KIOXIA, AIO Core and Kyocera Announce Development of PCIe 5.0-Compatible Broadband Optical SSD for Next-Generation Green Data Centers
Germany, Düsseldorf, 9 April 2025 – KIOXIA Corporation, AIO Core Co., Ltd. and Kyocera Corporation today announced the development of a prototype PCIe 5.0-compatible broadband SSD with an optical interface (broadband optical SSD). The three companies will develop technologies for broadband optical SSDs to enhance their suitability for advanced applications that require high-speed transfer of large data, such as generative AI, and will also apply them to proof-of-concept (PoC) tests for future social implementation.
The new prototype achieved functional operation with the high-speed PCIe 5.0 interface, which is twice the bandwidth of the previous PCIe 4.0 generation [1], through the combination of … Read More → "KIOXIA, AIO Core and Kyocera Announce Development of PCIe 5.0-Compatible Broadband Optical SSD for Next-Generation Green Data Centers"
Nexperia introduces new high speed optimized flip-chip package technology for automotive ESD protection
Nijmegen, April 09, 2025: Nexperia today announced a new portfolio of high signal integrity, bidirectional electrostatic discharge (ESD) protection diodes in innovative flip-chip land-grid-array (FC-LGA) packaging. This new package technology is optimized for protecting and filtering high-speed data communication links which are increasingly used in modern cars. Applications like in-vehicle camera video-links, multi-gigabit automotive Ethernet networks as well as infotainment interfaces like USBx, HDMIx, and PCIex, can be protected against potentially damaging ESD events.
Flip-chip packages have minimal parasitic components – they come without bond wires or copper lead frames resulting in high performance and excellent signal integrity. Nexperia’s … Read More → "Nexperia introduces new high speed optimized flip-chip package technology for automotive ESD protection"
Innatera Appoints Intralink to Bring Brain-Inspired AI to Asia
RIJSWIJK, NETHERLANDS – April 8, 2025 – Innatera, the leading provider of neuromorphic computing solutions, has appointed Intralink, an international business development consultancy, to introduce Innatera’s ultra-low-power AI technologies to Asia. The rollout will begin in China and Taiwan, with plans for further expansion across the region. The partnership will empower local Original Equipment Manufacturers (OEMs) to drive innovation in next-generation products, from smart sensors and wearables to autonomous systems.
Innatera’s neuromorphic technology mimics how the human brain processes information, enabling ultra-efficient and lightning-fast AI computations. Unlike traditional … Read More → "Innatera Appoints Intralink to Bring Brain-Inspired AI to Asia"
TDK unveils new high-performance, cost-effective Hall-effect 2D position sensor family for automotive applications
- HAL/HAR 35xy* is an ASIL C ready, stray-field robust Hall-effect 2D position sensor family with enhanced features for safety-critical automotive applications
New sensors include a single-die version (HAL 3550) and a dual-die version (HAR 3550) with analog (linear, ratiometric) and digital (PWM, SENT & Switch) output interfaces
Based on the flagship Micronas HAL/HAR 39xy family, offering a more cost-effective option without sacrificing performance or functional safety performance
Main target applications are steering wheel angles, brake and accelerator pedal positions, valve positions, and chassis position detection**
April 08, 2025
TDK Corporation ( … Read More → "TDK unveils new high-performance, cost-effective Hall-effect 2D position sensor family for automotive applications"
ADLINK Launches Intel® Core™ Ultra COM-HPC Mini with Powerful Computing Performance at 95mm x 70mm
- ADLINK Launches Intel® Core™ Ultra COM-HPC Mini with Powerful Computing Performance at 95mm x 70mm
- COM-HPC-mMTL: 14-Core Intel® Core™ Ultra Processor with Integrated ARC GPU+NPU and 16x PCIe
- Ultra-Power Performance, Perfectly Sized to Fit Any Space
Summary:
- Powered by the Intel® Core™ Ultra architecture with up to 14 CPU cores, 8 Xe GPU cores, and an integrated NPU for high-performance AI acceleration, combining ultra-power with energy efficiency.
- 64GB LPDDR5x memory soldered directly onto the board, supporting … Read More → "ADLINK Launches Intel® Core™ Ultra COM-HPC Mini with Powerful Computing Performance at 95mm x 70mm"
Lynred unveils LTB, comprehensive software suite enabling quicker integration of its infrared sensors
First software suite offering from hardware manufacturer Lynred
Grenoble, France, April 8, 2025 – Lynred, a leading global provider of high-quality infrared sensors for the aerospace, defense and commercial markets, today announces its unveiling of Lynred ToolBox (LTB), an intuitive software solution designed to facilitate the evaluation of Lynred’s IR modules and sensors by assessing IR image quality and overall performance. … Read More → "Lynred unveils LTB, comprehensive software suite enabling quicker integration of its infrared sensors"
TDK unveils new high-performance, cost-effective Hall-effect 2D position sensor family for automotive applications
- HAL/HAR 35xy* is an ASIL C ready, stray-field robust Hall-effect 2D position sensor family with enhanced features for safety-critical automotive applications
- New sensors include a single-die version (HAL 3550) and a dual-die version (HAR 3550) with analog (linear, ratiometric) and digital (PWM, SENT & Switch) output interfaces
- Based on the flagship Micronas HAL/HAR 39xy family, offering a more cost-effective option without sacrificing performance or functional safety performance
- Main target applications are steering wheel angles, brake and accelerator pedal positions, valve positions, and chassis position detection**
April 08, 2025
12-Bit I²C 3D Linear Hall Effect Sensor from Diodes Incorporated Simplifies Rotary Motion and Proximity Detection in Automotive Applications
Plano, Texas – April 8, 2025 – Diodes Incorporated (Nasdaq: DIOD) today introduces its first automotive-compliant* 3D linear Hall effect sensor. The Read More → "12-Bit I²C 3D Linear Hall Effect Sensor from Diodes Incorporated Simplifies Rotary Motion and Proximity Detection in Automotive Applications"
ALD’s Newest SAB MOSFET Reaches New Power Management Standard for Supercapacitors Rated at 3V or Higher
SUNNYVALE, Calif. – April 8, 2025 – Advanced Linear Devices Inc. (ALD), a design innovator in analog semiconductors, today announced its latest addition to its Supercapacitor Auto-Balancing (SAB™) MOSFET family. This dual MOSFET provides unmatched auto-balancing capabilities and power management for supercapacitors ranging from 2.8V to 3.3V. The ALD910030 uses virtually no power for cell balancing and prevents most catastrophic failures. The chip enhances performance across various sectors, including utility boxes, backup power systems, industrial applications, uninterruptable power supplies, renewable energy and consumer electronics.
Traditionally, widely used supercapacitors had a voltage rating of 2.7V … Read More → "ALD’s Newest SAB MOSFET Reaches New Power Management Standard for Supercapacitors Rated at 3V or Higher"

