Hsinchu, Taiwan, 12 January, 2017 – Macronix International Co., Ltd. (TSE: 2337), a leading integrated device manufacturer in the Non-Volatile Memory (NVM) market, today announced that the NAND MCP memory solution has been adopted and incorporated by Qualcomm Technologies Inc., a subsidiary of Qualcomm Incorporated as a part of the reference design for a Qualcomm Technologies’ LTE Cat. M1/NB-1 chipset, the MDM9206 modem.
Macronix’s industry-standard multichip packages (MCPs) combine RAM and Flash memories into one package, satisfying the demands of today’s consumers on their mobile and connected devices. The NAND MCP is co-developed with our strategic RAM partner, AP Memory. With minimal footprint, excellent performance and the high quality and power efficiency, the Macronix NAND MCPs offer an ideal integrated memory solution for this rapidly growing market. In addition, the Macronix Product Longevity Program brings reliable and sustainable memory support.
The features of Macronix NAND MCP memory products significantly contribute to system efficiency in ways not achievable with competitive solutions.
“Being incorporated in Qualcomm Technologies’ reference design for its latest LTE MDM9206 modem is an important accomplishment for our MCP solutions,” said Macronix VP Marketing, F.L. Ni. “The Internet of Things is the next revolution in the mobile ecosystem, and it’s great to be a part of powering the devices of the future.”
About Macronix
Macronix, a leading integrated device manufacturer in the non-volatile memory (NVM) market, provides a full range of NOR Flash, NAND Flash, and ROM products. With its world-class R&D and manufacturing capability, Macronix continues to deliver high-quality, innovative and performance-driven products to its customers in the consumer, communication, computing, automotive, networking and other market segments.
Find out more at www.macronix.com.
About AP Memory
AP Memory is a memory IC design company with focus on Mobile DRAM based specialty memory products for mobile, wearable and IoT (Internet of Things) devices. Partnering with advanced DRAM technology fab foundries, AP Memory provides, world class performance and quality, Mobile RAM KGD (Known-Good-Die) solutions to mobile communication processor SiP (System-in-Package), non-volatile memory MCP (Multi-Chip-Package) and other applications. The AP Memory product portfolio includes innovatively customized low density PSRAM (Pseudo-SRAM) and JEDEC standard Low-Power DRAM.
