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Cadence Collaborates with TSMC to Advance 5nm and 7nm+ Mobile and HPC Design Innovation

Highlights:

  • Cadence digital, signoff and custom/analog tools achieve latest DRM and SPICE certifications for TSMC 5nm and 7nm+ process technologies
  • Digital, signoff and custom/analog tool capabilities improve 5nm and 7nm+ designer productivity
  • Cadence library characterization tool flow supports 5nm and 7nm+ process

SAN JOSE, Calif., May 1, 2018—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced its continued collaboration with TSMC to further 5nm and 7nm+ FinFET design innovation for mobile and high-performance computing (HPC) platforms. The Cadence® digital, … Read More → "Cadence Collaborates with TSMC to Advance 5nm and 7nm+ Mobile and HPC Design Innovation"

Cadence Supports New TSMC WoW Advanced Packaging Technology

Full suite of Cadence digital, signoff and custom/analog IC design tools coupled with advanced IC package design and analysis tools optimized for TSMC WoW technology

SAN JOSE, Calif., May 1, 2018—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its full suite of Cadence® digital, signoff and custom/analog IC design tools, along with advanced IC packaging design solutions, support the new TSMC Wafer-on-Wafer (WoW) stacking technology.

For more information on the Cadence solutions that support the TSMC WoW technology, visit Read More → "Cadence Supports New TSMC WoW Advanced Packaging Technology"

TI simplifies space-constrained automotive application designs with robust, reliable 100BASE-T1 Ethernet PHY

New 100-Mbps single-pair Ethernet PHY with SGMII support enables designers to pack more capability and intelligence into their automotive network designs

DALLAS (May 2, 2018) – Texas Instruments (TI) (NASDAQ: TXN) today introduced a new automotive Ethernet physical layer (PHY) transceiver that cuts the external component count and board space in half and consumes as little as half the power of competitive solutions. The DP83TC811S-Q1’s support for serial gigabit media independent interface (SGMII), small packaging and integrated diagnostic features enable designers to bring greater intelligence via Ethernet connectivity to space-constrained automotive body electronics, infotainment and … Read More → "TI simplifies space-constrained automotive application designs with robust, reliable 100BASE-T1 Ethernet PHY"

Cadence Prototypes First IP Interface in Silicon for Preliminary Version of DDR5 Standard Being Developed in JEDEC

SAN JOSE, Calif., May 1, 2018—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced it has prototyped its first IP interface in silicon for a preliminary version of the DDR5 standard being developed in JEDEC. The Cadence test chip was fabricated in TSMC’s 7nm process and achieves a 4400 megatransfers per second (MT/sec) data rate, which is 37.5 percent faster than the fastest commercial DDR4 memory at 3200MT/sec. With this key milestone, SoC providers developing high-speed memory subsystems for high-end server, storage and enterprise applications can start developing their DDR5 memory subsystems now with silicon-tested PHY and controller IP from … Read More → "Cadence Prototypes First IP Interface in Silicon for Preliminary Version of DDR5 Standard Being Developed in JEDEC"

MagnaChip Introduces Third-Generation 40-Nanometer Mobile OLED DDIC for Smartphone Displays Without Bezels

SEOUL, South Korea and SAN JOSE, Calif., May 1, 2018 — MagnaChip Semiconductor Corporation (“MagnaChip Semiconductor”) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor platform solutions, announced today it has launched a new third-generation 40-nanometer (nm) OLED display driver integrated circuit (DDIC) for the next wave of OLED smartphone displays. The new rigid OLED DDIC supports various configurations such as FHD to FHD++, a wide aspect ratio up to 21:9 and bezel-less, edge type, and notch-type OLED displays. The 40nm mobile OLED DDIC already has won its first design-in at a leading smartphone player.

The new 40nm mobile … Read More → "MagnaChip Introduces Third-Generation 40-Nanometer Mobile OLED DDIC for Smartphone Displays Without Bezels"

Imperas and Andes Extend Partnership, Delivering Models and Virtual Platforms for Andes RISC-V Cores with New AndeStar V5m Extensions

Oxford, United Kingdom, May 1, 2018 — Imperas Software Ltd., the leader in virtual platforms and high-performance software simulation, and Andes Technology Corporation, today announced Open Virtual Platforms™ (OVP™) models and virtual platform support for powerful new extensions in the AndesCore™ N25 and NX25 IP processors, which are AndeStar™ V5 32-bit and 64-bit architectures based on the RISC-V technologies.

Building on the Imperas and Andes partnership to support Andes’ RISC-V cores announced in November 2017, the new Imperas reference models support the Andes AndeStar™ V5m extensions.</ … Read More → "Imperas and Andes Extend Partnership, Delivering Models and Virtual Platforms for Andes RISC-V Cores with New AndeStar V5m Extensions"

Spin Transfer Technologies Announces Breakthrough MRAM Technology for SRAM and DRAM Applications

FREMONT, Calif. – April 30, 2018 – Spin Transfer Technologies, Inc., the leading developer of advanced STT-MRAM for embedded SRAM and stand-alone DRAM applications, today announced results of its unique Precessional Spin Current (PSC™) structure. The results from advanced testing of the PSC structure confirm that it will increase the spin-torque efficiency of any MRAM device by 40-70 percent — enabling dramatically higher data retention while consuming less power. This gain translates to retention times lengthening by a factor of over 10,000 (e.g., 1 hour retention becomes more than 1 year retention) while reducing write current. Improved efficiency is critical for enabling MRAM … Read More → "Spin Transfer Technologies Announces Breakthrough MRAM Technology for SRAM and DRAM Applications"

Synopsys and TSMC Collaborate to Deliver DesignWare Foundation IP for Ultra-Low Power TSMC 22-nm Processes

MOUNTAIN VIEW, Calif., April 30, 2018 /PRNewswire/ —

Highlights

TSMC Certifies Synopsys Design Platform for High-performance 7-nm FinFET Plus Technology

MOUNTAIN VIEW, Calif., April 30, 2018 /PRNewswire/ —

Highlights:

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