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WARR Hyperloop team wins Hyperloop Pod Competition with Panasonic Industry on board

Team from TUM Munich wins trophy at the SpaceX Hyperloop Pod Competition for the third consecutive time
July 25, 2018

Munich, July 2018: Panasonic Industry Europe congratulates the WARR Hyperloop team from the Technical University in Munich (TUM) on winning the third international annual SpaceX Hyperloop Pod Competition on 22nd July 2018 in Los Angeles. The pod from the WARR Hyperloop team reached a final speed of 467km/h, thereby improving their performance from 2017 by almost 50%. It is already the third consecutive time the team has won a trophy at the competition.

The Hyperloop is a new transportation concept for a high-speed train to travel in a near-vacuum tube. The vacuum-tube allows the … Read More → "WARR Hyperloop team wins Hyperloop Pod Competition with Panasonic Industry on board"

Plunify Enables InTime FPGA Development in the Cloud

Offers On-demand Cloud Access to Developers for any Xilinx FPGAs, SoCs
July 25, 2018

SINGAPORE –– July 25, 2018 –– Plunify®, a leading design optimization technology provider, today announced availability of Plunify InTime™ through the Plunify Cloud platform for on-demand development, optimization, testing and deployment of Xilinx field programmable gate array (FPGA) designs in the cloud using Vivado® Design Suite, HLx Edition.

“Our collaboration with Plunify enables FPGA designers to leverage the flexibility and scalability of the cloud to compile designs in Vivado at scale and reduce turnaround time,” remarks Ramine Roane, vice president of solutions marketing … Read More → "Plunify Enables InTime FPGA Development in the Cloud"

Anritsu Introduces Industry-first PIM Over CRPI Capability for BTS Master™ Handheld Base Station Analyzers

New Software Allows PIM Measurements to be Conducted on the Ground, Creating Significant Time and Cost Savings When Installing and Maintaining Base Stations
July 25, 2018

Morgan Hill, CA – July 24, 2018 – Anritsu Company introduces PIM over CPRI software for its BTS Master™ MT8220T and MT822 … Read More → "Anritsu Introduces Industry-first PIM Over CRPI Capability for BTS Master™ Handheld Base Station Analyzers"

SiTime and Intel Announce Collaboration on MEMS Timing for 5G

Integration of SiTime’s Innovative MEMS Timing Solutions to Deliver Best Consumer Experience
July 25, 2018

 SiTime solves critical timing challenges for 5G and helps to achieve high-performance throughput in Intel’s 5G multi-mode radio modem platforms.

  • SiTime’s industry leading MEMS timing solutions provide unique advantages such as smallest size and high immunity to vibration and ability to withstand fast temperature ramps.
  • Tiny, low power microelectromechanical systems (MEMS) timing solutions from SiTime maximize battery life.

SANTA CLARA, Calif., July 24, 2018 – Read More → "SiTime and Intel Announce Collaboration on MEMS Timing for 5G"

RS Components now stocking newest version of HARTING PushPull connectors for industrial applications

Second generation PushPull devices deliver high flexibility, more secure connection and higher reliability for the Industry 4.0 environment
July 25, 2018

LONDON, UK, 24 July, 2018 – RS Components (RS), the trading brand of Electrocomponents plc (LSE:ECM), a global multi-channel distributor, has announced availability of the HARTING PushPull V4 series of connectors ( http://uk. … Read More → "RS Components now stocking newest version of HARTING PushPull connectors for industrial applications"

Newark element14 Offers a Range of Exclusive Brands Providing Price, Performance and Product Customization Benefits

9 out of 10 users of Exclusive Brands would recommend them to friends and colleagues
July 25, 2018

Chicago, July 24, 2018 – Newark element14, the Development Distributor, is providing customers with more affordable alternatives on a wide range of electrical and electronics products for design and production applications through its range of Exclusive … Read More → "Newark element14 Offers a Range of Exclusive Brands Providing Price, Performance and Product Customization Benefits"

Microsemi PolarFire FPGAs Enable Smallest, Lowest Power DisplayPort Implementations with New IP from Bitec

IP Gives Customers More Options for Customizing DisplayPort 1.4a Designs
July 25, 2018

ALISO VIEJO, Calif.—July 24, 2018—Microsemi Corporation, a wholly owned subsidiary of Microchip Technology, Inc. (Nasdaq: MCHP), today announced the availability of Bitec’s DisplayPort intellectual property (IP) core optimized for Read More → "Microsemi PolarFire FPGAs Enable Smallest, Lowest Power DisplayPort Implementations with New IP from Bitec"

Concurrent Technologies expands product capabilities with LynxSecure Separation Kernel Hypervisor

July 25, 2018

San Jose, California, 24 July 2018 – Concurrent Technologies, a leading supplier of processor solutions for demanding environments, has partnered with Lynx Software Technologies to provide solutions for applications requiring a secure virtualized environment.  The LynxSecure Separation Kernel Hypervisor enables simultaneous operation of general purpose and real-time operating systems whilst meeting the security needs of the US Department of Defense.  It is particularly suitable for use on Concurrent Technologies’ rugged server TR C4x/msd and TR G4x/msd boards, that are available with 12-core Intel® … Read More → "Concurrent Technologies expands product capabilities with LynxSecure Separation Kernel Hypervisor"

Cadence Selected for DARPA ERI Machine Learning Contract to Accelerate Electronic Design Innovation

Cadence MAGESTIC program includes machine learning experts at Carnegie Mellon University and NVIDIA to drive development of intelligent chip, package and board design flows
July 24, 2018

SAN JOSE, Calif., July 24, 2018 —Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that it was selected by the Defense Advanced Research Projects Agency (DARPA) to support the Intelligent Design of Electronic Assets (IDEA) program, one of six new programs within DARPA’s Electronics Resurgence Initiative (ERI) to use advanced machine learning techniques to develop a unified platform for a fully integrated, intelligent design flow for systems on chip (SoCs), systems in package (SiPs) and printed circuit boards (PCBs). The ERI investments are the next steps in creating a … Read More → "Cadence Selected for DARPA ERI Machine Learning Contract to Accelerate Electronic Design Innovation"

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