industry news
Subscribe Now

STMicroelectronics achieves EMVCo certification for biometric-payment platform, cutting time-to-market for card issuers

ST’s complete certified technology platform combines embedded secure element and ultra-low-power general-purpose microcontroller for cost-effective and robust protection

Geneva, November 28, 2022 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has announced it has completed EMVCo[1] certification for its STPay-Topaz-Bio biometric payment card platform. Certification confirms the security of the platform and its interoperability with payment systems. Mastercard and Visa payment schemes certifications are expected by early 2023.

The achievement makes STPay-Topaz-Bio and the underlying secure hardware the first one-stop-shop EMVCo-certified platform to comprise a biometric secure element and secure operating system (OS). The market for biometric payment cards is forecasted to grow at over 200% CAGR through 2026.

Card issuers everywhere can now take advantage of our certified STPay platform to deliver new products to market quickly, protected by biometric authentication that is extremely robust as well as easy to use,” said Laurent Degauque, Marketing Director, Secure Microcontroller Division, STMicroelectronics. “The secure element IC that anchors this solution leverages our expertise in hardware security for computing and Internet-of-Things (IoT) applications and is built for contact and contactless transactions.”

ST’s ST31N600 secure element IC provides state-of-the-art defenses for card-payment applications and sensitive processes. These include the biometric template matching for cardholder authentication, which uses software libraries developed with Fingerprint Cards AB (Fingerprints™). The ST31N600 runs a secure OS and the latest Arm® SecurCore® architecture for secure microcontrollers. In addition, designers can introduce value-added card features by securely connecting various types of peripherals.

Co-packaged with ST’s STM32L443 ultra-low-power general-purpose microcontroller in a module compliant with EMV® specifications, STPay-Topaz-Bio delivers a cost-effective Biometric System-on-Card (BSoC) solution. The STM32L443 handles non-sensitive aspects including managing the card’s fingerprint sensor module and ensures seamless experiences for users. Also featuring energy harvesting for batteryless operation, STPay-Topaz-Bio meets EMV ISO 7816, ISO 14443, standards for contact and contactless cards. 

About STMicroelectronics

At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of the Internet of Things and connectivity. ST is committed to becoming carbon neutral by 2027. Further information can be found at www.st.com.

Leave a Reply

featured blogs
Apr 23, 2024
The automotive industry's transformation from a primarily mechanical domain to a highly technological one is remarkable. Once considered mere vehicles, cars are now advanced computers on wheels, embodying the shift from roaring engines to the quiet hum of processors due ...
Apr 22, 2024
Learn what gate-all-around (GAA) transistors are, explore the switch from fin field-effect transistors (FinFETs), and see the impact on SoC design & EDA tools.The post What You Need to Know About Gate-All-Around Designs appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured chalk talk

Addressing the Challenges of Low-Latency, High-Performance Wi-Fi
In this episode of Chalk Talk, Amelia Dalton, Andrew Hart from Infineon, and Andy Ross from Laird Connectivity examine the benefits of Wi-Fi 6 and 6E, why IIoT designs are perfectly suited for Wi-Fi 6 and 6E, and how Wi-Fi 6 and 6E will bring Wi-Fi connectivity to a broad range of new applications.
Nov 17, 2023
20,715 views