Ventec International, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, is participating at the 2017 DesignCon show in Santa Clara, CA, USA from 31st January to 2nd February as both an exhibitor on booth #118 and technical presenter. The presentation will unveil the industry’s most advanced ultra-low Dk PCB materials for high-speed low-loss applications.

Ventec will be participating at DesignCon 2017, the premier conference for chip, board, and systems design engineers, on booth #118 and has specifically chosen the event as the ideal platform to unveil the industry’s latest advances in PCB materials for high-speed low-loss applications. Ventec’s Martin Cotton (Director – OEM Technology Marketing) and Bill Wang (Technical Director) will be presenting their paper titled “Ultra-Low Dk PCB Materials for High-Speed Low-Loss Applications” in Ballroom F on Wednesday, 1stFebruary at 8:00am. 

The technical presentation will demonstrate how lower losses and lower system power requirements are realized by using an ultra-low Dk material with Dk values between 2.3 and 2.8.

“By lowering the material Dk to ultra-low levels using FR4 processes, the delicate balance of performance and cost is achieved”, said Martin Cotton. “Higher layer counts on backplanes, daughter cards and hand-held’s are achieved in a smaller footprint by having smaller layer to layer separation without sacrificing trace width. Having potentially wider traces produces lower resistance in the signal path” he continues. “Combining ultra-low Dk with a low Df of 0.002 to 0.004, produces an alternative to ever smaller traces and higher power requirements.”

For more information about Ventec’s solutions and the company’s wide variety of products, please visit www.venteclaminates.com and/or download the Ventec APP.