a techfocus media publication

April 14, 2021

 

The First Emulators of Spring

New Capabilities Address Verification Challenge

by Kevin Morris

It’s the season of rebirth. The sun is out. Flowers are in bloom. Birds busily build nests while semiconductor verification teams emerge from their long winter hibernation, ready to tool up for the challenges of the next process generation. Billions of unverified gates give shelter to countless bugs awaiting anxious design teams as they prepare for summer’s tape-outs and struggle to bring new software up on wobbly legs.

 Read More

 
Parsing Google v. Oracle: What’s It Really Mean?
Long-Running Code Copyright Case Seems Finally Settled
by Jim Turley
ID for the IoT? We Need the IDoT!

by Max Maxfield
AMD Details Potential Ryzen Attack Vector
Publishes New Side-Channel Vulnerability in Zen 3 Processors
by Jim Turley
ARMv9: Fashionably Late
Latest Update to ARM Architecture Aids Security, AI, Performance
by Jim Turley

Articles Archive

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Synopsys
Apr 13, 2021
We explain the NHTSA's latest automotive cybersecurity best practices, including guidelines to protect automotive ECUs and connected vehicle technologies. The post NHTSA Shares Best Practices for Improving Autmotive Cybersecurity appeared first on From Silicon To Software....

More from Synopsys...


Cadence
Apr 13, 2021
If a picture is worth a thousand words, a video tells you the entire story. Cadence's subsystem SoC silicon for PCI Express (PCIe) 5.0 demo video shows you how we put together the latest... [[ Click on the title to access the full blog on the Cadence Community site. ]]...

More from Cadence...


Siemens Digital Industries Software
Apr 12, 2021
The Semiconductor Ecosystem- It is the definition of '€œHigh Tech'€, but it isn'€™t just about… The post Calibre and the Semiconductor Ecosystem appeared first on Design with Calibre....

More from Siemens Digital Industries Software...


Samtec, Inc.
Apr 8, 2021
We all know the widespread havoc that Covid-19 wreaked in 2020. While the electronics industry in general, and connectors in particular, took an initial hit, the industry rebounded in the second half of 2020 and is rolling into 2021. Travel came to an almost stand-still in 20...

More from Samtec, Inc....


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April 13, 2021

NVIDIA Unveils NVIDIA DRIVE Atlan, an AI Data Center on Wheels for Next-Gen Autonomous Vehicles

FormFactor Introduces Automated Cryogenic System to Accelerate Quantum Computing Development

u-blox extends reach of secure LTE-M, NB-IoT module with 400MHz support

Renesas Strengthens RL78 Family of Low-Power MCUs with 16-Bit General-Purpose RL78/G23

Digital DC/DC converter delivers 1300 W in half-brick package for RF Power Amplifier applications

Silex Insight and Andes Technology extend strategic partnership to deliver flexible and scalable Root-of-Trust security IP solution​

E-PEAS & Steliau Announce High-Profile Collaboration to Further Promote Energy Harvesting Innovation

Percepio and Lauterbach Announce Collaboration for Faster Debugging

Power Integrations’ HiperPFS-4 Power Factor Correction IC Delivers 98% Full-Load Efficiency

Synopsys Study Shows Uptick in Vulnerable, Outdated, and Abandoned Open Source Components in Commercial Software

NVIDIA Extends Data Center Infrastructure Processing Roadmap with BlueField-3

Swiss National Supercomputing Centre, Hewlett Packard Enterprise and NVIDIA Announce World’s Most Powerful AI-Capable Supercomputer

April 12, 2021

NVIDIA Partners with Schrödinger to Further Accelerate Drug Discovery Worldwide

NVIDIA Announces New DGX SuperPOD, the First Cloud-Native, Multi-Tenant Supercomputer, Opening World of AI to Enterprise

STMicroelectronics Introduces New MasterGaN4 Devices for High-Efficiency Power Conversion up to 200 Watts

April 9, 2021

Compact, conduction cooled 75W AC-DC power supply module for challenging and space-critical applications

L-com Releases New Fiber Optic MPO Fan-Out Cables, Cassettes, Sub-Panels and Rack-Mount Chassis

iWave Systems introduces Security Suite for NXP i.MX Applications Processors to secure connected devices

Cadence Delivers Automotive Reference Flow for Samsung Foundry 14LPU Process Technology

Cadence Collaborates with Samsung Foundry to Accelerate Hyperscale Computing SoC Design for Process Nodes Down to 4nm

 
 

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featured video

The Verification World We Know is About to be Revolutionized

Sponsored by Cadence Design Systems

Designs and software are growing in complexity. With verification, you need the right tool at the right time. Cadence® Palladium® Z2 emulation and Protium™ X2 prototyping dynamic duo address challenges of advanced applications from mobile to consumer and hyperscale computing. With a seamlessly integrated flow, unified debug, common interfaces, and testbench content across the systems, the dynamic duo offers rapid design migration and testing from emulation to prototyping. See them in action.

Click here for more information

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featured video

Meeting Cloud Data Bandwidth Requirements with HPC IP

Sponsored by Synopsys

As people continue to work remotely, demands on cloud data centers have never been higher. Chip designers for high-performance computing (HPC) SoCs are looking to new and innovative IP to meet their bandwidth, capacity, and security needs.

Click here for more information

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featured chalk talk

Complete Packaging for IIoT Devices

Sponsored by Mouser Electronics and Phoenix Contact

Industrial Internet of Things (IIoT) design brings a new level of demands to the engineering team, particularly in areas like thermal performance, reliability, and scalability. And, packaging has a key role to play. In this episode of Chalk Talk, Amelia Dalton chats with Joel Boone of Phoenix Contact about challenges and solutions in IIoT design packaging.

Click here for more information about Phoenix Contact ICS 50 Enclosure System

Easy Hardware and Software Scalability across Renesas RA MCUs — Renesas

  There are a bewildering number of choices when designing with an MCU. It can be a challenge to find one with exactly what your design requires – form factor, cost, power consumption, performance, features, and ease-of-use. In this episode of Chalk Talk, Amelia Dalton chats with Brad Rex of Renesas about the small-but-powerful Renesas … Read More → "Easy Hardware and Software Scalability across Renesas RA MCUs — Renesas"

FPGAs Advance Data Acceleration in the Digital Transformation Age — Achronix

  Acceleration is becoming a critical technology for today’s data-intensive world. Conventional processors cannot keep up with the demands of AI and other performance-intensive workloads, and engineering teams are looking to acceleration technologies for leverage against the deluge of data. In this episode of Chalk Talk, Amelia Dalton chats with Tom Spencer of Achronix about … Read More → "FPGAs Advance Data Acceleration in the Digital Transformation Age — Achronix"

Yield Explorer and SiliconDash — Synopsys

  One a design goes to tape-out, the real challenges begin. Teams find themselves drowning in data from design-process-test during production ramp-up, and have to cope with data from numerous sources in different formats in the manufacturing test supply chain. In this episode of Chalk Talk, Amelia Dalton chats with Mark Laird of Synopsys in … Read More → "Yield Explorer and SiliconDash — Synopsys"

Complete Packaging for IIoT Devices — Phoenix Contact and Mouser Electronics

  Industrial Internet of Things (IIoT) design brings a new level of demands to the engineering team, particularly in areas like thermal performance, reliability, and scalability. And, packaging has a key role to play. In this episode of Chalk Talk, Amelia Dalton chats with Joel Boone of Phoenix Contact about challenges and solutions in IIoT … Read More → "Complete Packaging for IIoT Devices — Phoenix Contact and Mouser Electronics"

In-Chip Sensing and PVT Monitoring — Synopsys

  In-chip monitoring can significantly alter the lifecycle management landscape. By taking advantage of modern techniques, today’s more complex designs can be optimized even after they are deployed. In this episode of Chalk Talk, Amelia Dalton chats with Stephen Crosher of Synopsys about silicon lifecycle management and how to take full advantage of the optimization … Read More → "In-Chip Sensing and PVT Monitoring — Synopsys"

Silicon Lifecycle Management (SLM) — Synopsys

  Wouldn’t it be great if we could keep on analyzing our IC designs once they are in the field? After all, simulation and lab measurements can never tell the whole story of how devices will behave in real-world use. In this episode of Chalk Talk, Amelia Dalton chats with Randy Fish of Synopsys about … Read More → "Silicon Lifecycle Management (SLM) — Synopsys"


 
ID for the IoT? We Need the IDoT!
RedBarn, I agree that companies need to overhaul their "software supply chain" so that upgrades are safe and from trusted sources but that's not the market this device serves. Your internet Modem is a great example - unless you expect that updates will be delivered in physical form like a ...

posted by ChuckInMN on Apr 13 at 10:48am

 
 
Parsing Google v. Oracle: What’s It Really Mean?
This sounds like a big win for open source. Anyone can take any interface copy it word for word. How will Google feel when someone open sources all of it's APIs? Are they going to get behind a "Free Android" version? Maybe all the phone companies will get together and ...

posted by Beercandyman on Apr 12 at 6:38pm

 
 
Parsing Google v. Oracle: What’s It Really Mean?
As a guy who teaches and gives away his work (code, circuits etc.) for free for anyone to use and copy, I can understand why copying the structure of an API would be fair use, but I can't find any logic in saying that copying the actual implementation of said ...

posted by rebound11 on Apr 12 at 9:19am

 
 
Parsing Google v. Oracle: What’s It Really Mean?
Hi Jim, really interesting article this. It gives a really valuable insight into the way the courts think about these issues. Interesting also the bit about deferring any ruling on copyright rules. Hmm. Thank you.

posted by RedBarnDesigner on Apr 12 at 8:06am

 
 
 
 
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