March 2, 2009
featured blogs
Jul 25, 2025
Manufacturers cover themselves by saying 'Contents may settle' in fine print on the package, to which I reply, 'Pull the other one'it's got bells on it!'...
featured paper
 Agilex™ 3 vs. Certus-N2 Devices: Head-to-Head Benchmarking on 10 OpenCores DesignsSponsored by Altera Explore how Agilex™ 3 FPGAs deliver up to 2.4× higher performance and 30% lower power than comparable low-cost FPGAs in embedded applications. This white paper benchmarks real workloads, highlights key architectural advantages, and shows how Agilex 3 enables efficient AI, vision, and control systems with headroom to scale. |
featured chalk talk
Power Modules and Why You Should Use Them in Your Next Power Design
Sponsored by Mouser Electronics and Texas Instruments
In this episode of Chalk Talk, Amelia Dalton and Christine Chacko from Texas Instruments explore a variety of power module package technologies, examine the many ways that power modules can help save on total design solution cost, and the unique benefits that Texas Instruments power modules can bring to your next design.