FREMONT, Calif., April 2, 2026 — ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer and panel processing solutions for semiconductor and advanced packaging applications, today announced a  new branding and organization of its product portfolio into a unified, process‑based structure, referred to as the ACM Planetary Family.

Under the ACM Planetary Family, ACM’s products are organized into eight distinct families aligned with core process steps across the semiconductor manufacturing flow, collectively referred to as the Eight Planets series. This structure clarifies ACM’s expanding product portfolio, supporting alignment with evolving customer requirements across front‑end processing, advanced packaging and related applications.

“The ACM Planetary Family reflects the expansion of our product portfolio from a single cleaning product line at our founding in 1998, to a comprehensive multi-product portfolio of complementary product families today,” said Dr. David Wang, President and Chief Executive Officer of ACM. “By aligning our offerings with key process steps, we are establishing a more structured foundation for our technologies that supports our long-term strategy focused on technology differentiation, product platformization and customer globalization.”

“The new portfolio structure reinforces our commitment to customers and our product roadmaps,” Wang added. “It supports how we organize our product portfolio around evolving customer requirements, maintaining a customer-centered approach.”

ACM Planetary Family Product Lineup

• Earth Series – Cleaning tools
• Jupiter Series – Wafer-level advanced packaging tools
• Venus Series – Electroplating tools
• Mars Series – Furnace tools
• Mercury Series – Track tools
• Saturn Series – Plasma-enhanced chemical vapor deposition (PECVD) tools
• Uranus Series – Panel-level advanced packaging tools
• Neptune Series – Stress-free polishing tools

About ACM Research, Inc.

ACM develops, manufactures and sells semiconductor process equipment spanning cleaning, electroplating, stress-free polishing, vertical furnace processes, track, PECVD, and wafer- and panel-level packaging tools, enabling advanced and semi-critical semiconductor device manufacturing. ACM is committed to delivering customized, high-performance, cost-effective process solutions that semiconductor manufacturers can use in numerous manufacturing steps to improve productivity and product yield. For more information, visit www.acmr.com.