Manufacturers cover themselves by saying 'Contents may settle' in fine print on the package, to which I reply, 'Pull the other one'it's got bells on it!'...
Explore how Agilex™ 3 FPGAs deliver up to 2.4× higher performance and 30% lower power than comparable low-cost FPGAs in embedded applications. This white paper benchmarks real workloads, highlights key architectural advantages, and shows how Agilex 3 enables efficient AI, vision, and control systems with headroom to scale.
Reliability is cornerstone to all electronic designs today, but how reliability is implemented and determined can vary widely by different market segments. In this episode of Chalk Talk, Amelia Dalton and Sam Accardo from the YAGEO Group explore the definition of reliability for electronic components, investigate the different grades of reliability offered by the YAGEO Group and the various steps that the YAGEO Group is taking to ensure the greatest reliability of their components.