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Sarcina Technology launches AI platform To enable cost-effective customizable packaging solutions for AI applications

March 31, 2025
Palo Alto, CA – 25 March 2025. Sarcina Technology, a global semiconductor packaging specialist, is excited to announce the launch of its innovative AI platform to enable advanced AI packaging solutions that can be tailored to meet specific customer requirements. Leveraging ASE’s FOCoS-CL (Fan-Out Chip-on-Substrate-Chip Last) assembly technology, this platform includes an interposer which supports chiplets using UCIe-A for die-to-die interconnects, allowing for the delivery of cost-effective, customizable, cutting-edge solutions.
Sarcina Technology is on a mission to push the boundaries of AI computing system development by providing a unique platform that enables efficient, scalable, configurable and cost-effective semiconductor packaging … Read More → "Sarcina Technology launches AI platform To enable cost-effective customizable packaging solutions for AI applications"

Zuken Joins IBM Research AI Hardware Center to Develop Next-Generation AI Hardware Solutions

Zuken has also signed a joint development agreement with IBM focusing on 3-D integrated circuit packaging, AI hardware acceleration, and EDA workflow advancements
March 25, 2025

WESTFORD, MASS, USA, March 24, 2025 – Today, Zuken Inc. announced an agreement with IBM to join the IBM Research AI Hardware Center as a commercial member. The IBM Research AI Hardware Center, a global research hub headquartered at the Albany NanoTech Complex in Albany, NY, aims to develop next-generation chips and systems, including advanced semiconductor packaging, that support the processing power and unprecedented speed that AI requires.

Zuken has also signed an agreement with IBM for the joint research and development of heterogeneous chip integration packaging solutions, which is critical for AI accelerator architecture. The collaboration will focus on 3 … Read More → "Zuken Joins IBM Research AI Hardware Center to Develop Next-Generation AI Hardware Solutions"

Siemens expands Industrial Copilot with New generative AI-powered Maintenance Offering

March 25, 2025
  • The Siemens Industrial Copilot, a generative AI-based assistant, is empowering customers across the entire value chain – from design and planning to engineering, operations, and services
  • Siemens expands its Industrial Copilot offering with extended capabilities for Senseye Predictive Maintenance
  • The generative AI-powered solution will support every stage of the maintenance cycle, from repair and prevention to prediction and optimization

The Siemens Industrial Copilot is revolutionizing industry by enabling customers to leverage generative AI across the entire value chain – from design and planning to engineering, operations, and services. For example, the generative AI-powered … Read More → "Siemens expands Industrial Copilot with New generative AI-powered Maintenance Offering"

PolarFire® SoC FPGAs Achieve AEC-Q100 Qualification

The robust, low-power solutions from Microchip Technology meet stringent automotive standards for reliability in harsh conditions
March 25, 2025
CHANDLER, Ariz., March 24, 2025 —Microchip Technology’s (Nasdaq: MCHP) PolarFire® System on Chip (SoC) FPGAs have earned the Automotive Electronics Council (AEC)-Q100 qualification. The AEC-Q standards are a guideline for integrated circuits, using stress tests to measure the reliability … Read More → "PolarFire® SoC FPGAs Achieve AEC-Q100 Qualification"

OMNIVISION Partners with Biotech Dental to Develop Highly Accurate 3D Intraoral Scanners

Together, the companies will improve dental visualization and patient care with Biotech’s Scan4All intraoral scanners that feature OMNIVISION’s miniature camera modules
March 25, 2025
SANTA CLARA, Calif. and SALON-DE-PROVENCE, France – March 24, 2025 – OMNIVISION, a leading global developer of semiconductor technology, including advanced digital imaging, analog, and display solutions, and Biotech Dental, a specialist in the design and manufacture of medical devices and digital solutions for dental applications, today announced a partnership that involves Biotech Dental’s use of multiple medical-grade camera modules from OMNIVISION in the design of its new Scan4All 3D intraoral scanners Iris by Starck. The camera modules for dental applications feature OMNIVISION’s CameraCubeChip® technology with an integrated lens and will be showcased at the International Dental Show ( … Read More → "OMNIVISION Partners with Biotech Dental to Develop Highly Accurate 3D Intraoral Scanners"

AXISCADES’ subsidiary Mistral Unveils DCP1000 Module based on Lattice CertusPro-NX FPGA

A Cutting-Edge Radar Data Capture and Playback Module for mmWave Radar Applications
March 24, 2025

21st March 2025, Bengaluru, India: Mistral Solutions Private Ltd, (Mistral) a subsidiary of  AXISCADES Technologies Limited (AXISCADES), a chip to product company and a pioneer in  Defense, Electronics, Semiconductor and Artificial Intelligent (ESAI) applications, today  announced the launch of the DCP1000 Module, a compact and user-friendly Radar Data  Capture and Playback Module designed for real-time mmWave Radar data streaming &  Playback together. Based on the award-winning low power Lattice Nexus™ FPGA platform, the  DCP1000 delivers high-speed, low-latency data capture with Gigabit Ethernet connectivity and  HIL (Hardware-In-Loop) playback functionality. This … Read More → "AXISCADES’ subsidiary Mistral Unveils DCP1000 Module based on Lattice CertusPro-NX FPGA"

Antenova launches Inpai, a small cellular antenna covering 4G/LTE bands worldwide

March 24, 2025

Waterlooville, UK, March 20, 2025 – Antenova Ltd, UK headquarters, launches Inpai – an SMD cellular antenna  designed for NB-IoT and CATM on 4G/LTE networks.  

The Inpai antenna with a slightly smaller footprint than the popular Lucida antenna, operates on all LTE and mobile  bands. The new addition provides exceptional performance in a compact design, measuring 35mm x 8mm x  3.3mm with a clearance of 35mm x 13mm. Optimal performance requires the antenna to be positioned along the  short end of a 105mm … Read More → "Antenova launches Inpai, a small cellular antenna covering 4G/LTE bands worldwide"

NVIDIA to Build Accelerated Quantum Computing Research Center

New Center in Boston to Advance the Development of Quantum Computing Architectures and Algorithms in Collaboration With Leading Hardware and Software Makers
March 24, 2025

GTC—NVIDIA today announced it is building a Boston-based research center to provide cutting-edge technologies to advance quantum computing.

The NVIDIA Accelerated Quantum Research Center, or NVAQC, will integrate leading quantum hardware with AI supercomputers, enabling what is known as accelerated quantum supercomputing. The NVAQC will help solve quantum computing’s most challenging problems, ranging from qubit noise to transforming experimental quantum processors into practical devices.

Leading quantum computing … Read More → "NVIDIA to Build Accelerated Quantum Computing Research Center"

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