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Spectrum General Purpose Digitizers now 50% faster

Maximum sampling rate increased from 80 to 125 MS/s
March 15, 2018
Grosshansdorf, Germany – 14 March 2018. Spectrum Instrumentation has announced the addition of five new models to its general purpose M2p.59xx series of PCIe 16-bit digitizer cards. The new versions extend the performance range by increasing the maximum sampling rate from 80 MS/s up to 125 MS/s. The increased sampling rate, together with higher overall bandwidth, enables the new cards to capture a wider range of electronic signals. It makes them ideal for use in applications where signals in the DC to 50 MHz frequency range … Read More → "Spectrum General Purpose Digitizers now 50% faster"

Si2 Approves Two IC Design Simulation Standards for Fast-Growing Gallium Nitride Market

Compact Model Coalition Models Expected to Reduce Costs, Speed Time-to-Market
March 14, 2018

AUSTIN–The Silicon Integration Initiative’s (Si2) Compact Model Coalition (CMC) has approved two integrated circuit design simulation standards that target the fast-growing global market for gallium nitride semiconductors.

The approved standards are the 12th and 13th models currently funded and supported by the CMC, a collaborative group that develops and maintains cost-saving SPICE (Simulation Program with Integrated Circuit Emphasis) models for IC design.

John Ellis, president and CEO, said gallium nitride devices are used in many high-power and high-frequency applications, including satellite communications, radar, cellular, broadband wireless systems, and automotive. “ … Read More → "Si2 Approves Two IC Design Simulation Standards for Fast-Growing Gallium Nitride Market"

Flex Power Modules announces new highly efficient small-footprint DC/DC converter

March 14, 2018
  • New PKU4300D series delivers highest power and highest efficiency in the industry for a one-sixteenth-brick footprint DC/DC module
  • Advanced bus converter targets replacement of one-eighth-brick devices on a range of end-user boards, including deployment in distributed and intermediate bus applications in ICT, telecom and industrial markets

    Flex Power Modules today announced a new one-sixteenth-brick 12V-output DC/DC converter module that can deliver 200 watts of power and has industry-leading efficiency of up to 95%, making it ideal as a replacement for one-eighth brick footprint converters in many applications, thereby saving more than 40% in board real … Read More → "Flex Power Modules announces new highly efficient small-footprint DC/DC converter"

EMA Provides Free Access to Ultra Librarian–the World’s Largest Library of Verified EDA Symbols, Footprints, and 3D Models

March 14, 2018

Rochester, NY (March 14, 2018) – EMA Design Automation® (www.ema-eda.com), a full-service provider and innovator of Electronic Design Automation (EDA) solutions, today announced that access for its more than 14 million component library is now free, allowing downloads from the world’s largest collection of verified symbols, footprints, and 3D STEP … Read More → "EMA Provides Free Access to Ultra Librarian–the World’s Largest Library of Verified EDA Symbols, Footprints, and 3D Models"

GLOBALFOUNDRIES Extends Silicon Photonics Roadmap to Meet Explosive Demand for Datacenter Connectivity

Integrated photonics technologies enable improved bandwidth and energy efficiency for next-generation optical interconnects
March 14, 2018

Santa Clara, Calif., March 14, 2018 – GLOBALFOUNDRIES today revealed new details of its silicon photonics roadmap to enable the next generation of optical interconnects for datacenter and cloud applications. The company has now qualified the industry’s first 90nm manufacturing process using 300mm wafers, while also unveiling its upcoming 45nm technology to deliver even greater bandwidth and energy efficiency.

GF’s silicon photonics technologies are designed to support the massive growth in data transmitted across today’s global communication infrastructure. Instead of traditional interconnects that transmit data using electrical signals over copper wires, silicon photonics … Read More → "GLOBALFOUNDRIES Extends Silicon Photonics Roadmap to Meet Explosive Demand for Datacenter Connectivity"

Plunify, Tencent Cloud Team Up to Offer FPGA Workflows Acceleration in the Cloud

Partnership Delivers On-Demand Access to FPGA Development Tools, Compute Resources to Alleviate Workloads, Optimize Design Performance
March 14, 2018

SINGAPORE, March 14, 2018 (GLOBE NEWSWIRE) — Plunify®, a leading design optimization technology provider, today announced immediate availability of the Plunify Cloud … Read More → "Plunify, Tencent Cloud Team Up to Offer FPGA Workflows Acceleration in the Cloud"

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