BOPLA , a leading specialist in electronic enclosures, has introduced BoVersa, an innovative new enclosure concept designed for next-generation wireless, embedded, and instrumentation systems. Combining modern design with robust engineering, BoVersa delivers maximum flexibility for equipment designers while ensuring long-term reliability, even in challenging outdoor environments.
Advanced Design for Modern Applications
BoVersa has been developed to meet the increasing demands of IoT, wireless, embedded, and instrumentation markets. The enclosure can be configured for hand-held, tabletop, wall, or pole-mounted applications, making it suitable for diverse fields such as security, measurement, and communication technology.
A unique three-part enclosure structure—comprising a lower part, functional lid, and design cover—offers designers unprecedented flexibility. These components can be combined in various colours, with options for transparent or translucent lids, enabling lighting effects, visibility of displays, or a clean, closed design.
Optimised for Wireless & Cooling
For wireless systems, BoVersa integrates a die-cast aluminium body with cooling fins combined with a plastic cover. This ensures both unhindered radio transmission and efficient thermal management, essential for electronics with high power density.
The point-symmetrical fin design guarantees uniform airflow in both vertical and horizontal mounting positions. This maximises cooling efficiency, stabilises internal temperature distribution, and extends the service life of sensitive electronics.
Built for Harsh Environments
BoVersa’s robust construction makes it suitable for outdoor deployment. With protection class up to IP66 / IP68 (1.2m for 2h, DIN EN 60529) and use of PC UL 94 V0 material, the enclosure withstands environmental stresses while ensuring safety and durability. Integrated options include a pressure equalisation diaphragm and direct mounting tabs.
Key Features of BoVersa:
- Transparent or translucent functional lids for displays and lighting effects
- Wide range of colour combinations for custom branding
- Open or closed versions for keyboards, displays, or seamless designs
- Hidden screws and optional die-cast aluminium covers for added stability
- Optional pole attachment accessory
- Integrated receptacle for pressure equalisation diaphragm
- Enhanced cooling fins with symmetrical airflow design
Complete Customisation & Services
BOPLA supports customers with a full box-build service, including mechanical processing, printing, engraving, lacquer finishing, PCB assembly, and custom colour schemes. A custom design sample service is also available to accelerate product development.
“With BoVersa, we are taking into account the growing requirements of users and expanding our portfolio in a targeted manner. We offer a holistic solution for numerous applications, developed on the basis of current market needs,” says Andreas Krömer, Head of Development at BOPLA.
For more information on the new BOPLA BoVersa enclosure concept call +44 (0)1296 611660, email enclosuresales@pmgb.co.uk or visit www.bopla.co.uk
About BOPLA
For more than 50 years BOPLA Gehäuse Systeme GmbH, headquartered in the East-Westphalian town of Bünde, Germany, have been developing and manufacturing application-oriented electronic enclosures made of plastic and aluminium, Touch Screen HMIs and Membrane Keypads. Their enclosure products are used in measurement, control and instrumentation applications, in machinery and plant engineering, and in medical and railway technology. BOPLA are also well-known for their exceptionally wide range of standard products which are available ex-warehouse.
BOPLA are one of the leading brands in the enclosure technology sector, always ready to support and advise customers worldwide with their development projects. BOPLA have approximately 500 employees worldwide in various production and marketing companies with 200 working at the Bünde headquarters. BOPLA are a subsidiary of the Swiss company of Phoenix Mecano AG, which ensures that our products and services are available all over the world.
In addition to manufacturing enclosures, BOPLA offer customers mechanical processing, printing and equipping. If required Bopla can offer customers full “box build” including complete assembly of a product including inspection and functional testing and integrate membrane keypads and touch displays.
BOPLA have been marketing Kundisch GmbH’s new and innovative HMI technologies in their high-end enclosure system solutions since 2021.
