industry news
Subscribe Now

Registration Now Open for Integrate23 and Zuken Innovation World (ZIW)

Hall of Fame Speaker, Dan Thurmon, to Deliver Keynote Address

BLACKSBURG, VA and Westford, MA, USA, April 4, 2023 – Zuken Vitech and Zuken USA are proud to announce that registration is now open for their upcoming co-located events Integrate23 and Zuken Innovation World (ZIW). The conference will take place from June 5-8, 2023, in Scottsdale, Arizona, and will feature keynote speaker Dan Thurmon. The agenda includes more than 90 classes covering model-based systems engineering, electrical and electronic design, and the latest innovations in digital engineering. Additionally, the combined events offer new experiences, such as a systems architecture and modeling competition and an E3.series software professional certification 

Dan Thurmon is a renowned motivational speaker and coach who has helped organizations move confidently through change and transformation. He has delivered thousands of presentations across six continents for audiences – including world leaders, Fortune 500 companies, entrepreneurs, educators, and even troops on the frontlines of battle in Iraq and Afghanistan. He is known for his ability to inspire and motivate audiences with his engaging and humorous style. Thurmon will deliver the keynote address on June 6, ensuring an engaging and energetic start to the event.  

“We are thrilled to be hosting this event and are looking forward to a great turnout,” said Bob Potock, Vice President of Marketing for Zuken USA. “With such an impressive lineup of speakers and events, we are confident this conference will be a valuable experience for everyone who attends.” 

The conference will also feature a systems architecture and modeling competition open to students and professionals alike. This competition provides a unique opportunity for individuals and teams of up to three to exhibit their skills and creativity in designing and constructing a systems solution for a real-world problem. 

Registration and exhibit sales are now open. $399 Early Bird pricing is available for a limited time. Attendees must register before April 21 to take advantage of this special offer. 

For more information about the conference and to register, visit https://www.integrate23.com

Leave a Reply

featured blogs
Sep 21, 2023
Wireless communication in workplace wearables protects and boosts the occupational safety and productivity of industrial workers and front-line teams....
Sep 26, 2023
5G coverage from space has the potential to make connectivity to the Internet truly ubiquitous for a broad range of use cases....
Sep 26, 2023
Explore the LPDDR5X specification and learn how to leverage speed and efficiency improvements over LPDDR5 for ADAS, smartphones, AI accelerators, and beyond.The post How LPDDR5X Delivers the Speed Your Designs Need appeared first on Chip Design....
Sep 26, 2023
The eighth edition of the Women in CFD series features Mary Alarcon Herrera , a product engineer for the Cadence Computational Fluid Dynamics (CFD) team. Mary's unwavering passion and dedication toward a career in CFD has been instrumental in her success and has led her ...
Sep 21, 2023
Not knowing all the stuff I don't know didn't come easy. I've had to read a lot of books to get where I am....

featured video

TDK PowerHap Piezo Actuators for Ideal Haptic Feedback

Sponsored by TDK

The PowerHap product line features high acceleration and large forces in a very compact design, coupled with a short response time. TDK’s piezo actuators also offers good sensing functionality by using the inverse piezo effect. Typical applications for the include automotive displays, smartphones and tablet.

Click here for more information about PowerHap Piezo Actuators

featured paper

Intel's Chiplet Leadership Delivers Industry-Leading Capabilities at an Accelerated Pace

Sponsored by Intel

We're proud of our long history of rapid innovation in #FPGA development. With the help of Intel's Embedded Multi-Die Interconnect Bridge (EMIB), we’ve been able to advance our FPGAs at breakneck speed. In this blog, Intel’s Deepali Trehan charts the incredible history of our chiplet technology advancement from 2011 to today, and the many advantages of Intel's programmable logic devices, including the flexibility to combine a variety of IP from different process nodes and foundries, quicker time-to-market for new technologies and the ability to build higher-capacity semiconductors

To learn more about chiplet architecture in Intel FPGA devices visit: https://intel.ly/47JKL5h

featured chalk talk

Introduction to Bare Metal AVR Programming
Sponsored by Mouser Electronics and Microchip
Bare metal AVR programming is a great way to write code that is compact, efficient, and easy to maintain. In this episode of Chalk Talk, Ross Satchell from Microchip and I dig into the details of bare metal AVR programming. They take a closer look at the steps involved in this kind of programming, how bare metal compares with other embedded programming options and how you can get started using bare metal AVR programming in your next design.
Jan 25, 2023
30,377 views