Hasselt, Belgium, February 28, 2018 — EpiGaN, a leading European supplier of GaN (Gallium Nitride) technology solutions for power switching, RF (radio frequency) and sensor applications, has a key position in the new EU research project SERENA (“gan-on-Silicon Efficient mm-wave euRopean systEm iNtegration platform”). SERENA sets out to develop a beamforming system platform for mm-wave multi-antenna arrays and to enable the functional performance of a hybrid analog/digital signal processing architecture beyond mainstream CMOS integration. SERENA started in January 2018 will run for 36 months.
The objective of SERENA is a proof-of-concept prototype for optimizing the power efficiency and cost of mm-wave … Read More → "EpiGaN GaN/Si RF Material Technology at the Core of EU 5G Project SERENA"
LONDON, UK, 1 March, 2018 – RS Components (RS), the trading brand of Electrocomponents plc (LSE:ECM), the global distributor for engineers, has introduced an ultra-compact oscilloscope that has a footprint approximately the size of a passport with a thickness of just 19 mm. The new RS Pro 2205A-20 ( https://uk.rs-online.com/web/p
DALLAS (March 1, 2018) – Texas Instruments (TI) (NASDAQ: TXN) today introduced several new power management chips that enable designers to boost efficiency and shrink power-supply and charger solution sizes for personal electronics and handheld industrial equipment.
Operating at up to 1 MHz, TI’s new chipset combines the UCC28780 active clamp flyback controller and the UCC24612 synchronous rectifier controller to help cut the size of power supplies in AC/DC adapters and USB Power Delivery chargers in half. For battery-powered electronics that need maximum charging efficiency in a small solution size, the bq25910 6-A three-level buck battery charger enables up … Read More → "New 1-MHz active clamp flyback chipset and industry-first 6-A three-level buck battery charger from TI cut power supply size and charge time in half"
GRENOBLE, France and DELFT, Netherlands – March 2, 2018 – Leti, a research institute of CEA Tech, and Mapper Lithography, the leading provider of maskless lithography equipment for the semiconductor and nanofabrication industries, today announced a low-cost cyber-security breakthrough that encrypts individual chips with a code.
The non-falsifiable code is generated by using a unique chip design that leverages direct multi-beam writing in a process that fits in a conventional CMOS flow with an extra level of lithography and without photomasks. Throughput on Mapper‘sFLX-1200 tool installed at Leti is compatible with optical … Read More → "Leti and Mapper Develop Individualized Chips with Maskless Lithography in CMOS Process"
Thalwil, Switzerland – March 1, 2018 – u-blox (SIX:UBXN), a global leader in wireless and positioning modules and chips, announced that its SARA-N2 ( https://www.u-blox.com/en/prod
Cupertino, CA – March 1, 2018 — Emerging from stealth today, OnScale announces $3 million … Read More → "OnScale Exits Stealth with $3M in Seed Funding and Unveils the Industry’s First Solver-as-a-Service Platform"
Henderson, NV – March 1, 2017 – VadaTech, a leading manufacturer of integrated systems, embedded boards, enabling software and application-ready platforms, announces the VT882. The VT882 is a 2U MTCA chassis that provides eight extended-size/full-size and/or mid-size AMC slots that can accept any AMC.1, AMC.2, AMC.3 and/or AMC.4 modules. It provides TCLKA, TCLKB, TCLKC and TCLKD as well as FLCLKA to each slot in addition to the JTAG signals. It also contains capability for full redundancy by having a redundant MCH, Power Modules, as well as redundant Cooling Units for high availability. Option for redundant/non-redundant clock is … Read More → "VadaTech Announces MicroTCA Chassis optimized for FPGAs"
