a techfocus media publication

July 8, 2020

 

Startup Introduces MEMS Speaker

xMEMS Says it’s Made the First All-MEMS Speaker for Wearables

by Jim Turley

“Happy is the hearing man; unhappy the speaking man.” – Ralph Waldo Emerson

There’s something about MEMS that seems almost magical, like tiny machines forged by elves. We think nothing of a 7nm CMOS die with billions of transistors, but a wee electromechanical accelerometer with moving parts seems otherworldly. 

So, it’s no small feat when a startup company produces a tiny MEMS speaker, suitable for your next set of AirPods, hearing aid, or Bluetooth headset. We’ve had MEMS microphones for a while, but MEMS speakers are rare. Maybe even unique, depending on who you ask. 

 Read More

 
Lattice Launches Certus-NX
Lights-up Low-End FPGA Market
by Kevin Morris
DLC for BMW
You’ll Subscribe to Your Own Car
by Jim Turley
DSP Group Dives into the Hearables Market

by Max Maxfield
What Roller Coasters Can Teach Us About Economics
There’s Something Behind the Game Theory
by Jim Turley

Articles Archive

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Max\\\'s Cool Beans
Jul 6, 2020
If you were in the possession of one of these bodacious beauties, what sorts of games and effects would you create using the little scamp?...

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Inside the IoT

Jul 3, 2020
[From the last episode: We looked at CNNs for vision as well as other neural networks for other applications.] We'€™re going to take a quick detour into math today. For those of you that have done advanced math, this may be a review, or it might even seem to be talking down...

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Samtec, Inc.
Jul 2, 2020
In June, we continued to upgrade several key pieces of content across the website, including more interactive product explorers on several pages and a homepage refresh. We also made a significant update to our product pages which allows logged-in users to see customer-specifi...

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July 7, 2020

videantis Processor Platform Adopted for TEMPO Neuromorphic Edge AI Chip

Renesas Advanced Automotive SoC Adopted by Continental for Its Body High-Performance Computer

KEMET Introduces Three New Series of Film Capacitors for Rapidly Expanding Green Energy and Automotive Applications

JLQ Technology Selects Synopsys DesignWare IP to Accelerate Development of Next-Generation SoCs

RS Components joins forces with VEX Robotics to set summer STEM coding challenge

July 6, 2020

Medical Device PCB Standard Reaches New Milestone, Aims for Late Summer Industrial Launch

Compact, Rugged Power System Provides Reliable Charging in Remote Locations

ON Semiconductor to Provide Danfoss with High Power Devices for Inverter Traction Modules

July 3, 2020

Saelig Introduces the Cambrionix ‘ModIT’ Modular USB Phone Charging Station

LinkSwitch-TN2 High-Voltage Switcher ICs from Power Integrations Now Certified for Automotive Use

Pasternack Introduces New Line of In Stock Bi-Phase Modulators Operating in Frequency Bands from 0.5 to 40 GHz

New PXI Multi-Function Card from Marvin Test Solutions

July 2, 2020

New Development Chassis From Pixus Technologies Supports Dual Board Depths, SpaceVPX

IC’Alps launches its new website for Application Specific Integrated Circuits design & supply activities

RDS enhances embedded systems solutions capability

GaN Systems Shows Why GaN is a Game Changer at PCIM 2020

Fairview Microwave Introduces New SOLT Calibration Kits with Four Additional Interconnect Options

July 1, 2020

Magnetic Sensors – TDK brings redundancy to its TMR angle sensor portfolio and aligns with ASIL D safety standard

Telit Launches Low-Cost, High-Security, Low-Power IoT Module with Fully Integrated 802.11n and Bluetooth Low Energy

New silicon carbide power module for electric vehicles

VadaTech Announces a new 3U VPX, Dual ADC 12-bit @ 6.4 GSPS or Quad ADC @ 3.2 GSPS with Virtex UltraScale+

Performance gains in new digital X-ray readout IC from ams achieve clearer images at lower radiation doses

 
 

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Featured Video

Product Update: Advances in DesignWare Die-to-Die PHY IP

Sponsored by Synopsys

Hear the latest about Synopsys' DesignWare Die-to-Die PHY IP for SerDes-based 112G USR/XSR and parallel-based HBI interfaces. The IP, available in advanced FinFET processes, addresses the power, bandwidth, and latency requirements of high-performance computing SoCs targeting hyperscale data center, AI, and networking applications.

Click here for more information about DesignWare Die-to-Die PHY IP Solutions

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Featured Paper

Cryptography: A Closer Look at the Algorithms

Sponsored by Maxim Integrated

Get more details about how cryptographic algorithms are implemented and how an asymmetric key algorithm can be used to exchange a shared private key.

Click here to download the whitepaper

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Featured Chalk Talk

uPOL Technology

Sponsored by Mouser Electronics and TDK

Power modules are a superior solution for many system designs. Their small form factor, high efficiency, ease of design-in, and solid reliability make them a great solution in a wide range of applications. In this episode of Chalk Talk, Amelia Dalton chats with Tony Ochoa of TDK about the new uPOL family of power modules and how they can deliver the power in your next design.

Click here for more information about TDK FS1406 µPOL™ DC-DC Power Modules

uPOL Technology — TDK and Mouser Electronics

   Power modules are a superior solution for many system designs. Their small form factor, high efficiency, ease of design-in, and solid reliability make them a great solution in a wide range of applications. In this episode of Chalk Talk, Amelia Dalton chats with Tony Ochoa of TDK about the new uPOL family of … Read More → "uPOL Technology — TDK and Mouser Electronics"

Next Generation Connectivity and Control Concepts for Industry 4.0 — Molex and Mouser Electronics

   Industry 4.0 promises major improvements in terms of efficiency, reduced downtime, automation, monitoring, and control. But Industry 4.0 also demands a new look at our interconnect solutions. In this episode of Chalk Talk, Amelia Dalton chats with Mark Schuerman of Molex about Industry 4.0 and how to choose the right connectors for your … Read More → "Next Generation Connectivity and Control Concepts for Industry 4.0 — Molex and Mouser Electronics"

Benefits of FPGAs & eFPGA IP in Futureproofing Compute Acceleration

   In the quest to accelerate and optimize today’s computing challenges such as AI inference, our system designs have to be flexible above all else. At the confluence of speed and flexibility are today’s new FPGAs and e-FPGA IP. In this episode of Chalk Talk, Amelia Dalton chats with Mike Fitton from Achronix about … Read More → "Benefits of FPGAs & eFPGA IP in Futureproofing Compute Acceleration"

Rail Data Connectivity — TE Connectivity and Mouser Electronics

  The rail industry is undergoing a technological revolution right now, and Ethernet connectivity is at the heart of it. But, finding the right interconnect solutions for high-reliability applications such as rail isn’t easy. In this episode of Chalk Talk, Amelia Dalton chats with Egbert Stellinga from TE Connectivity about TE’s portfolio of interconnect solutions … Read More → "Rail Data Connectivity — TE Connectivity and Mouser Electronics"

Keeping Your Linux Device Secure — Mentor

   Embedded security is an ongoing process, not a one-time effort. Even after your design is shipped, security vulnerabilities are certain to be discovered – even in things like the operating system. In this episode of Chalk Talk, Amelia Dalton chats with Kathy Tufto from Mentor – a Siemens business, about how to make … Read More → "Keeping Your Linux Device Secure — Mentor"

Electronic Fuses (eFuses) — ON Semiconductor and Mouser Electronics

   Today’s advanced designs demand advanced circuit protection. The days of replacing old-school fuses are long gone, and we need solutions that provide more robust protection and improved failure modes. In this episode of Chalk Talk, Amelia Dalton chats with Pramit Nandy of ON Semiconductor about the latest advances in electronic fuses, and how … Read More → "Electronic Fuses (eFuses) — ON Semiconductor and Mouser Electronics"


 
TNG of DFT
Hi Max, Back in the dark ages (1990/91 timeframe) I had the opportunity to design an ASIC. At that time the existing FPGAs were not big enough or fast enough to handle what I needed to do so I got to dip my toe into ASICs. This was before HDLs were ...

posted by tjburke on Jul 1 at 7:26am

 
 
Ultimate Guide to Switch Debounce (Part 9)
Regarding the code snippet shown above for a method of debouncing, I appreciate it is just a prototype of actual usable code, but there is a subtle flaw which needs to be addressed. I came across this problem in my last project where I was using Visual Basic under Windows ...

posted by Ian Johns on Jun 29 at 8:44am

 
 
Didja Hear the One About the 3¢ MCU?
There's lots more about this on Dave Jones' (in)famous EEVblog -- he's been digging into these for probably close to a year now.

posted by ericwertz on Jun 27 at 11:13pm

 
 
Didja Hear the One About the 3¢ MCU?
BTW2: A cole cents for micro is not unheard of. I think some big players have itnrduced a few names in that price bracket, but that was for high-volume orders. Only substatnial change here is that this one serves hign-volumes in CHina, but would like to expand into the world, ...

posted by Brane212 on Jun 24 at 10:44pm

 
 
 
 
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