Waterloo, Ontario  —  May 24, 2016   –  Pixus Technologies, a provider of embedded computing and enclosure solutions, has upgraded its 1U MicroTCA enclosure system to PCIe Gen 3.  The company will continue to upgrade its various configurations of MicroTCA solutions to the higher-speed standard.

The Pixus PXS0108 MicroTCA chassis platform features 6 Advanced Mezzanine Card (AMC) slots and 1 MicroTCA Carrier Hub (MCH) slot.  Various power options are available, including a dual redundant configuration.  The PXS0108 has an active backplane that alleviates the need for expensive Power Modules (PMs). The backplane provides a power manager for each slot that controls and limits the management and payload power to the maximum allowed.

PCIe Gen 3 brings the backplane speed to 8 GB/s in single x8 or dual x4 options.  Other backplanes are available including 10 Gigabit Ethernet.  The chassis can accept up to 3 Full Size AMC modules in lieu of the 6 Mid Size modules. 

Pixus offers MicroTCA system platforms and AMCs in various sizes and configurations.  The company also provides OpenVPX and AdvancedTCA backplane/chassis systems, boards, and components.

About Pixus Technologies

Leveraging over 20 years of innovative standard products, the Pixus team is comprised of industry experts in electronics packaging. Founded in 2009 by senior management from Kaparel Corporation, a Rittal company, Pixus Technologies’ embedded backplanes and systems are focused primarily on  ATCA, OpenVPX, MicroTCA, and custom designs.    Pixus also has an extensive offering of VME-based and cPCI-based solutions.   In May 2011, Pixus Technologies became the sole authorized North and South American supplier of the electronic packaging products previously offered by Kaparel Corporation and Rittal.