Cadence Collaborates with TSMC to Advance 5nm and 7nm+ Mobile and HPC Design Innovation
Highlights:
- Cadence digital, signoff and custom/analog tools achieve latest DRM and SPICE certifications for TSMC 5nm and 7nm+ process technologies
- Digital, signoff and custom/analog tool capabilities improve 5nm and 7nm+ designer productivity
- Cadence library characterization tool flow supports 5nm and 7nm+ process
SAN JOSE, Calif., May 1, 2018—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced its continued collaboration with TSMC to further 5nm and 7nm+ FinFET design innovation for mobile and high-performance computing (HPC) platforms. The Cadence® digital, … Read More → "Cadence Collaborates with TSMC to Advance 5nm and 7nm+ Mobile and HPC Design Innovation"

