Engineers at the University of California (UC) Davis have invented a so-called nanoglue that could be used in microchip fabrication.
Conventional glues form a thick layer between two surfaces. Prof Tingrui Pan’s nanoglue, which conducts heat and can be printed, or applied in patterns, forms a layer the thickness of only a few molecules.
According to a statement, the nanoglue is based on a transparent, flexible material called polydimethylsiloxane (PDMS), which, when peeled off a smooth surface, usually leaves behind an ultra-thin, sticky residue that researchers had mostly regarded as a nuisance.
via the engineer
March 6, 2012
