CMP/CMC/MOSIS partner to introduce a 3D-IC process
Grenoble, France, 22 June 2010, CMP/CMC/MOSIS are partnering to offer a 3D-IC MPW service based on Tezzaron’s SuperContact technology and GLOBALFOUNDRIES 130nm CMOS.
The first MPW run is targeting January 2011:
- 2-tier face-to-face bonded wafers
- 130nm CMOS process for both tiers
- Top tier exposing TSV and backside metal pads for wire bonding.
A design-kit supporting 3D-IC design with standard-cells and IO libraries is available. Further MPW runs will be scheduled supporting process flavors (multiple tiers beyond 2, different CMOS flavors for different … Read More → "CMP/CMC/MOSIS partner to introduce a 3D-IC process"

