EEJournal

industry news archive
Subscribe Now

Rugged Modular Power Supplies Support 30 W to 120 W Range for PCI-104 and COM Express-based Platforms

New PSUs operate in challenging power conditions found in rugged operations
May 24, 2018

Technical Highlights:

  • Ranges between 30 W and 120 W outputs and 11.4 VDC to 50 VDC inputs
  • Can be used in a PC/104 stack; as a standalone unit in COM Express or custom SFFs
  • Operating range of -40°C to +85°C per MIL-STD-810G

FREMONT, Calif., May 2018 – Elma has added four new, rugged power supply modules to its growing family of power solutions. The Read More → "Rugged Modular Power Supplies Support 30 W to 120 W Range for PCI-104 and COM Express-based Platforms"

Silex Inside HDMI over IP OEM solution is interoperable with AES67 and SMPTE 2110 standards

May 24, 2018

Louvain-la-Neuve, Belgium – May 24th 2018 – Silex Inside, leading provider of video compression technology and OEM solutions in the pro A/V market, is announcing the support of AES67 audio standard and SMPTE 2110 standard on its Viper OEM AV over IP solution. The support of AES67 and SMPTE 2110 is the reference in terms of open standard for streaming audio/video over IP network.

The Viper OEM solution is a fully functional stand-alone hardware board that enables HDMI over IP. It is a turnkey solution based on open standards. … Read More → "Silex Inside HDMI over IP OEM solution is interoperable with AES67 and SMPTE 2110 standards"

Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters

May 24, 2018

BMR466 and BMR461 DC/DC converters now offer power system architects more design options with choice of BGA or LGA packages
•       Targeting distributed and intermediate applications in ICT, telecom and industrial markets

Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package. Both modules target deployment in distributed power and intermediate bus voltage architectures within the ICT (Information and Communication Technology), telecom and industrial sectors, in … Read More → "Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters"

Annapolis Micro Systems Introduces Industry’s First COTS Mezzanine with New Xilinx® RF System-on-Chip

May 24, 2018

Annapolis Micro Systems, a leading FPGA board and systems supplier, announced today the availability of the industry’s first COTS FMC+ Mezzanine to feature the new Xilinx® Zynq® UltraScale+™ RF System-on-Chip (RFSoC) technology. The WILD FMC+ GM60 ADC & DAC integrates Xilinx’s ZU25DR, ZU27DR, or ZU28DR.

This breakthrough Xilinx RFSoC combines … Read More → "Annapolis Micro Systems Introduces Industry’s First COTS Mezzanine with New Xilinx® RF System-on-Chip"

Vishay Intertechnology High Speed PIN Photodiode Offers Enhanced Sensitivity for Visible Light, Enables Slim Sensor Designs for Wearables

Device Delivers Precise Signal Detection in 4.8 mm by 2.5 mm SMD Package With Industry-Low 0.48 mm Profile
May 24, 2018

MALVERN, Pa. — May 21, 2018 — Vishay Intertechnology, Inc. (NYSE: VSH) today broadens its optoelectronics portfolio with the introduction of a new high speed silicon PIN photodiode with enhanced sensitivity for visible light. Featuring a rectangular 4.8 mm by 2.5 mm top-view, surface-mount package with an industry-low 0.48 mm profile — 0.37 mm lower than that of competing solutions — the Vishay Semiconductors VEMD8080 offers fast switching times and low capacitance of 47 pF for precise signal detection in wearable devices and medical applications.

With a radiant-sensitive area measuring 4.5 mm² — and high radiant sensitivity with a reverse light current of 28 µA and dark current of 0.2 nA — the … Read More → "Vishay Intertechnology High Speed PIN Photodiode Offers Enhanced Sensitivity for Visible Light, Enables Slim Sensor Designs for Wearables"

Kudelski Group and u-blox to collaborate on secure connectivity 
for consumer, automotive and industrial IoT

May 23, 2018

CHESEAUX-SUR-LAUSANNE, Switzerland and THALWIL, Switzerland, May 22, 2018 – The Kudelski Group (SIX:KUD.S), the world leader in digital security, and u‑blox (SIX:UBXN), a global leader in positioning and wireless communication technologies for the automotive, industrial and consumer markets, today announced the signing of an MOU to bring premium-grade security to IoT devices.

Kudelski and u‑blox agreed to collaborate toward integrating the Kudelski IoT Security Suite into multiple u-blox product lines, thereby providing field-proven security technologies to empower businesses to sustainably secure their digital transformation, … Read More → "Kudelski Group and u-blox to collaborate on secure connectivity 
for consumer, automotive and industrial IoT"

Cadence Design Systems and NI Announce Collaboration to Simplify Next-Generation Semiconductor and RF Development

May 23, 2018

Highlights:

•       Cadence and NI collaborate to improve the overall semiconductor development and test process, reducing design cycle time and improving quality of results for next-generation wireless, automotive and mobile products
•       Cadence launches comprehensive, new Virtuoso RF Solution, enabling engineers to design, implement and analyze RF modules and RFICs from within the Virtuoso custom IC design platform
•       Unique EM simulation integration to support NI AWR AXIEM 3D planar EM software and Cadence Sigrity PowerSI 3D EM Extraction Option
•       Cadence and NI jointly working to deliver common transistor models to ensure consistent simulation behavior between NI … Read More → "Cadence Design Systems and NI Announce Collaboration to Simplify Next-Generation Semiconductor and RF Development"

University of Colorado’s Laboratory for Atmospheric and Space Physics adopts Ada and GNAT Pro for NASA project

Ada selected over C to run on a Cortex M1 core
May 23, 2018

PARIS & NEW YORK, May 22, 2018 – AdaCore today announced that the University of Colorado’s Laboratory for Atmospheric and Space Physics (LASP) has selected the Ada language and the GNAT Pro for the ARM Cortex product for NASA’s Climate Absolute Radiance and Refractivity Observatory (CLARREO) Pathfinder mission. CLARREO Pathfinder will deploy a Reflected Solar spectrometer on the International Space Station (ISS) … Read More → "University of Colorado’s Laboratory for Atmospheric and Space Physics adopts Ada and GNAT Pro for NASA project"

featured blogs
Human Artifacts Discovered on Mars!
Apr 24, 2026
A thought experiment in curiosity, confusion, and cosmic consequences....
More from Max's Cool Beans...