industry news
Subscribe Now

WiSig Networks, Sivers Semiconductors and Intel demonstrate 5G millimeter-wave backhaul technology at G20 Event

Representatives from G20 nations attending the G20 digital economy event in Hyderabad, India, expressed strong interest in the product, which combines Sivers millimeter-wave chip and antenna module solutions with WiSig Networks’ modem and software stack implemented on the Intel Agilex FPGA.

Representatives from G20 nations attending the Second Meeting of the G20 Digital Economy Working Group (DEWG) in Hyderabad visited IIT-Hyderabad, and experienced a demonstration of the WiSig-Sivers-Intel 5G standalone millimeter-wave integrated backhaul product, which was first demonstrated earlier this year at the Mobile World Congress in Barcelona. The demonstration drew an extremely positive response, particularly from African and Asian nations, with some nations already looking to start pilot projects to demonstrate the technology as an alternative to more costly deployments of optical fiber networks.

The technology will first be piloted in India. Any collaboration with other nations will be resolved at the government level, officials said.

I am excited about the positive interest shown by most of the G20 Digital Economy Working Group (DEWG) delegates. It emphasizes the importance of providing broadband services in rural areas as a means of enabling billions of people around the world to access information, education, tele-healthcare, entertainment, digital services, job and entrepreneurial opportunities, and to uplift their lives,” says Dr Kiran Kuchi, the Founder of WiSig Networks. “This highlights that providing broadband services in rural areas should not be solely a business viability issue, but rather a means of empowering people and preventing rural migration to cities. This also highlights the benefits of 5G millimeter wave backhaul technology, which I believe can help lower the cost of deploying and maintaining fiber in rural and difficult-to-access areas while still delivering high-quality broadband services.”

We are thrilled to be a part of this groundbreaking collaboration with WiSig Networks and Sivers Semiconductors, showcasing the potential of 5G millimeter-wave backhaul technology,” says Mike Fitton, Vice President of Network Business Division at Intel. “Leveraging Intel’s Agilex FPGA, we are able to provide the necessary processing power and flexibility to enable WiSig’s modem and software stack, supporting the deployment of cost-effective and high-performance broadband solutions.”

Last year when we started working with Intel and WiSig, we were very excited to see a new large potential for our solutions in India. This strong interest in other new emerging markets in Asia and Africa is a great rubber stamp that our joint technology is truly global”, says Anders Storm, Group CEO, Sivers Semiconductors.

Leave a Reply

featured blogs
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...
Apr 18, 2024
Analog Behavioral Modeling involves creating models that mimic a desired external circuit behavior at a block level rather than simply reproducing individual transistor characteristics. One of the significant benefits of using models is that they reduce the simulation time. V...
Apr 16, 2024
Learn what IR Drop is, explore the chip design tools and techniques involved in power network analysis, and see how it accelerates the IC design flow.The post Leveraging Early Power Network Analysis to Accelerate Chip Design appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured chalk talk

Industrial Internet of Things (IIoT)
Sponsored by Mouser Electronics and Eaton
In this episode of Chalk Talk, Amelia Dalton and Mohammad Mohiuddin from Eaton explore the components, communication protocols, and sensing solutions needed for today’s growing IIoT infrastructure. They take a closer look at how Eaton's circuit protection solutions, magnetics, capacitors and terminal blocks can help you ensure the success of your next industrial internet of things design.
Jun 14, 2023
35,112 views