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Lightrun Launches Industry’s First AI SRE With Live Dynamic Runtime Context

Autonomously Remediates Software Issues, Generates Missing Runtime Evidence on Demand, and Validates Hypotheses Against Live Execution from Code to Production
February 25, 2026

NEW YORK, February 25, 2026 — Lightrun, a leader in software reliability, today announced the industry’s first and only real-time AI SRE built on live, in-line runtime context. This allows AI agents and engineering teams to create missing evidence dynamically without redeployments, prove root causes with live execution data (“ground truth”), and validate fixes directly in live environments.

The mass adoption of AI agents and coding assistants … Read More → "Lightrun Launches Industry’s First AI SRE With Live Dynamic Runtime Context"

Junkosha expands high-frequency test leadership with new 0.5 psec skew matching solutions at DesignCon

Interconnect pioneers use premier electronics industry event to launch new cable solutions for high-speed digital applications
February 25, 2026

DesignCon booth: 1060

February 24th, 2026 – Junkosha, global leaders in high-performance cable solutions, have announced the launch of their latest Microwave/mmWave Coaxial Cable Assemblies at this year’s DesignCon, engineered to support ultra high-speed signal transmission up 110 GHz and 120 GHz with skew matched to 0.5 psec. The MWX001 and MWX002 cables address the quest for ever faster data transfer speeds for next-generation high-speed digital systems, including data center communication and precision test environments. In addition to this debut, Junkosha’s MWX0A5, the first 0.5 mm connector cable capable of transmitting signals from DC to 250 GHz, will be … Read More → "Junkosha expands high-frequency test leadership with new 0.5 psec skew matching solutions at DesignCon"

DigiKey Spotlights New Products at Embedded World 2026

The company’s booth will highlight product demos from Arduino, Microchip, NXP, STMicroelectronics and more
February 25, 2026

NUREMBERG, Germany ­— DigiKey, the global distribution leader of electronic components and automation products,will feature the latest embedded system products from top suppliers at its booth, 4A-633, during embedded world 2026, March 10-12, in Nuremberg, Germany. The company will … Read More → "DigiKey Spotlights New Products at Embedded World 2026"

SiMa.ai and STIGA S.p.A. Announce Strategic Partnership in Physical AI

Collaboration unlocks new real-time, efficient and class-leading AI solutions for robotic lawn mowers
February 25, 2026

SAN JOSE, Calif., Feb. 25, 2026 /PRNewswire/ — STIGA S.p.A., the leading European manufacturer and distributor of garden machinery and equipment, and SiMa Technologies Inc., the Physical AI company, today announced a strategic partnership to bring AI-powered solutions to robotic lawn mowers. STIGA will lead the industry with real-time decision-making on an ultra-low-latency and power-draw platform from SiMa, providing a scalable solution architecture for all robotic lawn mower products — domestic and commercial.

STIGA has established itself as a leader in lawn and garden technology, known for combining engineering excellence with … Read More → "SiMa.ai and STIGA S.p.A. Announce Strategic Partnership in Physical AI"

TDK extends X2 portfolio with compact 350 V (AC) capacitors for industrial and automotive

February 25, 2026

February 25, 2026

TDK Corporation (TSE:6762) extends its X2 safety film capacitor portfolio with the new B3292xU/V series, 
now supporting higher voltages and offering compact lead spacings of 15 mm and 22.5 mm, with capacitance values from 47 nF to 1.8 µF. Rated at 350 V (AC) and robust against peak voltage pulses up to 2.5 kV 
(IEC 60384-14), the series is designed for interference suppression in demanding, space-constrained industrial and … Read More → "TDK extends X2 portfolio with compact 350 V (AC) capacitors for industrial and automotive"

Vishay Intertechnology Phototransistor Optocouplers Deliver Accuracy and Energy Efficiency for Industrial Applications

Devices Combine High, Linear CTR Range With Low Forward Current of 0.5 mA and High Temperature Operation to +125 °C in Four Package Options
February 25, 2026

MALVERN, Pa. — Feb. 25, 2026 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new series of phototransistor optocouplers that combine a high and linear current transfer ratio (CTR) over temperature with a low forward current of 0.5 mA. Offering high temperature operation up to +125 °C in a choice of four packages — the DIL-4; long creepage LSOP-4; compact SOP-4; and half-pitch SSOP-4 — the Vishay Semiconductors VOx619A series is designed to deliver accuracy and energy efficiency in industrial applications.

Offering 50 % lower forward current than the previous-generation solution, the optocouplers released today reduce power consumption for more energy-efficient designs in micro mobility, … Read More → "Vishay Intertechnology Phototransistor Optocouplers Deliver Accuracy and Energy Efficiency for Industrial Applications"

High-Speed Data Acquisition for Advanced Applications: The ADQ35 Digitizer

February 25, 2026

Teledyne SP Devices’ ADQ35 is an established leader in high-performance data acquisition. As part of the 12 bit ADQ3 series, it offers an exceptional combination of speed, resolution, and flexibility, making it a strong fit for demanding scientific, industrial, and OEM applications.

Applications and Market Demand
The ADQ35 is engineered for use in areas such as swept source optical coherence tomography (SS OCT), time of flight mass spectrometry, distributed fiber-optic sensing, LiDAR, scientific instrumentation, and automated test equipment. These applications require digitizers capable of capturing and processing large volumes of data with high fidelity and … Read More → "High-Speed Data Acquisition for Advanced Applications: The ADQ35 Digitizer"

Caspia Launches New RTL Security Analyzer Enabling Agentic Silicon Security Verification

February 25, 2026
  • Caspia’s flagship product, CODAx delivers new levels of security improvement, paving the way for agentic workflows.
  • The company is expanding its management team to support delivery of agentic security workflows.
  • Caspia will present its latest technology at DVCon on March 2-5, 2026.

GAINESVILLE, Fla., Feb. 24, 2026 // PRNewswire/ 

Caspia Technologies today announced broad availability of its … Read More → "Caspia Launches New RTL Security Analyzer Enabling Agentic Silicon Security Verification"

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