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Dropping the Ball and Casting Aspersions (Part Deux)

A few months ago, I posted a couple of columns -- Dropping the Ball and Casting Aspersions and Metrology Maketh the Man (and Woman, and Silicon Chip) – as part of which I posed the question: Who can say what discoveries and inventions would have been triggered had the wisdom of the ancients been accepted and employed?


Welcome to a World of Reconfigurable Intelligent Surfaces

Have you heard that the European Telecommunications Standards Institute (ETSI), which produces globally applicable standards for Information and Communications Technology (ICT), recently launched a new Industry Specification Group on Reconfigurable Intelligent Surfaces (ISG RIS)? There’s no need to hang your head in shame if this is new news to you. To be honest, I didn’t … Read More → "Welcome to a World of Reconfigurable Intelligent Surfaces"

When Reliability Analysis Meets Silicon Lifecycle Management

I’ve recently been chatting with folks from Synopsys and Concertio, and now my head is so full of “stuff” regarding things like hyper-convergent chip design, reliability analysis, real-time performance optimization, and silicon lifecycle management that I don’t know whether I’m coming or going. I’ve told this tale before (and I’ll doubtless tell it again), but … Read More → "When Reliability Analysis Meets Silicon Lifecycle Management"


Next-Gen Voice Interfaces for Smart Things and Loquacious Folks

I was just chatting with Mark Lippett, who is CEO at the British chip company XMOS. Mark was telling me that they recently announced the launch of their XVF3610 and XVF3615 voice processors. These little beauties will power the next generation of high-performance two-microphone voice interfaces for wireless speakers, TVs, set-top boxes, smart home appliances, … Read More → "Next-Gen Voice Interfaces for Smart Things and Loquacious Folks"




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