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KLA-Tencor to Present on Intelligent Feed-Forward of Non-Litho Errors for 3D Patterning at the APC Conference

MILPITAS, Calif., Sept. 23, 2014— KLA-Tencor Corporation, a leading provider of process control and yield management solutions, today announced that John Robinson, director of marketing in its Parametric Solutions Group, will present a paper on the topic of non-lithographic errors for 3D patterning at the APC Conference 2014. Held at the University of Michigan, Ann Arbor Sept. 29 – Oct. 1, the conference addresses the extremely complex manufacturing processes that the semiconductor, photovoltaic, display, MEMS, LED and other relevant industries are experiencing. Greater yield, quality, and cost objectives have placed a high importance on advanced process control, and the conference will focus on recent technical advancements, current challenges, and future needs and trends.

KLA-Tencor’s John Robinson, Ph.D., will present “Intelligent Feed-Forward of Non-Litho Errors for 3D Patterning,” and speak to how the drive for improved transistors at the lowest cost per transistor has led to innovations including multi-patterning and spacer pitch splitting. As this transition occurs, a much higher number of non-litho steps that are required to define the final pattern. Key contributors such as etch and deposition now play an increased role in the patterning process and in final device performance, and patterning control has become more complex as non-litho errors dominate pattern variations. The future is an intelligent combination of feed-forward and feedback – resulting in improved process control, reduced total variation, and ultimately better patterning.

Session Title/Code: Technical Sessions

Date and Time: Tuesday, Sept. 30, from 11:30 a.m. to 12:00 p.m. EST

Title:  Intelligent Feed-Forward of Non-Litho Errors for 3D Patterning

Location: Rackham Building, University of Michigan, Ann Arbor

About John Robinson

John Robinson, Ph.D. is director of product marketing in the Parametric Solutions Group at KLA-Tencor Corporation, contributing to the 5D™ patterning control solution program. He has also held positions in applications engineering, lithography applications management,  and product marketing.  Prior to joining KLA-Tencor Robinson was a senior photolithography process engineer in Motorola’s Advanced Products Research and Development Lab.  He has authored more than 50 technical publications and patents. 

About KLA-Tencor

KLA-Tencor Corporation, a leading provider of process control and yield management solutions, partners with customers around the world to develop state-of-the-art inspection and metrology technologies. These technologies serve the semiconductor, LED and other related nanoelectronics industries. With a portfolio of industry-standard products and a team of world-class engineers and scientists, the company has created superior solutions for its customers for more than 35 years. Headquartered in Milpitas, Calif., KLA-Tencor has dedicated customer operations and service centers around the world. Additional information may be found at http://www.kla-tencor.com (KLAC-C).

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