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ADLINK Announces COM Express Module with Intel’s Latest Graphics Core and DDR3 Memory Support

San Jose, Calif, January 5, 2010  ADLINK Technology, Inc., a global provider of trusted embedded products, unveiled the Express-MV, the newest and highest-performance member of the ADLINK Computer-on-Module family. The Express-MV is a COM Express™ Type 2 module supporting the Intel® Core™2 Duo and Celeron® M processors. Based on the Intel® GS45 Express Graphic Controller Hub SFF (Small Form Factor) and the Intel® I/O Controller Hub ICH9M-SFF, the Express-MV has outstanding graphics performance and is specifically designed for high-end data and media-processing applications.

Greater Performance-per-Watt for Power-Sensitive Applications

Equipped with the 45 nm Intel® Core™2 Duo processor, the Express-MV is available with a clock speed of up to 2.26 GHz. Combined with up to 8 GB of DDR3 dual-channel memory at 800/1067 MHz, the Express-MV provides higher data-transfer speed at 30% less power consumption compared with DDR2 memory. The Express-MV is designed for embedded applications with high demands on data-processing and high-end graphics performance. Its target application areas are Medical Diagnostic Equipment and Medical Imaging, Digital Signage, Infotainment, Industrial Automation, Gaming, Video Preprocessing, POS and Kiosk.

Leading Graphics Performance

The Express-MV integrates the Mobile Intel® Graphics Media Accelerator 4500MHD, which supports Microsoft® Direct X10, Shader Model 4.0 and OpenGL 2.0. The Intel® GMA 4500MHD provides high-level features such as hardware decoding for MPEG2 and Intel® Clear Video Technology. The Express-MV also supports Intel® Dynamic Video Memory Technology 5.0 (Intel® DVMT 5.0).

“In accordance with higher data transfer and performance-per-watt needs, the Express-MV combines the 45 nm Intel® Core™2 Duo CPU, GS45 chipset and DDR3 memory in one module. It is a comprehensive package that perfectly fits the needs of customers who are seeking an advanced graphics performance and energy-saving, low power consumption solution in small form factor,” explained Henk van Bremen, Product Director for ADLINK Embedded Division. “With reduced power consumption and the latest integrated graphics controller, customers can access high-performance graphics and space-saving features with modest investment, that is also backed by Intel’s seven year production lifetime support,” said van Bremen.

Express-MV Feature Set

The Express-MV combines the Intel® Core™2 Duo processor with Intel’s GS45 Express Chipset. The chipset consists of the GS45/ICH9M-SFF North- and Southbridge and supports up to 8 GB of dual-channel DDR3 800/1067MHz memory on two stacked SODIMM sockets. The Intel® GS45 Express chipset integrates a Mobile Intel® Graphics Media Accelerator 4500MHD that provides CRT, single/dual channel 18/24-bit LVDS and TV-out (SDTV and HDTV).

In addition to the onboard integrated graphics, a PCI Express® Graphics x16 (PEG x16) bus for SDVO/HDMI/DisplayPort or general purpose x8, x4 or x1 PCI Express devices is also supported. Up to six additional PCI Express® x1 lanes are also available from the Southbridge.

The Express-MV also features a single onboard Gigabit Ethernet port and four SATA/300 ports. Legacy support is provided for a single IDE channel, 32-bit PCI, LPC, SMBus and I2C. The module is equipped with an AMIBIOS8® supporting embedded features such as remote console, CMOS backup, CPU and system monitoring, and watchdog timer.

PICMG COM Express Carrier Design Guide Subcommittee

ADLINK currently chairs the PICMG COM Express Carrier Design Guide subcommittee. The recently released COM Express Carrier Design Guide aims to increase the use of COM Express modules by defining a set of carrier design guidelines that enable interoperability and increase compatibility between COM Express modules from various vendors. More information on the Carrier Design Guide and ADLINK’s latest COM Express Reference Carrier Board can be found at http://www.adlinktech.com/news/news_detail.php?file=Products/n_2009_8.htm.

ADLINK’s Full Computer-on-Module Product Line

ADLINK’s complete Computer-on-Module product family includes ETX® modules for PCI/ISA oriented designs and COM Express modules for PCI Express / PCI designs with optional legacy support through LPC. To evaluate or test our modules, prototype boards in ATX form factor are available.

Carrier Board Design and Manufacturing Support

ADLINK provides Schematics, mechanical files, design guides, R&D support, product review service and BIOS customization for companies that are doing their own carrier board design. ADLINK also offers full development and production services for those who wish to outsource their carrier board’s design and/or manufacturing.

Price and Availability

The Express-MV COM Express module is currently available at a list price of $495.

About ADLINK

ADLINK Technology (www.adlinktech.com) provides a wide range of embedded computing products and services to the test & measurement, automation & process control, gaming, communications, medical, network security, and transportation industries. ADLINK products include PCI Express®-based data acquisition and I/O; vision and motion control; and AdvancedTCA, CompactPCI, and Computer-on-Modules (COMs) for industrial computing. With the acquisition of Ampro Computers, Inc., ADLINK also provides a wide range of Extreme Rugged and Rugged Single Board Computers, Computer-on-Modules and Systems under the brand name Ampro by ADLINK. ADLINK strives to minimize the total cost of ownership (TCO) of its customers by providing customization and system integration services, maintaining low manufacturing costs, and extending the lifecycle of its products. ADLINK is a global company with headquarters and manufacturing in Taiwan; R&D and integration in Taiwan, China, and the US; and an extensive network of worldwide sales and support offices.

ADLINK is ISO-9001, ISO-14001, and TL9000 certified, is an Associate Member of the Intel® Embedded and Communications Alliance, an Executive Member of PICMG, and a Sponsor Member of the PXI Systems Alliance. ADLINK is a publicly traded company listed on the TAIEX Taiwan Stock Exchange (stock code: 6166).

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Mentor Graphics Supports the Canon India Design Centre’s Migration to OVM

WILSONVILLE, Ore.–(BUSINESS WIRE)–Mentor Graphics Corporation (NASDAQ:MENT) today announced that the Canon India Design Centre has successfully deployed theQuesta® advanced verification platform with SystemVerilog as a next-generation HVL and Open Verification Methodology (OVM)-based verification environment.

The Canon India Design Centre chose the Questa advanced verification platform, combined with the OVM, to ensure the highest level of modularity, productivity and reuse for the verification of Canon India’s complex and highly compute-intensive integrated circuit (IC) designs. In particular, the Canon India Design Centre verification team used SystemVerilog with OVM for verifying multi-layered communication IP.

“The OVM defines the concept of ‘object oriented’ for verification environment in a systematic way,” said Sunil Kashide, Verification head at the Canon India Design Centre. “We were able to define and build the verification architecture much more robust and modular. Mentor India has given extensive support in understanding and exercising the different concepts. With OVM, we could reduce the overall timeline by bringing parallelism into execution.”

“Mentor Graphics’ team has provided us extended support during the evaluation phase,” said Dhanaji Kamble, Design Centre head. “We could successfully build the domain expertise and boost team confidence for the next-generation verification methodology.”

“The OVM was developed to deliver ready-to-use, reusable, and scalable testbench components within a proven, repeatable methodology,” said John Lenyo, general manager of Mentor’s Functional Verification division. “The combination of industry-leading SystemVerilog support and OVM-specific debug capabilities in the Questa functional verification environment has helped customers like Canon India quickly get successful results in real projects.”

About the Open Verification Methodology (OVM)

The OVM is based on the IEEE 1800 SystemVerilog standard and supports design and verification engineers developing advanced verification environments that offer higher levels of integration and portability of Verification IP. The methodology is non-vendor specific and is interoperable with multiple languages and simulators. The OVM is fully open and includes a robust class library and source code that is available for download. Visit http://www.ovmworld.org for more information.

About Canon India

Canon India Private Limited, India’s No. 1 Complete Digital Imaging Company, started the software development centre ISDC (India Software Development Centre) in 1999. The ISDC is comprised of multiple divisions, namely SDC (Software Development Centre), CoE (Centre of Excellence) and Design Centre. SDC and CoE are located at Noida and Design Centre is located at Bangalore.

The Design Centre at Bangalore started in 2008 with a vision to focus on VLSI/ASIC Design and Firmware/Software development. The key areas of focus for the ASIC Design group are: IP development, Verification IP Development, SoC (System on Chip) architecture and development, Post-silicon Validation, and FPGA prototyping. The group is well skilled to tape-out the multi-million gate count SoC with 45nm and 65nm technology. The verification team is highly skilled to work in state-of-the-art verification methodologies.

About Mentor Graphics

Mentor Graphics Corporation (NASDAQ:MENT) is a world leader in electronic hardware and software design solutions, providing products, consulting services and award-winning support for the world’s most successful electronics and semiconductor companies. Established in 1981, the company reported revenues over the last 12 months of about $800 million and employs approximately 4,425 people worldwide. Corporate headquarters are located at 8005 S.W. Boeckman Road, Wilsonville, Oregon, 97070-7777. World Wide Web site:http://www.mentor.com/.

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