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e-con Systems to Unveil the Latest AI Imaging Solutions at NVIDIA GTC 2025

California & Chennai (March 18, 2025): e-con Systems®, a leading provider of embedded vision solutions, is set to showcase its latest innovations at GTC 2025, scheduled from March 18 to 21 at the San Jose Convention Center. Attendees can visit Booth 2107 to experience firsthand how e-con Systems’ cutting-edge AI-driven imaging solutions are poised to transform various industries through the latest technology advancements.

Register nowRead More → "e-con Systems to Unveil the Latest AI Imaging Solutions at NVIDIA GTC 2025"

Smart Eye and Bus OEM Ayats Achieve Milestone ADDW Homologation with AIS Driver Support System

Gothenburg, Sweden – March 18, 2025 – Smart Eye, the leading developer of Driver Monitoring Systems (DMS), has successfully completed Advanced Driver Distraction Warning (ADDW) homologation with prominent bus and coach manufacturer Ayats.

This homologation, carried out in close collaboration with engineering partner Read More → "Smart Eye and Bus OEM Ayats Achieve Milestone ADDW Homologation with AIS Driver Support System"

TDK launches automotive power-over-coax (PoC) inductors for up to 1600 mA

  • Compatible with high currents of up to 1600 mA
  • Ensures high impedance across a wide frequency range
  • Suitable for high-temperature environments; supports a wide operation range of -55 °C to +155 °C

March 18, 2025

TDK Corporation (TSE: 6762) announces the expansion of the ADL3225VF series (3.2 x 2.5 x 2.3 mm; L x W x T) of wire-wound inductors for automotive power-over-coax (PoC). Mass production of these new components began in March 2025.

Advanced driver-assistance systems (ADAS) are designed to enhance vehicle safety by using automotive cameras and sensors that monitor the driving environment. … Read More → "TDK launches automotive power-over-coax (PoC) inductors for up to 1600 mA"

Arteris Selected by Nextchip to Accelerate Chip Designs for Automotive Vision Technology


CAMPBELL, Calif. – March 18, 2025 – Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today announced that Nextchip has licensed Arteris’ FlexNoC 5 interconnect IP with Functional Safety for their EFREET1 project for automotive vision. The physically aware, silicon-proven network-on-chip IP from Arteris supports the advancement of Nextchip’s next-generation vision technology products for the automotive industry.

 

Nextchip specializes … Read More → "Arteris Selected by Nextchip to Accelerate Chip Designs for Automotive Vision Technology"

Renesas Unveils Complete Lithium-Ion Battery Management Platform with Pre-Validated Firmware

ATLANTA and TOKYO, Japan, March 18, 2025 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced all-in-one solutions for managing lithium-ion battery packs in a wide range of battery-powered consumer products, such as e-bikes, vacuum cleaners, robotics and drones. With pre-validated firmware provided, the R-BMS F (Ready Battery Management System with Fixed Firmware) will significantly reduce the learning curve for developers, enabling rapid designs of safe, power-efficient battery management systems.
Designed for lithium-ion batteries in both 2-4 and 3-10 cell series (S), R-BMS F solutions include Renesas’ industry-leading fuel gauge ICs (FGICs), an … Read More → "Renesas Unveils Complete Lithium-Ion Battery Management Platform with Pre-Validated Firmware"

FAMES Pilot Line Launches Open-Access Call for Chip Industry To Submit Proposals to Join Groundbreaking EU Initiative

BRUSSELS – March 18, 2025 at 4pm CET – The FAMES Pilot Line launched its first Open-Access Call today. A dedicated workshop in Brussels generated strong interest from across Europe’s semiconductor industry. A great number of potential users participated to learn more about how to submit a User Request to access the pilot line’s cutting-edge microelectronics R&D technologies and services.

Initiated in December 2023 by the < … Read More → "FAMES Pilot Line Launches Open-Access Call for Chip Industry To Submit Proposals to Join Groundbreaking EU Initiative"

onsemi Launches Silicon Carbide-Based Intelligent Power Modules to Reduce Energy Consumption and Total System Cost

What’s New: Today, onsemi introduced the first generation of its 1200V silicon carbide (SiC) metal oxide semiconductor field-effect transistor (MOSFET) based SPM 31 intelligent power modules (IPMs). onsemi EliteSiC SPM 31 IPMs deliver the highest energy efficiency and power density in the smallest form factor compared to using Field Stop 7 IGBT technology, resulting in lower total system cost than any other leading solution on the market. Their improved thermal performance, reduced power losses and ability to support fast switching speeds makes these IPMs ideally suited for three-phase inverter drive applications such as electronically commutated (EC) fans in AI … Read More → "onsemi Launches Silicon Carbide-Based Intelligent Power Modules to Reduce Energy Consumption and Total System Cost"

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