louisville, CO – February 20, 2018 – The 2018 Design and Verification Conference and Exhibition U.S. (DVCon U.S.) begins next week, offering attendees the industry’s most comprehensive technical program focused on the design and verification of electronics systems. Sponsored by Read More → "Don’t Miss the 30th DVCon U.S. 2018 Next Week!"
Taipei, Taiwan – January 2018 — Artila Electronics, which specializes in the development and manufacture of Linux-ready ARM embedded industrial computers, is pleased to announce RIO-2017PG, the high-performance, compact remote I/O modules interface with up to 8 isolated A/I channels.
This module provides programmable input ranges on all channels and is powered by ARM processor and FreeRTOS operating system to achieve high-performance, lower power consumption with compact size.
For users who would like to develop their application software using RIO-2017PG, Artila provides a f</ … Read More → "Artila Introduces New C Programmable Analog-In Remote I/O Module"
San Jose, Calif. — February 13, 2018 — Practical implementation of deep learning technology demands extreme performance, low power and efficient access to massive amounts of data. Advanced application-specific integrated circuits (ASICs) play a critical role in the path to production for innovations that involve deep learning. In fact, many AI-related applications cannot be realized without the performance and security that a custom chip provides.
Moreover, an implementation platform is needed that supports high-bandwidth memory (HBM2), 2.5D system-in-package (SiP) design and implementation, HBM2 controllers, HBM2 PHY and memory IP designed … Read More → "ASICs Unlock Deep Learning Innovation: Live Seminar in Silicon Valley"
Munich, 20 February 2018 – PRO DESIGN, a leading supplier of FPGA-based Prototyping systems, today announced the launch of its three new proFPGA Zynq™ UltraScale+™ FPGA modules, which offer a complete embedded processing platform for the efficient development and verification of SoC and IP designs.
The proFPGA product family is a complete, scalable, and modular multi-FPGA Prototyping solution, which fulfills highest needs in the area of FPGA-based ASIC Prototyping. The new members of this flexible system concept are the proFPGA Zynq™ UltraScale+™ ZU11EG, ZU17EG and ZU19EG … Read More → "PRO DESIGN Introduces Zynq™ UltraScale+™ Based FPGA SoC and IP Prototyping Platform"
TUALATIN, Ore. — February 20, 2018 — CUI’s Audio Group ( http://www.cui.com/catalog/aud
ALISO VIEJO, Calif.—Feb. 20, 2018—Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced it has expanded the third-party intellectual property (IP) offerings for its cost-optimized, low power, mid-range Read More → "Microsemi to Showcase Third-Party IP Offerings for Machine Vision Applications Using its Cost-Optimized, Low Power Mid-Range PolarFire FPGAs at Embedded World"
Siklu Inc., the market leader in millimeter wave wireless networks, announces a new 10 Gigabit per second (Gbps) full duplex wireless solution. Operating over the interference free 70/80GHz bands, the new EtherHaul™ 8010 provides a reliable fiber extension solution where fiber exists, and greenfield Gigabit connectivity where there may be no fiber at all.
The EtherHaul™ 8010 leverages multiple technical innovations to deliver robust 10Gbps full duplex capacity over longer distances. The EH-8010 is the first of a new platform from Siklu, the 8000 series of products. Additional products incorporating the high capacity/high link budget core technologies will … Read More → "Siklu Announces New 10 Gigabit Full Duplex Wireless Radios"
NORTH ANDOVER, Mass. (February 20, 2018) – L-com Global Connectivity, a preferred manufacturer of wired and wireless connectivity products, announced today that it has launched a new series of high-performance Ethernet patch panels with PoE+ support.
L-com’s new … Read More → "L-com Releases Cat5e/6 Patch Panels with PoE+ Interfaces"
Munich, February 20, 2018 — Rohde & Schwarz is collaborating with wireless module vendor Gemalto to overcome the problem of extensive real network drive tests in different countries. The solution is to automatically reproduce field-recorded network configurations of Gemalto Cinterion modules on an R&S CMW500 mobile radio tester. Manufacturers can use virtual drive tests during the development phase of LTE and LTE-Advanced modules that will ultimately be used in smartphones as well as in M2M and automotive applications. Network-specific integration tests and field tests include analysis of call … Read More → "Rohde & Schwarz collaborates with Gemalto to minimize multi-region drive testing for LTE-Advanced wireless modules"
