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Rohde & Schwarz demonstrate test capability of 3GPP C-V2X technology in preparation for GCF certification toward commercialization

March 7, 2018

At Mobile World Congress 2018 in Barcelona, Rohde & Schwarz will showcase their CMW500 wideband radio communication tester and a pre-commercial Qualcomm® 9150 C-V2X chipset solution, that implements 3rd Generation Partnership Project (3GPP) Release 14 cellular vehicle-to-everything (C-V2X) direct communications technology. Rohde & Schwarz, working with companies including Qualcomm Technologies, aim to support an official global certification scheme based on 3GPP standardized conformance tests selected by the Global Certification Forum (GCF) in preparation of commercialization.

Munich, February 27, 2018 — Rohde & Schwarz, a premium supplier of test and measurement solutions to the wireless industry announced today they have successfully implemented … Read More → "Rohde & Schwarz demonstrate test capability of 3GPP C-V2X technology in preparation for GCF certification toward commercialization"

congatec introduces MIPI-CSI 2 Smart Camera Kit for rugged vision system

Application-ready bundle for video analytics at the IIoT edge
March 7, 2018
San Diego, CA, USA, February 27, 2018 * * * congatec – a leading vendor of standardized and customized embedded computer boards and modules – introduces its first MIPI-CSI 2 Smart Camera Kit for vision systems at the edge of the IIoT. It is an application-ready kit for the evaluation and deployment of MIPI-CSI 2 based rugged smart camera analytics in harsh industrial, outdoor, and in-vehicle environments. Developers benefit from an instantly deployable industrial-grade smart MIPI-CSI platform. Built with commercial, off-the-shelf available components, it simplifies development and accelerates the time to market of smart camera analytics solutions for the edge … Read More → "congatec introduces MIPI-CSI 2 Smart Camera Kit for rugged vision system"

GLOBALFOUNDRIES Strengthens 22FDX® eMRAM Platform with eVaderis’ Ultra-low Power MCU Reference Design

Co-developed technology solution enables significant power and die size reductions for IoT and wearable products
March 6, 2018

Santa Clara, Calif., February 27, 2018 – GLOBALFOUNDRIES and eVaderis today announced that they are co-developing an ultra-low power microcontroller (MCU) reference design using GF’s embedded magnetoresistive non-volatile memory (eMRAM) technology on the 22nm FD-SOI (22FDX®) platform. By bringing together the superior reliability and versatility of GF’s 22FDX eMRAM and eVaderis’ ultra-low power IP, the companies will deliver a technology solution that supports a broad … Read More → "GLOBALFOUNDRIES Strengthens 22FDX® eMRAM Platform with eVaderis’ Ultra-low Power MCU Reference Design"

650 V Silicon Carbide FETs Offer Simple Silicon Substitution to Cut Losses in Power Systems

Achieve 15-20% loss reduction and higher frequency operation using standard silicon MOSFET gate drive
March 6, 2018

March 5, 2018, Princeton, New Jersey: UnitedSiC, a manufacturer of silicon carbide (SiC) power semiconductors, has announced the UJ3C series of 650 V SiC FETs as drop-in replacements for silicon Superjunction MOSFETs. Available in standard TO-220, TO-247 and D2PAK-3L packages, they operate with standard Si-MOSFET gate drive, eliminating the need to re-design drive circuits, while offering low RDS(ON) and low gate charge to reduce system losses. Used for power factor correction and DC-DC conversion in both hard-switched and ZVS-switched systems, applications include electric vehicle (EV) chargers, power supplies, motor drives and renewable energy inverters.

The maximum … Read More → "650 V Silicon Carbide FETs Offer Simple Silicon Substitution to Cut Losses in Power Systems"

STMicroelectronics Launches World’s First Multi-Band GNSS Receiver with Autonomous-Driving Precision and Automotive Safety Compliance

March 6, 2018
  • ST’s new Teseo receiver combines multiple-frequency (L1, L2, and L5) and multi-constellation tracking to correct positioning error for high-precision navigation
  • First-in-class device features built-in integrity checking for use in safety-critical systems (ISO 26262 ASIL)
  • Enables autonomous-driving systems to combine precise positioning with sensor data for enhanced system performance, safety, reliability

Geneva, February 27, 2018 – Assisting safer autonomous driving, STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has introduced the world’s first multi-frequency satellite-navigation receiver chipset suitable for safety-critical automotive applications and high accuracy positioning at … Read More → "STMicroelectronics Launches World’s First Multi-Band GNSS Receiver with Autonomous-Driving Precision and Automotive Safety Compliance"

IAR Systems commits to bring leading development tools to the growing number of RISC-V users

As a response to customer requests, the company joins the RISC-V Foundation
March 6, 2018

embedded world 2018, Nuremberg, Germany—February 27, 2018—IAR Systems®, the future-proof supplier of software tools and services for embedded development, has joined the RISC-V Foundation, a non-profit corporation controlled by its members to drive the adoption and implementation of the open, free RISC-V instruction set architecture (ISA) forward, and will contribute to the evolution of the RISC-V ecosystem. The company has seen an increasing demand from its customers to provide tools for the RISC-V ISA and is responding to that need by committing to bring support for RISC-V in the professional, leading development toolchain IAR Embedded Workbench®.

RISC-V … Read More → "IAR Systems commits to bring leading development tools to the growing number of RISC-V users"

New Ametherm Inrush Current Limiting NTC Thermistors Withstand up to 1200 J of Input Energy and 80 A Currents

Devices Feature DIN-Rail-Mountable Packages for Easy Installation in Industrial and Green Energy Applications
March 6, 2018

CARSON CITY, Nev. — March 5, 2018 — Ametherm today announced a new series of inrush current limiting NTC thermistors designed to withstand high input energy of 1200 J and steady-state currents from 50.0 A to 80.0 A at 680 V. Offered in DIN-rail-mountable packages, MM35-DIN series devices are optimized for power distribution in high-power industrial and green energy applications including variable-frequency motor drives, transformers, wind turbines, large inverters, and single- and three-phase motors. The MM35 series is among the products being featured this week in the Ametherm booth (#640) at APEC 2018, taking place through March 8 in San Antonio, Texas.

The MM35-DIN series consists … Read More → "New Ametherm Inrush Current Limiting NTC Thermistors Withstand up to 1200 J of Input Energy and 80 A Currents"

Green Hills Software’s INTEGRITY-178 tuMP Multicore Operating System is the First Operating System Certified as Conforming to the FACE Technical Standard

Proven Industry Leader in Safe and Secure Operating Systems completes all FACE Conformance Activities for both ARMv8 and PowerPC architectures making it the first FACE Technical Standard 2.1.1 conformant Operating System and the first ever FACE Conformant Multicore Operating System
March 6, 2018

SANTA BARBARA, CA – March 6, 2018 – Green Hills Software, the worldwide leader in high-assurance operating systems, today announced that it has successfully completed the FACE™ verification process with CERTON, a Cyient Company and a FACE Consortium approved Verification Authority, in order to verify conformance of its INTEGRITY®-178 Time-Variant Unified Multi Processing (tuMP™) operating system with the Technical Standard for Future Airborne Capability Environment (FACE) edition 2.1.1. Green Hills Software has completed these conformance requirements for its INTEGRITY-178 tuMP operating system for two different multicore architectures, or Units of Conformance (UoC): … Read More → "Green Hills Software’s INTEGRITY-178 tuMP Multicore Operating System is the First Operating System Certified as Conforming to the FACE Technical Standard"

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