Lowering Power at 28nm with Xilinx 7 Series FPGAs

by Jim Turley

This whitepaper describes several aspects of power related to the Xilinx® 28nm 7 series FPGAs, including the TSMC 28nm high-k metal gate (HKMG), high performance, low power (28nm HPLor 28 HPL) process choice.

The power benefits afforded by the 28 HPL process and its usefulness across Xilinx’s full product offerings is described as well as the architectural innovations and features for power reduction across the dimensions of static power, dynamic power, and I/O power.

Click here to download this whitepaper.

Agilex™ 3 vs. Certus-N2 Devices: Head-to-Head Benchmarking on 10 OpenCores Designs

Sponsored by Altera

Explore how Agilex™ 3 FPGAs deliver up to 2.4× higher performance and 30% lower power than comparable low-cost FPGAs in embedded applications. This white paper benchmarks real workloads, highlights key architectural advantages, and shows how Agilex 3 enables efficient AI, vision, and control systems with headroom to scale.

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featured chalk talk

High Power Charging Inlets

Sponsored by Mouser Electronics and TE Connectivity

All major truck and bus OEMs will be launching electric vehicle platforms within the next few years and in order to keep pace with on-highway and off-highway EV innovation, our charging inlets must also provide the voltage, current and charging requirements needed for these vehicles. In this episode of Chalk Talk, Amelia Dalton and Drew Reetz from TE Connectivity investigate charging inlet design considerations for the next generation of industrial and commercial transportation, the differences between AC only charging and fast charge and high power charging inlets, and the benefits that TE Connectivity’s ICT high power charging inlets bring to these kinds of designs.

Click here for more information about TE Connectivity High Power Charging Inlets

Aug 30, 2024

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Lowering Power at 28nm with Xilinx 7 Series FPGAs

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